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Vishay Siliconix SIHH26N60E-T1-GE3

Part No.:
SIHH26N60E-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
8-PowerTDFN
Datasheet:
AetrixSIHH26N60E-T1-GE3.pdf
Description:
MOSFET N-CH 600V 25A PPAK 8 X 8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,625

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Product details

Overview

SIHH26N60E-T1-GE3 from Vishay Siliconix is a 600 V, 25 A N-channel PowerPAK® 8 × 8 surface-mount MOSFET with Kelvin source connection, RDS(on) = 0.117 Ω at VGS = 10 V, Qg = 77 nC (typ), and rated for unclamped inductive switching (UIS) up to 353 mJ - optimized for high-efficiency server power supplies and PFC stages.

For engineers reviewing the SIHH26N60E-T1-GE3 datasheet, SIHH26N60E-T1-GE3 pinout, SIHH26N60E-T1-GE3 application, or SIHH26N60E-T1-GE3 equivalent, key selection criteria include its low FOM (RDS(on) × Qg), reduced gate noise via Kelvin source, and thermal performance with RthJC = 0.48 °C/W - critical for high-density SMPS and solar inverters.

Technical Context

This E-series MOSFET employs planar trench-gate silicon technology with integrated Kelvin source terminal to decouple power and signal return paths, minimizing gate drive loop inductance and improving switching stability under high dI/dt conditions. Its 600 V VDS rating supports universal input AC/DC front-end designs.

The device features avalanche-rated ruggedness (EAS = 353 mJ), low Ciss = 2815 pF, and fast body diode recovery (trr = 459 ns typ) - enabling reliable operation in hard-switched topologies such as boost PFC and LLC resonant converters without external snubbers.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max600 V - supports 400 V DC bus with 50 % margin for transient overvoltage in telecom/server PSUs
RDS(on) typ @ 10 V0.117 Ω - enables <2.5 W conduction loss at 13 A continuous drain current
Qg max116 nC - determines gate driver power requirement and switching speed in 100–300 kHz PFC stages
EAS353 mJ - ensures single-pulse robustness during output short-circuit or startup inverter faults
RthJC max0.62 °C/W - allows >150 W power dissipation with ≤95 °C case temperature rise under forced air cooling
Ciss2815 pF - impacts Miller effect and gate drive energy in high-side switch configurations
trr459 ns (typ) - reduces reverse recovery losses and EMI in discontinuous conduction mode (DCM) operation

Pinout & Package

Package: PowerPAK® 8 × 8 (8.0 mm × 8.0 mm × 1.0 mm), thermally enhanced copper-clip package with exposed drain pad on bottom side and four-surface solderable terminals.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1GateMain gate control terminal; connects to gate driver IC output with low-inductance trace
Pin 2Kelvin SourceDedicated low-current source return for gate driver feedback - isolates power source path to minimize VGS distortion
Pin 3SourceMain power source terminal; carries full load current and connects to power ground plane
Pin 4DrainExposed copper pad on underside; electrically and thermally connected to PCB copper pour for heat sinking

Key Features

FeatureDesign Value
Kelvin source connectionSeparates gate drive return from high-current source path, reducing gate oscillation and improving turn-off consistency under high dI/dt
Low RDS(on) × Qg figure-of-merit13.7 Ω·nC (0.117 Ω × 116 nC) - balances conduction and switching losses for optimal efficiency at 100–250 kHz
Avalanche energy rating353 mJ single-pulse - eliminates need for external clamping in inductive load transients common in motor drives and welders
Lead (Pb)-free and halogen-freeComplies with RoHS 2011/65/EU and JEDEC JS709C - suitable for industrial and telecom equipment with strict environmental compliance
Ultra-low gate chargeQg = 77 nC (typ) - reduces gate driver IC stress and enables use of lower-cost drivers in high-volume SMPS designs

Applications

Server Power SupplyPhotovoltaic Inverter

Use Scenario: High-density 3 kW+ AC/DC front-end with active clamp forward or interleaved PFC.

IC Role / Device Role / Timing Role: Main switch in boost PFC stage operating at 100–200 kHz with 400 V DC bus.

Use Value: Kelvin source minimizes gate ringing during zero-crossing transitions, while 600 V rating accommodates 480 VAC surge peaks per IEC 61000-4-5.

Use Scenario: Two-level string inverter DC/AC stage with unipolar PWM modulation.

IC Role / Device Role / Timing Role: High-side switching element in H-bridge leg handling 1000 V DC input with 50 kHz carrier frequency.

Use Value: Low Ciss and fast trr reduce shoot-through risk and switching losses during dead-time transitions, improving inverter efficiency by ≥0.4 % at full load.

Industrial Motor DriveLED Streetlight Driver

Use Scenario: 7.5 kW variable-frequency drive with regenerative braking and dynamic braking resistor control.

IC Role / Device Role / Timing Role: Brake chopper switch activated during overvoltage events on DC bus.

