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Vishay Siliconix SIHK105N60E-T1-GE3

Part No.:
SIHK105N60E-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
8-PowerBSFN
Datasheet:
AetrixSIHK105N60E-T1-GE3.pdf
Description:
E SERIES POWER MOSFET WITH FAST
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,050

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Product details

Overview

SIHK105N60E-T1-GE3 from Vishay Siliconix is a 600 V, 24 A N-channel Power MOSFET in PowerPAK® 10 x 12 (TOLL) package with RDS(on) = 0.090 Ω at VGS = 10 V, Qg = 34 nC (typ), and fast body diode (trr = 102 ns typ). It delivers low conduction and switching losses for high-efficiency PFC and SMPS stages in telecom rectifiers.

For engineers reviewing the SIHK105N60E-T1-GE3 datasheet, SIHK105N60E-T1-GE3 pinout, SIHK105N60E-T1-GE3 application, or SIHK105N60E-T1-GE3 equivalent, key selection criteria include avalanche-rated energy (EAS = 154 mJ), Co(er) = 85 pF, dv/dt capability (100 V/ns), and thermal resistance RthJC = 0.88 °C/W - all critical for hard-switched industrial power converters.

Technical Context

This MOSFET employs Vishay's 4th-generation EF-series silicon technology optimized for high-voltage, medium-current applications requiring robust unclamped inductive switching performance and fast body diode recovery. Its low RDS(on) × Qg figure-of-merit (FOM) directly reduces total gate drive loss and conduction loss trade-off in continuous conduction mode (CCM) PFC boost stages.

The device integrates an avalanche-energy-rated body diode with trr = 102 ns (typ) and Qrr = 0.6 μC (typ) at TJ = 25 °C, enabling reliable operation in synchronous rectification and bidirectional topologies without external anti-parallel diodes. Its 600 V VDS rating supports 400 V DC bus designs with 50 V margin.

Key Specifications

Parameter Value and Actual Design Meaning
VDS max600 V - Supports 400 V DC bus with 50 V safety margin in telecom/server PSUs
RDS(on) typ @ 10 V0.090 Ω - Enables ≤ 2.16 W conduction loss at 15 A continuous drain current
Qg typ34 nC - Reduces gate driver power demand and switching transition time in 100–300 kHz PFC stages
EAS154 mJ - Withstands single-pulse inductive energy without failure in hard-switched motor drives
trr typ102 ns - Limits reverse recovery loss and EMI generation during diode commutation in bridge legs
RthJC0.88 °C/W - Allows ≥ 142 W power dissipation with <130 °C junction rise above 25 °C case temperature
Co(er)85 pF - Low effective output capacitance minimizes turn-on loss in ZVS-assisted topologies

Pinout & Package

SIHK105N60E-T1-GE3 uses the PowerPAK® 10 x 12 (TOLL) thermally enhanced surface-mount package with exposed drain tab on bottom side for direct PCB heatsinking. The package features 8-pin configuration: pins 3–8 are source-connected internally to the drain tab; pin 2 is driver source; pin 1 is gate.

Pin/Terminal Circuit Role Design Meaning
Drain (tab)Main power drain terminalExposed copper pad on underside - must be soldered to large copper pour for thermal management and low-inductance return path
Pins 3–8Source terminalsInternally bonded to source metallization - provide parallel low-resistance source connection for reduced loop inductance
Pin 2Driver source (Kelvin source)Separate Kelvin connection for gate driver return - isolates gate loop from high di/dt source paths to improve switching stability
Pin 1Gate inputControl terminal for MOSFET channel - requires low-impedance gate driver (<1 Ω Rg) to achieve specified td(on)/tr

Key Features

Feature Design Value
4th-generation EF-series siliconOptimized cell layout delivering 18% lower RDS(on) × Qg FOM vs. prior E-series, reducing combined conduction/switching loss
Avalanche energy rated (UIS)154 mJ single-pulse rating enables robustness against transient overloads in welding and induction heating inverters
Fast body diode102 ns reverse recovery time and 0.6 μC Qrr reduce diode-induced voltage spikes and EMI in half-bridge LLC resonant converters
Low Co(er)85 pF effective output capacitance cuts turn-on switching loss by ~35% vs. standard 600 V MOSFETs with comparable RDS(on)
Thermally enhanced TOLL package0.88 °C/W RthJC enables 142 W power dissipation with minimal heatsink - ideal for space-constrained 1U server PSUs

Applications

Server Power Supply PFC Stage Telecom Rectifier Output Stage

Use Scenario: Boost converter in 3.5 kW front-end PFC module operating at 100 kHz with 400 V DC bus.

IC Role / Device Role / Timing Role: Main switching device in continuous conduction mode (CCM) boost topology; handles 24 A RMS input current.

Use Value: 0.090 Ω RDS(on) and 34 nC Qg minimize combined conduction and gate loss, achieving >98.2% efficiency at full load.

Use Scenario: Synchronous rectification in 48 V/50 A telecom rectifier with 300 kHz phase-shifted full-bridge.

IC Role / Device Role / Timing Role: Secondary-side switch replacing Schottky diodes; operates with 100 ns dead-time control.

Use Value: Fast 102 ns trr and low Qrr prevent shoot-through and reduce voltage overshoot during body-diode commutation.

Solar PV Inverter DC-DC Stage Industrial Motor Drive Inverter Leg

Use Scenario: Isolated DC-DC stage in string-level optimizer converting 60–150 V PV input to 400 V bus.

IC Role / Device Role / Timing Role: Primary-side switch in active clamp forward topology; switches at 200 kHz with 50% duty cycle.

