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Vishay Siliconix SIHB6N65E-GE3

Part No.:
SIHB6N65E-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSIHB6N65E-GE3.pdf
Description:
MOSFET N-CH 650V 7A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,309

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Product details

Overview

SIHB6N65E-GE3 from Vishay Siliconix is a 650 V, 7 A N-channel enhancement-mode power MOSFET in D2PAK (TO-263) package, featuring RDS(on) = 0.6 Ω at VGS = 10 V, Qg = 48 nC, and avalanche-rated EAS = 56 mJ. It delivers low conduction and switching losses for high-efficiency SMPS and PFC stages in telecom and server power supplies.

For engineers reviewing the SIHB6N65E-GE3 datasheet, SIHB6N65E-GE3 pinout, SIHB6N65E-GE3 application, or SIHB6N65E-GE3 equivalent, key selection criteria include its 650 V VDS, 0.6 Ω RDS(on), 48 nC total gate charge, 1.6 °C/W RthJC, and UIS-rated ruggedness - critical for hard-switched industrial and renewable energy inverters.

Technical Context

This MOSFET employs planar high-voltage silicon technology optimized for fast switching with controlled dV/dt (37 V/ns at TJ = 125 °C) and low Ciss (820 pF). Its body diode exhibits trr = 237 ns and Qrr = 2.2 μC at IF = 3 A, supporting quasi-resonant and ZVS topologies.

The device operates across -55 to +150 °C junction temperature range, with VGS(th) = 2–4 V and ΔVDS/TJ = 0.73 V/°C, enabling stable gate drive design under thermal stress. Its 78 W PD rating at TC = 25 °C supports high-power density layouts when mounted on thermally optimized PCBs.

Key Specifications

ParameterValue and Actual Design Meaning
VDS650 V - Withstands DC bus voltages up to 520 V in PFC and 400 V in LLC resonant converters without derating.
RDS(on) max0.6 Ω at VGS = 10 V - Enables <1.8 W conduction loss at 3 A continuous drain current in 100 kHz SMPS designs.
Qg48 nC - Reduces gate driver power demand and enables use of low-cost 1-A peak drivers in isolated flyback controllers.
EAS56 mJ - Supports unclamped inductive switching in motor drives and welding inverters without external snubbers.
RthJC1.6 °C/W - Allows direct heatsink mounting for thermal management in compact 1U server PSUs with ≤ 70 °C case temperature rise.
Ciss820 pF - Minimizes Miller-induced shoot-through risk in half-bridge configurations operating above 200 kHz.
tr/tf12–24 ns / 20–40 ns - Enables clean edge control in high-frequency synchronous rectification and digital PWM systems.

Pinout & Package

D2PAK (TO-263) package with exposed drain pad for thermal and electrical connection. Standard 3-pin configuration: Gate (G), Drain (D), Source (S). Drain tab is electrically connected to the internal MOSFET drain and serves as primary heat path.

Pin/TerminalCircuit RoleDesign Meaning
GGate control inputAccepts 0–10 V logic-level drive; requires ≥10 V for full RDS(on) specification; gate leakage ≤100 nA at ±20 V.
DDrain terminal / thermal padHigh-side switch node connection; electrically tied to exposed copper tab; must be soldered to large copper pour for thermal performance.
SSource reference / return pathCommon source node for gate drive return and current sensing; connects to low-side shunt or controller ground plane.

Key Features

FeatureDesign Value
Low FOM (RDS(on) × Qg)28.8 Ω·nC - Balances switching speed and conduction loss for optimal efficiency in 65–300 kHz PFC boost stages.
Avalanche energy rated (UIS)56 mJ single-pulse - Eliminates need for external clamping in inductive load switching and fault-tolerant solar MPPT circuits.
Ultra-low Qgd/Qg ratio11/48 ≈ 23 % - Reduces Miller plateau duration, improving controllability during hard switching and minimizing cross-conduction risk.
Body diode trr & Qrr237 ns / 2.2 μC - Enables reliable freewheeling in bridge-leg configurations without requiring external Schottky catch diodes.
High dV/dt immunity37 V/ns at 125 °C - Maintains gate integrity during fast voltage transients in high-noise industrial motor drive environments.

Applications

Server Power SupplyTelecom Rectifier

Use Scenario: Primary-side switching in 1–3 kW 80 PLUS Titanium AC-DC front-end with active PFC and LLC resonant conversion.

IC Role / Device Role / Timing Role: High-voltage N-channel switch in boost PFC stage and LLC half-bridge primary leg.

Use Value: 0.6 Ω RDS(on) and 48 nC Qg enable >96 % system efficiency at full load while maintaining thermal margin on 2-oz copper PCBs.

Use Scenario: 48 V/54 V distributed power architecture rectifier with hold-up capacitor and hot-swap capability.

IC Role / Device Role / Timing Role: Synchronous rectifier and OR-ing FET in redundant 48 V input stage.

Use Value: Avalanche rating and 1.3 V VSD support robust reverse-current blocking and fault recovery during input hot-plug events.

Solar PV InverterIndustrial Motor Drive

Use Scenario: DC-link switching in string inverters with 600–1000 V DC input and transformerless topology.