Use Value: UIS rating of 353 mJ ensures reliable energy absorption during rapid motor deceleration without failure - eliminating need for external TVS or Zener clamps.

Use Scenario: Constant-current 300 W LED driver for outdoor street lighting with DALI dimming interface.

IC Role / Device Role / Timing Role: Primary-side switch in flyback topology operating in quasi-resonant (QR) mode at 65–120 kHz.

Use Value: Low Qg enables clean zero-voltage switching (ZVS) initiation across line range, reducing EMI and improving light-output stability under voltage sags.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STW48N60M2600 V, 48 A, RDS(on) = 0.065 Ω, Qg = 120 nC, TO-247 packageHigher current rating but larger footprint and higher gate charge - requires larger heatsink and stronger gate driverSelect when higher continuous current (>30 A) is required and board space permits TO-247 mounting
IXFH40N60P600 V, 40 A, RDS(on) = 0.085 Ω, Qg = 145 nC, TO-247 package with fast body diodeNo Kelvin source; higher Qg increases driver losses; superior diode trr (250 ns) but no avalanche ratingPrefer for resonant topologies where diode recovery dominates losses, but avoid in hard-switched PFC with inductive fault risk

Compared with STW48N60M2 and IXFH40N60P, SIHH26N60E-T1-GE3 delivers superior gate drive stability via Kelvin source and best-in-class FOM for compact, high-frequency PFC - making it optimal for space-constrained server and telecom power modules where layout-induced oscillation must be minimized.

Availability

SIHH26N60E-T1-GE3 is available at Aetrix Electronics and suitable for server and telecom power supplies, photovoltaic inverters, and industrial motor drives requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for SIHH26N60E-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, ruggedness, and reliability.

The E Series Power MOSFET product line targets high-efficiency, high-reliability switching applications in server, telecom, industrial, and renewable energy systems - engineered for low FOM, Kelvin-source noise immunity, and robust avalanche capability.

FAQ

What is the maximum continuous drain current rating for SIHH26N60E-T1-GE3 at 100 °C case temperature?

The SIHH26N60E-T1-GE3 supports 16 A continuous drain current at TC = 100 °C, derated linearly from 25 A at 25 °C using a 1.6 W/°C factor. This rating assumes proper PCB copper area and airflow per Vishay's recommended PowerPAK® 8 × 8 thermal layout guidelines in document 68441.

Does SIHH26N60E-T1-GE3 include an integrated body diode, and what are its key recovery characteristics?

Yes, SIHH26N60E-T1-GE3 includes an integral body diode with trr = 459 ns (typ), Qrr = 7.6 μC (typ), and VSD = 0.9 V (typ) at IS = 13 A and TJ = 25 °C. These values are measured under standardized conditions (dI/dt = 100 A/μs, VR = 25 V) and enable predictable performance in synchronous rectification and freewheeling roles.

How does the Kelvin source configuration in SIHH26N60E-T1-GE3 improve gate drive performance?

The Kelvin source in SIHH26N60E-T1-GE3 separates the gate return path from the main source current path, eliminating voltage drop-induced gate threshold shift during high dI/dt switching. This preserves accurate VGS control, suppresses parasitic turn-on, and improves timing consistency - especially critical in multi-phase PFC and high-frequency LLC designs.

What is the thermal resistance from junction to case (RthJC) for SIHH26N60E-T1-GE3, and how is it measured?

The SIHH26N60E-T1-GE3 has a typical RthJC of 0.48 °C/W, measured from the silicon die junction to the exposed drain pad (Pin 4). This value is validated per JESD51-14 and reflects direct thermal conduction through the copper clip - enabling accurate junction temperature estimation when the drain pad is soldered to a thermally optimized PCB copper pour.

Is SIHH26N60E-T1-GE3 suitable for use in automotive applications?

No, SIHH26N60E-T1-GE3 is not qualified to AEC-Q101 or automotive-grade reliability standards. It is specified for industrial, telecom, and renewable energy applications only. For automotive use, Vishay offers the SQ series (e.g., SQM26N60E) with extended temperature range and qualification testing.

SIHH26N60E-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
8-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
25A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
135mOhm @ 13A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
116 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
2815 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
202W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® 8 x 8

SIHH26N60E-T1-GE3 FAQ

1.How can I place an order for SIHH26N60E-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHH26N60E-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHH26N60E-T1-GE3 reliable?

The price and inventory of SIHH26N60E-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHH26N60E-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIHH26N60E-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHH26N60E-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHH26N60E-T1-GE3?

SIHH26N60E-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHH26N60E-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHH26N60E-T1-GE3?

For technical support, including SIHH26N60E-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHH26N60E-T1-GE3 requirements.

6.How does Aetrix verify that SIHH26N60E-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHH26N60E-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHH26N60E-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIHH26N60E-T1-GE3?

All SIHH26N60E-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHH26N60E-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHH26N60E-T1-GE3 part is unused and in its original packaging.

Return procedure for SIHH26N60E-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHH26N60E-T1-GE3 Tags

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