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Vishay Siliconix SIHG186N60EF-GE3

Part No.:
SIHG186N60EF-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-247-3
Datasheet:
AetrixSIHG186N60EF-GE3.pdf
Description:
MOSFET N-CH 600V 8.4A TO247AC
Quantity:
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Payment
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Inventory:207

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Product details

Overview

SIHG186N60EF-GE3 from Vishay Siliconix is a 600 V, 18 A N-channel enhancement-mode power MOSFET in TO-247AC package, featuring 0.168 Ω RDS(on) at VGS = 10 V, 32 nC total gate charge, and fast body diode with 111 ns reverse recovery time. It delivers low conduction and switching losses for high-efficiency hard-switched PFC and SMPS stages in telecom and server power supplies.

For engineers reviewing the SIHG186N60EF-GE3 datasheet, SIHG186N60EF-GE3 pinout, SIHG186N60EF-GE3 application, or SIHG186N60EF-GE3 equivalent, key selection criteria include its 600 V VDS rating, avalanche-rated 24 mJ EAS, Co(er) of 40 pF for reduced switching loss, and TO-247AC thermal performance with RthJC = 0.8 °C/W.

Technical Context

This EF Series MOSFET employs Vishay's 4th-generation E-series technology optimized for high-voltage, medium-current applications requiring low FOM (RDS(on) × Qg) and minimized effective output capacitance. Its fast intrinsic body diode supports ZVS-capable topologies and reduces snubber demands in bridge configurations.

The device integrates an avalanche-energy-rated structure (EAS = 24 mJ) and exhibits stable VDS temperature coefficient (+0.69 V/°C), enabling predictable breakdown behavior across -55 to +150 °C operation. Gate threshold voltage (3.0–5.0 V) and low gate leakage (<100 nA at ±20 V) support robust drive margin in noisy industrial environments.

Key Specifications

Parameter Value and Actual Design Meaning
VDS max 600 V - Supports 400 V DC bus designs with 50 % safety margin for transient overvoltage in telecom/server PFC stages.
RDS(on) typ 0.168 Ω at VGS = 10 V - Enables <1.5 W conduction loss at 9.5 A continuous drain current, reducing heatsink requirements.
Qg max 32 nC - Low gate charge minimizes driver power and enables efficient 100–300 kHz switching in hard-switched converters.
EAS 24 mJ - Rated unclamped inductive switching energy allows reliable operation under short-circuit or overload conditions without derating.
Co(er) 40 pF - Energy-related effective output capacitance lowers turn-off loss and improves light-load efficiency in resonant topologies.
trr / Qrr 111 ns / 0.6 μC - Fast body diode recovery reduces cross-conduction loss and EMI in synchronous rectification and half-bridge circuits.
RthJC 0.8 °C/W - High thermal conductivity from junction to case enables >100 W dissipation with standard TO-247 heatsinking.

Pinout & Package

SIHG186N60EF-GE3 uses the TO-247AC package - a through-hole, single-ended, high-voltage power package with isolated drain tab and 3-pin configuration. The plastic body includes a thermal pad (D1/E1 optional per version) and conforms to JEDEC TO-247 outline with facility-code-specific dimensional variants (9/Y/N).

Pin/Terminal Circuit Role Design Meaning
1 (Gate) Control electrode Receives 10 V logic-level gate drive; low input capacitance (Ciss = 1081 pF) eases driver selection and layout.
2 (Drain) Main high-side current path Connected to internal die drain metallization and external heatsink via isolated tab; rated for 600 V blocking and 43 A pulsed current.
3 (Source) Reference node and return path Serves as common reference for gate drive and current sensing; low-inductance connection critical for minimizing dv/dt-induced false turn-on.
4 (Drain) Secondary drain terminal Redundant drain connection (pin 4 = pin 2 electrically) improves current sharing and thermal spreading in high-current PCB layouts.

Key Features

Feature Design Value
4th-generation E-series process Delivers industry-leading RDS(on) × Qg figure-of-merit for 600 V class, directly reducing combined conduction and switching losses.
Avalanche energy rating 24 mJ single-pulse UIS capability eliminates need for external clamping in inductive load switching and fault-tolerant designs.
Fast body diode 111 ns trr and 0.6 μC Qrr enable use in freewheeling paths without external Schottky diodes in mid-power SMPS and motor drives.
Low Co(er) 40 pF effective output capacitance cuts turn-off energy loss by ~35 % vs. legacy 600 V MOSFETs, improving efficiency above 100 kHz.
Lead (Pb)-free & halogen-free Meets RoHS Directive 2011/65/EU and Vishay's material compliance standard (doc#99912), supporting green manufacturing and export compliance.

Applications

Server Power Supply PFC Stage Telecom Rectifier Module

Use Scenario: Active boost PFC front-end operating at 100–300 kHz with 380–400 V DC output.

IC Role / Device Role / Timing Role: Main switching device in continuous conduction mode (CCM) boost converter; handles full line-frequency AC input rectification and high-voltage DC bus generation.

Use Value: 0.168 Ω RDS(on) and 32 nC Qg jointly reduce total losses below 2.1 W at 12 A RMS, enabling >96 % PFC efficiency without liquid cooling.

Use Scenario: Isolated LLC resonant DC/DC stage in 48 V telecom rectifier delivering up to 3 kW.

IC Role / Device Role / Timing Role: High-side switch in half-bridge primary side; synchronized with complementary low-side device for zero-voltage switching.

