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Vishay Siliconix SIHFS11N50A-GE3

Part No.:
SIHFS11N50A-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSIHFS11N50A-GE3.pdf
Description:
MOSFET N-CH 500V 11A TO263
Quantity:
Payment:
Payment
Shipping:
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Inventory:9,876

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Product details

Overview

SIHFS11N50A-GE3 from Vishay Siliconix is a 500 V, 11 A N-channel power MOSFET in D2PAK (TO-263) package, with RDS(on) = 0.52 Ω at VGS = 10 V, Qg = 52 nC, and rated for repetitive avalanche energy of 17 mJ - designed for high-voltage switching in SMPS half-bridge and PFC boost stages.

For engineers reviewing the SIHFS11N50A-GE3 datasheet, SIHFS11N50A-GE3 pinout, SIHFS11N50A-GE3 application, or SIHFS11N50A-GE3 equivalent, key selection criteria include its 500 V VDS, low gate charge enabling simple gate drive, robust dV/dt ruggedness (6.9 V/ns), and fully characterized Coss and body diode recovery (trr = 510–770 ns).

Technical Context

This device employs planar vertical DMOS technology optimized for high-voltage hard-switching applications. Its gate structure delivers low Qg/Qgd ratio (52 nC / 18 nC) and controlled dV/dt immunity, while the integral body diode supports synchronous rectification and unclamped inductive switching with validated EAS = 275 mJ.

The thermal design leverages a low RthJC of 0.75 °C/W and a copper-exposed drain pad in D2PAK for efficient heat transfer to heatsinks. Dynamic parameters - including Ciss = 1423 pF, Coss(eff) = 97 pF, and td(on)/tf = 14 ns/28 ns - are fully characterized across temperature and operating conditions per Vishay S13-1927-Rev. E.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 500 V - supports primary-side switching in 400 V DC bus PFC and offline SMPS topologies without derating.
RDS(on) 0.52 Ω @ VGS = 10 V - enables <1.2 W conduction loss at 11 A continuous drain current (TC = 25 °C).
Qg 52 nC - determines gate driver power requirement; compatible with standard 1-A peak drivers for ≤500 kHz operation.
EAS 275 mJ - specifies single-pulse avalanche capability under unclamped inductive load (L = 4.5 mH, IAS = 11 A).
trr 510–770 ns - defines body diode reverse recovery window; critical for ZVS/ZCS design and EMI control in bridge circuits.
RthJC 0.75 °C/W - sets junction-to-heatsink thermal resistance baseline; enables 170 W dissipation at TC = 25 °C.
VSD 1.5 V @ IS = 11 A - forward voltage of integrated body diode; impacts conduction loss during freewheeling in half-bridge configurations.

Pinout & Package

D2PAK (TO-263) package with exposed drain pad on underside for thermal and electrical connection; 3-pin surface-mount outline conforming to JEDEC TO-263AB standard (Document 73397). Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.

Pin/Terminal Circuit Role Design Meaning
Gate (G) Control terminal Receives 10 V logic-level drive; threshold VGS(th) = 2.0–4.0 V ensures reliable turn-on with standard PWM controllers.
Drain (D) High-side power node Connected to exposed copper tab - must be soldered to PCB copper pour or heatsink; carries full switched voltage (≤500 V).
Source (S) Reference and return path Common node for gate drive reference and current sensing; ties to power ground or low-side switch source in half/full-bridge layouts.

Key Features

Feature Design Value
Low Qg (52 nC) Reduces gate drive power and simplifies driver selection - no need for high-current gate buffers in 100–300 kHz SMPS designs.
Fully characterized Coss and Coss(eff) Enables accurate snubber design and soft-switching analysis - Coss(eff) = 97 pF reflects actual energy storage during VDS rise from 0 to 400 V.
Validated dV/dt ruggedness (6.9 V/ns) Prevents false turn-on during high-speed switching transients - critical for reliability in high-frequency bridge converters.
Repetitive avalanche rated (IAR = 11 A, EAR = 17 mJ) Supports operation in inductive fault conditions without immediate failure - allows use in non-clamped topologies like two-transistor forward.
RoHS-compliant, halogen-free (GE3 suffix) Meets IPC-1752A material declaration requirements and EU Directive 2015/863 for restricted substances.

Applications

Server PSU Primary Switch PFC Boost Switch

Use Scenario: High-efficiency 80 PLUS Titanium server power supply operating at 300–500 kHz with 380–400 V DC bus.

IC Role / Device Role / Timing Role: High-side switch in interleaved dual-phase boost PFC stage, handling 11 A RMS input current.

Use Value: Low RDS(on) minimizes conduction loss; low Qg and fast tf reduce switching loss and EMI generation at high frequency.

Use Scenario: Active PFC front-end in industrial AC-DC power module delivering 3 kW output.

IC Role / Device Role / Timing Role: Main switching element in continuous conduction mode (CCM) boost converter, switching at 65–100 kHz.

Use Value: 500 V rating accommodates 400 V bus with margin; validated avalanche capability handles line surges and startup transients.

UPS Inverter Half-Bridge Industrial Motor Drive Output Stage

Use Scenario: Online double-conversion UPS with 48 V DC input and 230 V AC output, using full-bridge inverter stage.

IC Role / Device Role / Timing Role: Upper-leg switch in half-bridge leg, commutating 11 A peak load current with body diode freewheeling.

Use Value: Tight trr and Qrr specs (510–770 ns, 3.4–5.1 μC) minimize shoot-through risk and recovery loss during dead-time transitions.

Use Scenario: 3-phase inverter for HVAC compressor drive operating from 320–450 V DC link.

