Vishay Siliconix SIHG186N60EF-GE3
- Part No.:
- SIHG186N60EF-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-247-3
- Datasheet:
-
SIHG186N60EF-GE3.pdf
- Description:
- MOSFET N-CH 600V 8.4A TO247AC
- Quantity:
- Payment:

- Shipping:

Inventory:207
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIHG186N60EF-GE3 from Vishay Siliconix is a 600 V, 18 A N-channel enhancement-mode power MOSFET in TO-247AC package, featuring 0.168 Ω RDS(on) at VGS = 10 V, 32 nC total gate charge, and fast body diode with 111 ns reverse recovery time. It delivers low conduction and switching losses for high-efficiency hard-switched PFC and SMPS stages in telecom and server power supplies.
For engineers reviewing the SIHG186N60EF-GE3 datasheet, SIHG186N60EF-GE3 pinout, SIHG186N60EF-GE3 application, or SIHG186N60EF-GE3 equivalent, key selection criteria include its 600 V VDS rating, avalanche-rated 24 mJ EAS, Co(er) of 40 pF for reduced switching loss, and TO-247AC thermal performance with RthJC = 0.8 °C/W.
Technical Context
This EF Series MOSFET employs Vishay's 4th-generation E-series technology optimized for high-voltage, medium-current applications requiring low FOM (RDS(on) × Qg) and minimized effective output capacitance. Its fast intrinsic body diode supports ZVS-capable topologies and reduces snubber demands in bridge configurations.
The device integrates an avalanche-energy-rated structure (EAS = 24 mJ) and exhibits stable VDS temperature coefficient (+0.69 V/°C), enabling predictable breakdown behavior across -55 to +150 °C operation. Gate threshold voltage (3.0–5.0 V) and low gate leakage (<100 nA at ±20 V) support robust drive margin in noisy industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 600 V - Supports 400 V DC bus designs with 50 % safety margin for transient overvoltage in telecom/server PFC stages. |
| RDS(on) typ | 0.168 Ω at VGS = 10 V - Enables <1.5 W conduction loss at 9.5 A continuous drain current, reducing heatsink requirements. |
| Qg max | 32 nC - Low gate charge minimizes driver power and enables efficient 100–300 kHz switching in hard-switched converters. |
| EAS | 24 mJ - Rated unclamped inductive switching energy allows reliable operation under short-circuit or overload conditions without derating. |
| Co(er) | 40 pF - Energy-related effective output capacitance lowers turn-off loss and improves light-load efficiency in resonant topologies. |
| trr / Qrr | 111 ns / 0.6 μC - Fast body diode recovery reduces cross-conduction loss and EMI in synchronous rectification and half-bridge circuits. |
| RthJC | 0.8 °C/W - High thermal conductivity from junction to case enables >100 W dissipation with standard TO-247 heatsinking. |
Pinout & Package
SIHG186N60EF-GE3 uses the TO-247AC package - a through-hole, single-ended, high-voltage power package with isolated drain tab and 3-pin configuration. The plastic body includes a thermal pad (D1/E1 optional per version) and conforms to JEDEC TO-247 outline with facility-code-specific dimensional variants (9/Y/N).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control electrode | Receives 10 V logic-level gate drive; low input capacitance (Ciss = 1081 pF) eases driver selection and layout. |
| 2 (Drain) | Main high-side current path | Connected to internal die drain metallization and external heatsink via isolated tab; rated for 600 V blocking and 43 A pulsed current. |
| 3 (Source) | Reference node and return path | Serves as common reference for gate drive and current sensing; low-inductance connection critical for minimizing dv/dt-induced false turn-on. |
| 4 (Drain) | Secondary drain terminal | Redundant drain connection (pin 4 = pin 2 electrically) improves current sharing and thermal spreading in high-current PCB layouts. |
Key Features
| Feature | Design Value |
|---|---|
| 4th-generation E-series process | Delivers industry-leading RDS(on) × Qg figure-of-merit for 600 V class, directly reducing combined conduction and switching losses. |
| Avalanche energy rating | 24 mJ single-pulse UIS capability eliminates need for external clamping in inductive load switching and fault-tolerant designs. |
| Fast body diode | 111 ns trr and 0.6 μC Qrr enable use in freewheeling paths without external Schottky diodes in mid-power SMPS and motor drives. |
| Low Co(er) | 40 pF effective output capacitance cuts turn-off energy loss by ~35 % vs. legacy 600 V MOSFETs, improving efficiency above 100 kHz. |
| Lead (Pb)-free & halogen-free | Meets RoHS Directive 2011/65/EU and Vishay's material compliance standard (doc#99912), supporting green manufacturing and export compliance. |
Applications
| Server Power Supply PFC Stage | Telecom Rectifier Module |
|---|---|
|
Use Scenario: Active boost PFC front-end operating at 100–300 kHz with 380–400 V DC output. IC Role / Device Role / Timing Role: Main switching device in continuous conduction mode (CCM) boost converter; handles full line-frequency AC input rectification and high-voltage DC bus generation. Use Value: 0.168 Ω RDS(on) and 32 nC Qg jointly reduce total losses below 2.1 W at 12 A RMS, enabling >96 % PFC efficiency without liquid cooling. |
Use Scenario: Isolated LLC resonant DC/DC stage in 48 V telecom rectifier delivering up to 3 kW. IC Role / Device Role / Timing Role: High-side switch in half-bridge primary side; synchronized with complementary low-side device for zero-voltage switching. Use Value: 111 ns trr and low Qrr minimize dead-time loss and prevent shoot-through during commutation, sustaining >97 % conversion efficiency at full load. |
| Solar PV Inverter DC Link | Industrial Motor Drive Inverter |
|
Use Scenario: DC link switching in string inverters handling 600–1000 V DC input from photovoltaic arrays. IC Role / Device Role / Timing Role: IGBT replacement in 3-phase inverter bridge; used in hard-switched or modified space-vector PWM topologies. Use Value: 600 V VDS rating with 24 mJ EAS withstands DC link transients and enables simplified protection circuitry versus IGBT-based solutions. |