Use Value: 111 ns trr and low Qrr minimize dead-time loss and prevent shoot-through during commutation, sustaining >97 % conversion efficiency at full load.

Solar PV Inverter DC Link Industrial Motor Drive Inverter

Use Scenario: DC link switching in string inverters handling 600–1000 V DC input from photovoltaic arrays.

IC Role / Device Role / Timing Role: IGBT replacement in 3-phase inverter bridge; used in hard-switched or modified space-vector PWM topologies.

Use Value: 600 V VDS rating with 24 mJ EAS withstands DC link transients and enables simplified protection circuitry versus IGBT-based solutions.

Use Scenario: 3-phase inverter driving 3–7.5 kW induction motors in HVAC and pump systems.

IC Role / Device Role / Timing Role: Output stage switch in V/f or sensorless vector control; operates at 8–16 kHz carrier frequency with active braking.

Use Value: Fast body diode and low Coss reduce regeneration losses during dynamic braking, improving system response and thermal stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STW48N60M2 600 V, 48 A, RDS(on) = 0.065 Ω, Qg = 65 nC, TO-247 long leads Higher current rating but larger gate charge increases driver loss; no specified EAS rating Prefer when higher continuous current (>25 A) is required and gate drive capability permits higher Qg.
IXFH32N60P 600 V, 32 A, RDS(on) = 0.135 Ω, Qg = 52 nC, TO-247 non-isolated drain Lower RDS(on) but significantly higher Qg; lacks avalanche rating and fast-body-diode optimization Select only if conduction loss dominates design and avalanche robustness is not required in the target application.

Compared with STW48N60M2 and IXFH32N60P, SIHG186N60EF-GE3 offers superior balance of low Qg, rated avalanche energy, and fast body diode-making it optimal for efficiency-critical, reliability-demanding PFC and resonant converter designs where driver simplicity and fault tolerance are prioritized over raw current capacity.

Availability

SIHG186N60EF-GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp-up.

Supply support for SIHG186N60EF-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with vertical manufacturing and rigorous reliability testing.

The EF Series, including SIHG186N60EF-GE3, was engineered specifically for high-efficiency, high-reliability hard-switched and resonant power conversion in datacenter, telecom, and renewable energy infrastructure.

FAQ

What is the maximum continuous drain current rating for SIHG186N60EF-GE3 at 100 °C case temperature?

The SIHG186N60EF-GE3 has a continuous drain current rating of 12 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value accounts for thermal derating from the 18 A rating at 25 °C and ensures safe operation within the 150 °C maximum junction temperature limit under typical heatsink conditions.

Does SIHG186N60EF-GE3 have a fully rated avalanche capability, and what is its EAS value?

Yes, SIHG186N60EF-GE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 24 mJ, tested per standard conditions (VDD = 120 V, L = 28.2 mH, Rg = 25 Ω, IAS = 1.3 A). This rating is guaranteed and characterized across temperature, enabling robust fault handling without external snubbers.

What is the gate-source threshold voltage range for SIHG186N60EF-GE3, and how does it affect drive design?

The gate-source threshold voltage (VGS(th)) for SIHG186N60EF-GE3 is specified from 3.0 V to 5.0 V at ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while providing sufficient margin against noise-induced false triggering-critical in high-dv/dt power converter environments where SIHG186N60EF-GE3 operates.

Can SIHG186N60EF-GE3 be used in place of an IGBT in a solar inverter DC link stage?

Yes, SIHG186N60EF-GE3 is qualified for IGBT replacement in 600 V-class solar inverter DC link stages due to its 600 V VDS rating, 24 mJ EAS, and low RDS(on). Unlike most IGBTs, it offers faster switching and no tail current, reducing switching loss-but requires careful gate drive design to manage higher dv/dt and ensure clean turn-off in hard-switched topologies.

What is the thermal resistance from junction to case (RthJC) for SIHG186N60EF-GE3, and why is it important?

The maximum junction-to-case thermal resistance (RthJC) for SIHG186N60EF-GE3 is 0.8 °C/W. This low value reflects efficient heat transfer from the silicon die to the TO-247AC drain tab, enabling high-power dissipation (up to 156 W) with minimal temperature rise-essential for maintaining reliability and efficiency in compact, air-cooled power modules where SIHG186N60EF-GE3 is deployed.

SIHG186N60EF-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
EF
Package/Case:
TO-247-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
8.4A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
193mOhm @ 9.5A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
32 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
1081 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
156W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-247AC

SIHG186N60EF-GE3 FAQ

1.How can I place an order for SIHG186N60EF-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHG186N60EF-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHG186N60EF-GE3 reliable?

The price and inventory of SIHG186N60EF-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHG186N60EF-GE3 is usually 5 days.

3.What payment methods are accepted for SIHG186N60EF-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHG186N60EF-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHG186N60EF-GE3?

SIHG186N60EF-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHG186N60EF-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHG186N60EF-GE3?

For technical support, including SIHG186N60EF-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHG186N60EF-GE3 requirements.

6.How does Aetrix verify that SIHG186N60EF-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHG186N60EF-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHG186N60EF-GE3 meets industry standards.

7.What is the process for return or replacement of SIHG186N60EF-GE3?

All SIHG186N60EF-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHG186N60EF-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHG186N60EF-GE3 part is unused and in its original packaging.

Return procedure for SIHG186N60EF-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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