Vishay Siliconix SIHK105N60E-T1-GE3
- Part No.:
- SIHK105N60E-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerBSFN
- Datasheet:
-
SIHK105N60E-T1-GE3.pdf
- Description:
- E SERIES POWER MOSFET WITH FAST
- Quantity:
- Payment:

- Shipping:

Inventory:2,050
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIHK105N60E-T1-GE3 from Vishay Siliconix is a 600 V, 24 A N-channel Power MOSFET in PowerPAK® 10 x 12 (TOLL) package with RDS(on) = 0.090 Ω at VGS = 10 V, Qg = 34 nC (typ), and fast body diode (trr = 102 ns typ). It delivers low conduction and switching losses for high-efficiency PFC and SMPS stages in telecom rectifiers.
For engineers reviewing the SIHK105N60E-T1-GE3 datasheet, SIHK105N60E-T1-GE3 pinout, SIHK105N60E-T1-GE3 application, or SIHK105N60E-T1-GE3 equivalent, key selection criteria include avalanche-rated energy (EAS = 154 mJ), Co(er) = 85 pF, dv/dt capability (100 V/ns), and thermal resistance RthJC = 0.88 °C/W - all critical for hard-switched industrial power converters.
Technical Context
This MOSFET employs Vishay's 4th-generation EF-series silicon technology optimized for high-voltage, medium-current applications requiring robust unclamped inductive switching performance and fast body diode recovery. Its low RDS(on) × Qg figure-of-merit (FOM) directly reduces total gate drive loss and conduction loss trade-off in continuous conduction mode (CCM) PFC boost stages.
The device integrates an avalanche-energy-rated body diode with trr = 102 ns (typ) and Qrr = 0.6 μC (typ) at TJ = 25 °C, enabling reliable operation in synchronous rectification and bidirectional topologies without external anti-parallel diodes. Its 600 V VDS rating supports 400 V DC bus designs with 50 V margin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 600 V - Supports 400 V DC bus with 50 V safety margin in telecom/server PSUs |
| RDS(on) typ @ 10 V | 0.090 Ω - Enables ≤ 2.16 W conduction loss at 15 A continuous drain current |
| Qg typ | 34 nC - Reduces gate driver power demand and switching transition time in 100–300 kHz PFC stages |
| EAS | 154 mJ - Withstands single-pulse inductive energy without failure in hard-switched motor drives |
| trr typ | 102 ns - Limits reverse recovery loss and EMI generation during diode commutation in bridge legs |
| RthJC | 0.88 °C/W - Allows ≥ 142 W power dissipation with <130 °C junction rise above 25 °C case temperature |
| Co(er) | 85 pF - Low effective output capacitance minimizes turn-on loss in ZVS-assisted topologies |
Pinout & Package
SIHK105N60E-T1-GE3 uses the PowerPAK® 10 x 12 (TOLL) thermally enhanced surface-mount package with exposed drain tab on bottom side for direct PCB heatsinking. The package features 8-pin configuration: pins 3–8 are source-connected internally to the drain tab; pin 2 is driver source; pin 1 is gate.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (tab) | Main power drain terminal | Exposed copper pad on underside - must be soldered to large copper pour for thermal management and low-inductance return path |
| Pins 3–8 | Source terminals | Internally bonded to source metallization - provide parallel low-resistance source connection for reduced loop inductance |
| Pin 2 | Driver source (Kelvin source) | Separate Kelvin connection for gate driver return - isolates gate loop from high di/dt source paths to improve switching stability |
| Pin 1 | Gate input | Control terminal for MOSFET channel - requires low-impedance gate driver (<1 Ω Rg) to achieve specified td(on)/tr |
Key Features
| Feature | Design Value |
|---|---|
| 4th-generation EF-series silicon | Optimized cell layout delivering 18% lower RDS(on) × Qg FOM vs. prior E-series, reducing combined conduction/switching loss |
| Avalanche energy rated (UIS) | 154 mJ single-pulse rating enables robustness against transient overloads in welding and induction heating inverters |
| Fast body diode | 102 ns reverse recovery time and 0.6 μC Qrr reduce diode-induced voltage spikes and EMI in half-bridge LLC resonant converters |
| Low Co(er) | 85 pF effective output capacitance cuts turn-on switching loss by ~35% vs. standard 600 V MOSFETs with comparable RDS(on) |
| Thermally enhanced TOLL package | 0.88 °C/W RthJC enables 142 W power dissipation with minimal heatsink - ideal for space-constrained 1U server PSUs |
Applications
| Server Power Supply PFC Stage | Telecom Rectifier Output Stage |
|---|---|
Use Scenario: Boost converter in 3.5 kW front-end PFC module operating at 100 kHz with 400 V DC bus. IC Role / Device Role / Timing Role: Main switching device in continuous conduction mode (CCM) boost topology; handles 24 A RMS input current. Use Value: 0.090 Ω RDS(on) and 34 nC Qg minimize combined conduction and gate loss, achieving >98.2% efficiency at full load. |
Use Scenario: Synchronous rectification in 48 V/50 A telecom rectifier with 300 kHz phase-shifted full-bridge. IC Role / Device Role / Timing Role: Secondary-side switch replacing Schottky diodes; operates with 100 ns dead-time control. Use Value: Fast 102 ns trr and low Qrr prevent shoot-through and reduce voltage overshoot during body-diode commutation. |
| Solar PV Inverter DC-DC Stage | Industrial Motor Drive Inverter Leg |
Use Scenario: Isolated DC-DC stage in string-level optimizer converting 60–150 V PV input to 400 V bus. IC Role / Device Role / Timing Role: Primary-side switch in active clamp forward topology; switches at 200 kHz with 50% duty cycle. Use Value: 154 mJ EAS withstands leakage inductance energy during clamp reset, eliminating need for snubbers. |
Use Scenario: High-side switch in 7.5 kW three-phase inverter driving permanent magnet motor at 10 kHz PWM. IC Role / Device Role / Timing Role: Upper-leg IGBT replacement in 600 V class inverter leg; operated with 15 V gate drive. Use Value: 0.88 °C/W RthJC allows direct PCB copper cooling, eliminating discrete heatsinks in compact VFD enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW62N60M2 | 600 V, 57 A, RDS(on) = 0.055 Ω, Qg = 62 nC, TO-247 package | Higher current rating but larger footprint and higher gate charge - better suited for 3 kW+ industrial inverters | Select when higher ID and TO-247 mechanical robustness outweigh surface-mount density requirements |
| IXFH50N60X3 | 600 V, 50 A, RDS(on) = 0.065 Ω, Qg = 55 nC, TO-247 package with ultra-fast diode (trr = 55 ns) | Lower RDS(on) and faster diode but no Kelvin source - less stable in high-di/dt synchronous rectification | Prefer for ZVS resonant converters where diode speed dominates; avoid in hard-switched PFC with tight layout constraints |
Compared with STW62N60M2 and IXFH50N60X3, SIHK105N60E-T1-GE3 offers superior power density via TOLL packaging, Kelvin source for gate-loop isolation, and balanced FOM for 1–5 kW CCM PFC - making it optimal for space-limited, high-reliability telecom and server power systems.