IC Role / Device Role / Timing Role: High-side switch in three-phase inverter bridge driving permanent magnet synchronous motors.

Use Value: 650 V VDS and 56 mJ EAS ensure safe operation during grid fault conditions and rapid DC-link voltage transients.

Use Scenario: Inverter output stage in 0.75–2.2 kW variable frequency drives for HVAC and pump control.

IC Role / Device Role / Timing Role: Low-loss switching element in IGBT gate-drive auxiliary supply and regenerative braking chopper.

Use Value: 7 A continuous ID and 1.6 °C/W RthJC allow direct heatsink mounting without forced air, reducing system BOM cost and footprint.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP6NK60ZFP600 V VDS, 0.75 Ω RDS(on), 35 nC Qg, TO-220FP packageLower voltage rating and higher RDS(on); limited to ≤400 V DC-link applicationsPreferred where lower gate charge reduces driver complexity but 650 V margin is not required.
IXTH6N65X2650 V VDS, 0.55 Ω RDS(on), 32 nC Qg, TO-247 packageLower RDS(on) and Qg, but larger TO-247 footprint and higher costSelected when maximum efficiency is prioritized over board space and cost in high-volume industrial inverters.

Compared with STP6NK60ZFP and IXTH6N65X2, SIHB6N65E-GE3 offers balanced trade-offs: sufficient 650 V rating for universal input PFC, D2PAK thermal performance superior to TO-220FP, and lower system cost than TO-247 alternatives - ideal for space-constrained, high-reliability telecom and server power modules.

Availability

SIHB6N65E-GE3 is available at Aetrix Electronics and suitable for server and telecom power supplies, solar PV inverters, and industrial motor drives requiring stable component supply and long-term manufacturing continuity.

Supply support for SIHB6N65E-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, ruggedness, and thermal efficiency.

The E Series Power MOSFETs, including SIHB6N65E-GE3, are engineered for high-voltage, high-efficiency switching in demanding power conversion applications such as telecom rectifiers, server PSUs, and renewable energy inverters.

FAQ

What is the maximum continuous drain current rating for SIHB6N65E-GE3 at 100 °C case temperature?

The SIHB6N65E-GE3 has a continuous drain current rating of 5 A at TC = 100 °C, per its Absolute Maximum Ratings table. This reflects thermal derating from the 7 A rating at TC = 25 °C, based on its 0.63 W/°C linear derating factor. Designers must verify PCB copper area and heatsinking to sustain this current in real-world thermal environments.

Does SIHB6N65E-GE3 support logic-level gate drive?

No, SIHB6N65E-GE3 is not a logic-level MOSFET. Its gate threshold voltage VGS(th) is specified from 2 V to 4 V, but full enhancement requires VGS = 10 V to achieve the rated RDS(on) of 0.6 Ω. Driving SIHB6N65E-GE3 with only 5 V may result in significantly higher on-resistance and excessive conduction loss - a dedicated 10 V gate driver is recommended.

What is the significance of the "-GE3" suffix in SIHB6N65E-GE3?

The "-GE3" suffix indicates that SIHB6N65E-GE3 is a lead (Pb)-free and halogen-free version in tape-and-reel packaging, compliant with Vishay's green initiative and RoHS Directive 2011/65/EU. It uses matte tin plating and meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1), allowing unlimited floor life at ≤30 °C/60 % RH.

Can SIHB6N65E-GE3 be used in avalanche mode repeatedly?

SIHB6N65E-GE3 is rated for single-pulse avalanche energy (EAS) of 56 mJ, but repetitive avalanche operation is not characterized or guaranteed. The datasheet specifies only "repetitive rating" for continuous parameters like ID and PD. For circuits subject to frequent inductive turn-off stress, designers should implement external clamping or select devices explicitly rated for repetitive UIS.

How does the body diode performance of SIHB6N65E-GE3 compare to discrete ultrafast diodes?

The SIHB6N65E-GE3 body diode has trr = 237 ns and Qrr = 2.2 μC at IF = 3 A, making it suitable for moderate-frequency freewheeling but not a replacement for dedicated ultrafast diodes (typically <50 ns trr). Its VSD = 1.3 V at 3 A is higher than Schottky diodes, so synchronous rectification or external diode co-location is advised in high-efficiency designs.

SIHB6N65E-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
7A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
600mOhm @ 3A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
48 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
820 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
78W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

SIHB6N65E-GE3 FAQ

1.How can I place an order for SIHB6N65E-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHB6N65E-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHB6N65E-GE3 reliable?

The price and inventory of SIHB6N65E-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHB6N65E-GE3 is usually 5 days.

3.What payment methods are accepted for SIHB6N65E-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHB6N65E-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHB6N65E-GE3?

SIHB6N65E-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHB6N65E-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHB6N65E-GE3?

For technical support, including SIHB6N65E-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHB6N65E-GE3 requirements.

6.How does Aetrix verify that SIHB6N65E-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHB6N65E-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHB6N65E-GE3 meets industry standards.

7.What is the process for return or replacement of SIHB6N65E-GE3?

All SIHB6N65E-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHB6N65E-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHB6N65E-GE3 part is unused and in its original packaging.

Return procedure for SIHB6N65E-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHB6N65E-GE3 Tags

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