IC Role / Device Role / Timing Role: Output phase-leg switch handling 11 A continuous motor current with repetitive inductive switching.

Use Value: RthJC = 0.75 °C/W enables direct heatsink mounting; robust dV/dt immunity prevents spurious turn-on from motor cable ringing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP12NK50ZFP 500 V, 12 A, RDS(on) = 0.52 Ω, but Qg = 45 nC and trr = 120 ns - lower gate charge but significantly faster diode recovery. Better suited for ZVS resonant converters where fast diode recovery reduces circulating current loss. Prefer STP12NK50ZFP when minimizing Qrr and optimizing for resonant topologies; SIHFS11N50A-GE3 remains preferred for hard-switched PFC due to higher EAS.
IXFH12N50P 500 V, 12 A, RDS(on) = 0.45 Ω, Qg = 65 nC - lower on-resistance but higher gate charge and no published EAS rating. Lacks specified avalanche capability; requires external clamping in inductive fault scenarios. Select IXFH12N50P only in thermally constrained designs where RDS(on) reduction outweighs gate drive complexity and missing avalanche validation.

Compared with STP12NK50ZFP and IXFH12N50P, the SIHFS11N50A-GE3 offers balanced trade-offs: verified 275 mJ single-pulse avalanche, industry-standard D2PAK thermal performance, and fully characterized dynamic parameters - making it a robust choice for industrial SMPS and UPS where reliability under transient stress is critical.

Availability

SIHFS11N50A-GE3 is available at Aetrix Electronics and suitable for switch-mode power supplies, uninterruptible power systems, and high-speed power switching applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for SIHFS11N50A-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on high-reliability, high-voltage, and thermally optimized devices.

The SIHFS11N50A-GE3 belongs to Vishay's high-voltage power MOSFET product line, engineered for efficiency-critical 400–500 V DC bus applications in enterprise power, industrial automation, and renewable energy infrastructure.

FAQ

What is the maximum continuous drain current rating for SIHFS11N50A-GE3 at 100 °C case temperature?

The SIHFS11N50A-GE3 has a continuous drain current rating of 7.0 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the D2PAK package and ensures safe operation within its 0.75 °C/W RthJC constraint. At TC = 25 °C, the rating is 11 A. Designers must verify heatsink sizing using actual ambient and airflow conditions to maintain TC ≤ 100 °C for sustained 7 A loads.

Does SIHFS11N50A-GE3 support logic-level gate drive?

No, SIHFS11N50A-GE3 is not a logic-level MOSFET. Its gate threshold voltage VGS(th) ranges from 2.0 V to 4.0 V, and it is characterized for full enhancement at VGS = 10 V - requiring a dedicated 10 V gate driver. It does not guarantee reliable turn-on at 3.3 V or 5 V logic levels. For logic-level alternatives, consider Vishay's SiHF3202 or similar 5 V-rated parts, but note that those lack the 500 V rating of SIHFS11N50A-GE3.

What is the significance of the "-GE3" suffix in SIHFS11N50A-GE3?

"-GE3" denotes a lead (Pb)-free and halogen-free version compliant with RoHS Directive 2015/863 and Vishay's material categorization standard (Doc. 99912). It confirms the device uses matte tin-plated leads, green molding compound, and conforms to JEDEC J-STD-020 moisture sensitivity level (MSL) 1. The GE3 variant replaces legacy Pb-bearing versions like IRFS11N50APbF and is qualified for reflow soldering up to 260 °C peak temperature.

How is the effective output capacitance (Coss eff.) of SIHFS11N50A-GE3 defined and why does it matter?

Coss eff. = 97 pF for SIHFS11N50A-GE3 is a fixed capacitance value calibrated to replicate the actual time required to charge Coss as VDS rises from 0 % to 80 % of 400 V - unlike typical Coss measured at fixed bias. This parameter directly impacts zero-voltage switching (ZVS) design, snubber sizing, and turn-off energy loss (Eoff ∝ Coss eff. × VDS²). It is more accurate than static Coss (208 pF at VDS = 25 V) for high-voltage switching analysis.

Can SIHFS11N50A-GE3 be used in synchronous rectification configurations?

SIHFS11N50A-GE3 is not recommended for synchronous rectification due to its relatively high body diode forward voltage (VSD = 1.5 V at 11 A) and slow reverse recovery (trr = 510–770 ns). These characteristics increase conduction and recovery losses compared to purpose-built SR MOSFETs with low VSD (<0.8 V) and ultrafast trr (<100 ns). For secondary-side synchronous rectification, use dedicated SR controllers paired with low-Vth, low-Qrr MOSFETs instead of SIHFS11N50A-GE3.

SIHFS11N50A-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
500 V
Current - Continuous Drain (Id) @ 25°C:
11A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
520mOhm @ 6.6A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
52 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
1423 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
170W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

SIHFS11N50A-GE3 FAQ

1.How can I place an order for SIHFS11N50A-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHFS11N50A-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHFS11N50A-GE3 reliable?

The price and inventory of SIHFS11N50A-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHFS11N50A-GE3 is usually 5 days.

3.What payment methods are accepted for SIHFS11N50A-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHFS11N50A-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHFS11N50A-GE3?

SIHFS11N50A-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHFS11N50A-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHFS11N50A-GE3?

For technical support, including SIHFS11N50A-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHFS11N50A-GE3 requirements.

6.How does Aetrix verify that SIHFS11N50A-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHFS11N50A-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHFS11N50A-GE3 meets industry standards.

7.What is the process for return or replacement of SIHFS11N50A-GE3?

All SIHFS11N50A-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHFS11N50A-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHFS11N50A-GE3 part is unused and in its original packaging.

Return procedure for SIHFS11N50A-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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