Availability
SIHK105N60E-T1-GE3 is available at Aetrix Electronics and suitable for server and telecom power supplies, solar PV inverters, and industrial motor drives requiring stable component supply and long-term lifecycle support.
Supply support for SIHK105N60E-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics for power, signal, and sensing applications.
The EF-series Power MOSFETs are engineered for high-efficiency, high-reliability switching in 400–800 V DC bus systems - targeting next-generation PFC, UPS, and renewable energy conversion where thermal density and avalanche ruggedness are critical.
FAQ
What is the maximum continuous drain current rating for SIHK105N60E-T1-GE3 at 100 °C case temperature?
The SIHK105N60E-T1-GE3 has a continuous drain current rating of 15 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value reflects thermal derating from its 24 A rating at 25 °C case temperature, based on a linear derating factor of 1.14 W/°C and RthJC = 0.88 °C/W. Engineers must verify board-level thermal design meets this condition for sustained operation.
Does SIHK105N60E-T1-GE3 include a Kelvin source connection, and how is it implemented?
Yes, SIHK105N60E-T1-GE3 implements a dedicated Kelvin source connection at pin 2. This separate low-current source terminal isolates the gate driver return path from high-di/dt main source current flowing through pins 3–8 and the drain tab. This design minimizes gate loop inductance and prevents voltage spikes that could cause false turn-on, especially critical in high-frequency PFC and synchronous rectifier applications using the SIHK105N60E-T1-GE3.
What is the typical reverse recovery charge (Qrr) of the body diode in SIHK105N60E-T1-GE3, and under what conditions is it measured?
The typical reverse recovery charge (Qrr) of the SIHK105N60E-T1-GE3 body diode is 0.6 μC, measured at TJ = 25 °C with IF = IS = 12 A, di/dt = 100 A/μs, and VR = 400 V. This parameter directly impacts switching loss and EMI in bridge-leg configurations - lower Qrr reduces tail current and associated voltage overshoot during commutation, a key advantage of the EF-series silicon used in SIHK105N60E-T1-GE3.
Can SIHK105N60E-T1-GE3 be used in avalanche-mode operation, and what is its rated single-pulse energy?
Yes, SIHK105N60E-T1-GE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 154 mJ, tested per JEDEC standard with VDD = 120 V, L = 28.2 mH, Rg = 25 Ω, and IAS = 3.3 A. This ruggedness enables use in non-ZVS topologies like hard-switched flyback or forward converters where leakage inductance energy must be absorbed - a verified capability of the SIHK105N60E-T1-GE3 confirmed in Vishay's characterization data.
What is the gate-source threshold voltage range for SIHK105N60E-T1-GE3, and why does it matter for gate drive design?
The gate-source threshold voltage (VGS(th)) for SIHK105N60E-T1-GE3 is specified from 3.0 V to 5.0 V at VDS = VGS and ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while preventing accidental conduction from noise coupling - critical in high-noise industrial environments. Designers must ensure gate drive voltage exceeds 5 V to guarantee full enhancement across process and temperature variation, a requirement consistently met in SIHK105N60E-T1-GE3 applications.
SIHK105N60E-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- EF
- Package/Case:
- 8-PowerBSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 24A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 105mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 51 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2301 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 142W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK®10 x 12
SIHK105N60E-T1-GE3 FAQ
1.How can I place an order for SIHK105N60E-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHK105N60E-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHK105N60E-T1-GE3 reliable?
The price and inventory of SIHK105N60E-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHK105N60E-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIHK105N60E-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHK105N60E-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHK105N60E-T1-GE3?
SIHK105N60E-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHK105N60E-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHK105N60E-T1-GE3?
For technical support, including SIHK105N60E-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHK105N60E-T1-GE3 requirements.
6.How does Aetrix verify that SIHK105N60E-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHK105N60E-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHK105N60E-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIHK105N60E-T1-GE3?
All SIHK105N60E-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHK105N60E-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHK105N60E-T1-GE3 part is unused and in its original packaging.
Return procedure for SIHK105N60E-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIHK105N60E-T1-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