Use Value: 154 mJ EAS withstands leakage inductance energy during clamp reset, eliminating need for snubbers.

Use Scenario: High-side switch in 7.5 kW three-phase inverter driving permanent magnet motor at 10 kHz PWM.

IC Role / Device Role / Timing Role: Upper-leg IGBT replacement in 600 V class inverter leg; operated with 15 V gate drive.

Use Value: 0.88 °C/W RthJC allows direct PCB copper cooling, eliminating discrete heatsinks in compact VFD enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STW62N60M2600 V, 57 A, RDS(on) = 0.055 Ω, Qg = 62 nC, TO-247 packageHigher current rating but larger footprint and higher gate charge - better suited for 3 kW+ industrial invertersSelect when higher ID and TO-247 mechanical robustness outweigh surface-mount density requirements
IXFH50N60X3600 V, 50 A, RDS(on) = 0.065 Ω, Qg = 55 nC, TO-247 package with ultra-fast diode (trr = 55 ns)Lower RDS(on) and faster diode but no Kelvin source - less stable in high-di/dt synchronous rectificationPrefer for ZVS resonant converters where diode speed dominates; avoid in hard-switched PFC with tight layout constraints

Compared with STW62N60M2 and IXFH50N60X3, SIHK105N60E-T1-GE3 offers superior power density via TOLL packaging, Kelvin source for gate-loop isolation, and balanced FOM for 1–5 kW CCM PFC - making it optimal for space-limited, high-reliability telecom and server power systems.

Availability

SIHK105N60E-T1-GE3 is available at Aetrix Electronics and suitable for server and telecom power supplies, solar PV inverters, and industrial motor drives requiring stable component supply and long-term lifecycle support.

Supply support for SIHK105N60E-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics for power, signal, and sensing applications.

The EF-series Power MOSFETs are engineered for high-efficiency, high-reliability switching in 400–800 V DC bus systems - targeting next-generation PFC, UPS, and renewable energy conversion where thermal density and avalanche ruggedness are critical.

FAQ

What is the maximum continuous drain current rating for SIHK105N60E-T1-GE3 at 100 °C case temperature?

The SIHK105N60E-T1-GE3 has a continuous drain current rating of 15 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value reflects thermal derating from its 24 A rating at 25 °C case temperature, based on a linear derating factor of 1.14 W/°C and RthJC = 0.88 °C/W. Engineers must verify board-level thermal design meets this condition for sustained operation.

Does SIHK105N60E-T1-GE3 include a Kelvin source connection, and how is it implemented?

Yes, SIHK105N60E-T1-GE3 implements a dedicated Kelvin source connection at pin 2. This separate low-current source terminal isolates the gate driver return path from high-di/dt main source current flowing through pins 3–8 and the drain tab. This design minimizes gate loop inductance and prevents voltage spikes that could cause false turn-on, especially critical in high-frequency PFC and synchronous rectifier applications using the SIHK105N60E-T1-GE3.

What is the typical reverse recovery charge (Qrr) of the body diode in SIHK105N60E-T1-GE3, and under what conditions is it measured?

The typical reverse recovery charge (Qrr) of the SIHK105N60E-T1-GE3 body diode is 0.6 μC, measured at TJ = 25 °C with IF = IS = 12 A, di/dt = 100 A/μs, and VR = 400 V. This parameter directly impacts switching loss and EMI in bridge-leg configurations - lower Qrr reduces tail current and associated voltage overshoot during commutation, a key advantage of the EF-series silicon used in SIHK105N60E-T1-GE3.

Can SIHK105N60E-T1-GE3 be used in avalanche-mode operation, and what is its rated single-pulse energy?

Yes, SIHK105N60E-T1-GE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 154 mJ, tested per JEDEC standard with VDD = 120 V, L = 28.2 mH, Rg = 25 Ω, and IAS = 3.3 A. This ruggedness enables use in non-ZVS topologies like hard-switched flyback or forward converters where leakage inductance energy must be absorbed - a verified capability of the SIHK105N60E-T1-GE3 confirmed in Vishay's characterization data.

What is the gate-source threshold voltage range for SIHK105N60E-T1-GE3, and why does it matter for gate drive design?

The gate-source threshold voltage (VGS(th)) for SIHK105N60E-T1-GE3 is specified from 3.0 V to 5.0 V at VDS = VGS and ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while preventing accidental conduction from noise coupling - critical in high-noise industrial environments. Designers must ensure gate drive voltage exceeds 5 V to guarantee full enhancement across process and temperature variation, a requirement consistently met in SIHK105N60E-T1-GE3 applications.

SIHK105N60E-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
EF
Package/Case:
8-PowerBSFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
24A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
105mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
51 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
2301 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
142W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK®10 x 12

SIHK105N60E-T1-GE3 FAQ

1.How can I place an order for SIHK105N60E-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHK105N60E-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHK105N60E-T1-GE3 reliable?

The price and inventory of SIHK105N60E-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHK105N60E-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIHK105N60E-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHK105N60E-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHK105N60E-T1-GE3?

SIHK105N60E-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHK105N60E-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHK105N60E-T1-GE3?

For technical support, including SIHK105N60E-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHK105N60E-T1-GE3 requirements.

6.How does Aetrix verify that SIHK105N60E-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHK105N60E-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHK105N60E-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIHK105N60E-T1-GE3?

All SIHK105N60E-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHK105N60E-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHK105N60E-T1-GE3 part is unused and in its original packaging.

Return procedure for SIHK105N60E-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHK105N60E-T1-GE3 Tags

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