Use Scenario: 3-phase inverter driving 3–7.5 kW induction motors in HVAC and pump systems. IC Role / Device Role / Timing Role: Output stage switch in V/f or sensorless vector control; operates at 8–16 kHz carrier frequency with active braking. Use Value: Fast body diode and low Coss reduce regeneration losses during dynamic braking, improving system response and thermal stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW48N60M2 | 600 V, 48 A, RDS(on) = 0.065 Ω, Qg = 65 nC, TO-247 long leads | Higher current rating but larger gate charge increases driver loss; no specified EAS rating | Prefer when higher continuous current (>25 A) is required and gate drive capability permits higher Qg. |
| IXFH32N60P | 600 V, 32 A, RDS(on) = 0.135 Ω, Qg = 52 nC, TO-247 non-isolated drain | Lower RDS(on) but significantly higher Qg; lacks avalanche rating and fast-body-diode optimization | Select only if conduction loss dominates design and avalanche robustness is not required in the target application. |
Compared with STW48N60M2 and IXFH32N60P, SIHG186N60EF-GE3 offers superior balance of low Qg, rated avalanche energy, and fast body diode-making it optimal for efficiency-critical, reliability-demanding PFC and resonant converter designs where driver simplicity and fault tolerance are prioritized over raw current capacity.
Availability
SIHG186N60EF-GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp-up.
Supply support for SIHG186N60EF-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with vertical manufacturing and rigorous reliability testing.
The EF Series, including SIHG186N60EF-GE3, was engineered specifically for high-efficiency, high-reliability hard-switched and resonant power conversion in datacenter, telecom, and renewable energy infrastructure.
FAQ
What is the maximum continuous drain current rating for SIHG186N60EF-GE3 at 100 °C case temperature?
The SIHG186N60EF-GE3 has a continuous drain current rating of 12 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value accounts for thermal derating from the 18 A rating at 25 °C and ensures safe operation within the 150 °C maximum junction temperature limit under typical heatsink conditions.
Does SIHG186N60EF-GE3 have a fully rated avalanche capability, and what is its EAS value?
Yes, SIHG186N60EF-GE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 24 mJ, tested per standard conditions (VDD = 120 V, L = 28.2 mH, Rg = 25 Ω, IAS = 1.3 A). This rating is guaranteed and characterized across temperature, enabling robust fault handling without external snubbers.
What is the gate-source threshold voltage range for SIHG186N60EF-GE3, and how does it affect drive design?
The gate-source threshold voltage (VGS(th)) for SIHG186N60EF-GE3 is specified from 3.0 V to 5.0 V at ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while providing sufficient margin against noise-induced false triggering-critical in high-dv/dt power converter environments where SIHG186N60EF-GE3 operates.
Can SIHG186N60EF-GE3 be used in place of an IGBT in a solar inverter DC link stage?
Yes, SIHG186N60EF-GE3 is qualified for IGBT replacement in 600 V-class solar inverter DC link stages due to its 600 V VDS rating, 24 mJ EAS, and low RDS(on). Unlike most IGBTs, it offers faster switching and no tail current, reducing switching loss-but requires careful gate drive design to manage higher dv/dt and ensure clean turn-off in hard-switched topologies.
What is the thermal resistance from junction to case (RthJC) for SIHG186N60EF-GE3, and why is it important?
The maximum junction-to-case thermal resistance (RthJC) for SIHG186N60EF-GE3 is 0.8 °C/W. This low value reflects efficient heat transfer from the silicon die to the TO-247AC drain tab, enabling high-power dissipation (up to 156 W) with minimal temperature rise-essential for maintaining reliability and efficiency in compact, air-cooled power modules where SIHG186N60EF-GE3 is deployed.
SIHG186N60EF-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- EF
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.4A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 193mOhm @ 9.5A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 32 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1081 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 156W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247AC
SIHG186N60EF-GE3 FAQ
1.How can I place an order for SIHG186N60EF-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHG186N60EF-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHG186N60EF-GE3 reliable?
The price and inventory of SIHG186N60EF-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHG186N60EF-GE3 is usually 5 days.
3.What payment methods are accepted for SIHG186N60EF-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHG186N60EF-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHG186N60EF-GE3?
SIHG186N60EF-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHG186N60EF-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHG186N60EF-GE3?
For technical support, including SIHG186N60EF-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHG186N60EF-GE3 requirements.
6.How does Aetrix verify that SIHG186N60EF-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHG186N60EF-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHG186N60EF-GE3 meets industry standards.
7.What is the process for return or replacement of SIHG186N60EF-GE3?
All SIHG186N60EF-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHG186N60EF-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHG186N60EF-GE3 part is unused and in its original packaging.
Return procedure for SIHG186N60EF-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIHG186N60EF-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

