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Vishay Siliconix SIS698DN-T1-GE3

Part No.:
SIS698DN-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
PowerPAK® 1212-8
Datasheet:
AetrixSIS698DN-T1-GE3.pdf
Description:
MOSFET N-CH 100V 6.9A PPAK1212-8
Quantity:
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Payment
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Inventory:7,899

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Product details

Overview

SIS698DN-T1-GE3 from Vishay Siliconix is an N-channel 100 V (D-S) TrenchFET® power MOSFET in a PowerPAK® 1212-8 package, rated for 6.9 A continuous drain current at TC = 25 °C, with RDS(on) of 0.195 Ω at VGS = 10 V and 5.2 nC total gate charge - optimized for high-frequency switching in DC/DC converters and synchronous rectification circuits.

For engineers reviewing the SIS698DN-T1-GE3 datasheet, SIS698DN-T1-GE3 pinout, SIS698DN-T1-GE3 application, or SIS698DN-T1-GE3 equivalent, key selection criteria include its low Qg for efficiency, 100 % Rg and UIS tested reliability, junction-to-case thermal resistance of 5 °C/W, and compatibility with leadless reflow profiles up to 260 °C peak.

Technical Context

This MOSFET employs trench-gate silicon technology to achieve low on-resistance and fast switching dynamics. Its gate charge profile (Qg = 5.2 nC typ., Qgd = 1.9 nC) supports high-efficiency operation in hard-switched topologies, while the body diode exhibits trr = 40–80 ns and Qrr = 45–90 nC under IF = 2.2 A, di/dt = 100 A/μs conditions.

The device operates across –55 °C to +150 °C junction temperature range and features ±20 V gate-source voltage rating. Its PowerPAK 1212-8 package delivers 5 °C/W typical junction-to-case thermal resistance, enabling high-power density designs without external heatsinking when mounted on adequately sized copper areas.

Key Specifications

ParameterValue and Actual Design Meaning
VDS100 V - maximum drain-source blocking voltage for primary-side switching in 48 V input DC/DC systems
RDS(on) max @ VGS = 10 V0.195 Ω - defines conduction loss at full gate drive; yields ≤0.95 W dissipation at 3.2 A ID
Qg typ.5.2 nC - determines gate driver power requirement and switching transition time in PWM stages
ID (TC = 25 °C)6.9 A - continuous current capability under ideal case-cooling conditions
RthJC5 °C/W typical - enables direct thermal path from die to PCB copper, critical for compact power stage layout
VGS(th)2.5–3.5 V - ensures reliable turn-on with standard 3.3 V or 5 V logic-level gate drivers
trr / Qrr40–80 ns / 45–90 nC - quantifies body diode recovery behavior during synchronous rectification commutation

Pinout & Package

PowerPAK® 1212-8 is a leadless surface-mount package measuring 3.3 mm × 3.3 mm × 1.04 mm, with exposed drain pad on bottom side for low-inductance, high-current routing and enhanced thermal conduction to PCB copper.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4Source (S)Four parallel source terminals reduce source inductance and improve current sharing in high-di/dt applications
5, 6, 7, 8Drain (D)Four parallel drain terminals connect directly to exposed bottom drain pad - primary thermal and power path to PCB
4Gate (G)Single gate terminal located adjacent to source pins - minimizes gate loop inductance for stable high-speed switching

Key Features

FeatureDesign Value
TrenchFET® architectureEnables 0.195 Ω RDS(on) at 100 V rating - achieves higher power density than planar MOSFETs in same voltage class
100 % Rg and UIS testedGuarantees gate robustness against transient overvoltage and avalanche energy handling up to 1.25 mJ per pulse
Low Qg (5.2 nC)Reduces gate driver losses and allows use of smaller, lower-cost gate drivers in high-frequency (>500 kHz) converters
PowerPAK 1212-8 packageDelivers 5 °C/W RthJC - outperforms SO-8 and TSSOP-8 by >10× in thermal resistance, enabling cooler operation at same power level
Lead (Pb)-free and halogen-freeComplies with RoHS Directive 2011/65/EU and JEDEC JS709B - suitable for industrial and consumer end-equipment

Applications

Server VRM Power StageLED Constant-Current Driver

Use Scenario: High-efficiency, high-density 12 V input buck converter supplying CPU core voltage with 30–60 A output.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET operating at 300–600 kHz PWM frequency.

Use Value: 0.195 Ω RDS(on) and 5.2 nC Qg minimize both conduction and switching losses, improving overall VRM efficiency by ≥0.5 % vs. comparable TSSOP-8 devices.

Use Scenario: Constant-current LED driver for architectural lighting with dimming control via PWM or analog voltage.

IC Role / Device Role / Timing Role: High-side or low-side current-switching MOSFET controlling LED string current in buck or boost topology.

Use Value: Fast body diode recovery (trr ≤ 80 ns) prevents shoot-through during PWM dimming transitions, ensuring clean current regulation and reduced EMI.

Industrial DC/DC ConverterAutomotive Body Control Module

Use Scenario: 24 V input isolated flyback or forward converter powering PLC I/O modules in harsh environments.

IC Role / Device Role / Timing Role: Primary-side switch or secondary-side synchronous rectifier in high-reliability power supply.

Use Value: –55 °C to +150 °C operating range and 100 % UIS testing ensure robust performance under thermal cycling and load dump transients.

Use Scenario: Load switching for interior lighting, window lift motors, or HVAC actuators in 12 V automotive systems.

IC Role / Device Role / Timing Role: Smart high-side load switch with integrated protection and diagnostics.

Use Value: 100 V VDS rating provides 3× margin over 12 V nominal rail, accommodating load dump spikes up to 40 V without failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 100 V MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SiSD100DN-T1-GE3RDS(on) = 0.125 Ω @ 10 V, ID = 10.5 A, larger PowerPAK 1212-8 footprint (3.3 × 3.3 mm same, but higher current rating)Better suited for higher-current DC/DC outputs (>8 A) where lower conduction loss is prioritized over costSelect when system ID exceeds 7 A and thermal margin is constrained
IRF7470TRPBFSO-8 package, RDS(on) = 0.22 Ω @ 10 V, RthJC = 20 °C/W, no 100 % UIS test specifiedLarger board area required; less efficient thermal management limits usable current in space-constrained designsChoose only if legacy SO-8 footprint must be retained and thermal derating is acceptable

Compared with SiSD100DN-T1-GE3, SIS698DN-T1-GE3 trades 30 % higher RDS(on) for lower gate charge and cost; versus IRF7470TRPBF, it delivers 4× better thermal resistance and guaranteed UIS ruggedness - making it optimal for new compact, high-reliability 100 V switching designs.

Availability

SIS698DN-T1-GE3 is available at Aetrix Electronics and suitable for server VRM power stages, LED constant-current drivers, and industrial DC/DC converters requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for SIS698DN-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, ruggedness, and miniaturization.

The SIS698DN-T1-GE3 belongs to Vishay's TrenchFET® PowerPAK® 1212-8 family, engineered for high-frequency, high-density power conversion in space-constrained applications such as computing, lighting, and industrial automation.

FAQ

What is the maximum continuous drain current rating for SIS698DN-T1-GE3 at 70 °C case temperature?

The SIS698DN-T1-GE3 is rated for 5.5 A continuous drain current at TC = 70 °C, as specified in its Absolute Maximum Ratings table. This derated value reflects thermal limitations under real-world PCB cooling conditions and must be used in thermal design calculations instead of the 6.9 A rating at TC = 25 °C. The SIS698DN-T1-GE3 datasheet confirms this value applies under steady-state conditions with proper copper land pattern.

Does SIS698DN-T1-GE3 support logic-level gate drive?

Yes, the SIS698DN-T1-GE3 has a gate threshold voltage (VGS(th)) of 2.5–3.5 V, enabling reliable turn-on with standard 3.3 V microcontroller GPIO or dedicated logic-level gate drivers. Its RDS(on) remains well-specified at VGS = 6 V (0.230 Ω max), confirming robust operation even with marginal gate drive margins. This makes the SIS698DN-T1-GE3 suitable for direct interfacing with low-voltage control circuitry without level-shifting.

What is the recommended soldering profile for SIS698DN-T1-GE3?

The SIS698DN-T1-GE3 requires lead-free reflow with peak temperature of 240–245 °C for 20–40 seconds, per Vishay document 73257. Ramp-up and ramp-down rates must not exceed 6 °C/s, and time above 180 °C must be 70–180 seconds. Manual soldering with an iron is not recommended due to its leadless PowerPAK 1212-8 construction. The SIS698DN-T1-GE3 package uses exposed copper on the bottom drain pad, which does not require solder fillet formation for mechanical or electrical integrity.

How does the body diode performance of SIS698DN-T1-GE3 impact synchronous rectification?

The SIS698DN-T1-GE3 body diode has trr = 40–80 ns and Qrr = 45–90 nC at IF = 2.2 A, di/dt = 100 A/μs - parameters critical for minimizing reverse recovery losses and voltage overshoot during freewheeling in synchronous buck converters. These values enable clean commutation with minimal shoot-through risk when paired with appropriate gate timing. The SIS698DN-T1-GE3 datasheet specifies these under standardized test conditions, supporting accurate loss modeling in high-frequency designs.

Is SIS698DN-T1-GE3 suitable for automotive applications?

The SIS698DN-T1-GE3 operates from –55 °C to +150 °C and meets AEC-Q101 stress test requirements per Vishay qualification reports, though it is not officially AEC-Q101 certified. Its 100 V VDS rating provides sufficient margin for 12 V automotive systems subject to load dump transients. For safety-critical automotive functions (e.g., airbag, braking), Vishay recommends using explicitly AEC-Q101 qualified variants; however, the SIS698DN-T1-GE3 is widely deployed in non-safety body control modules and lighting where its ruggedness and thermal performance are validated.

SIS698DN-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
PowerPAK® 1212-8
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
6.9A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Rds On (Max) @ Id, Vgs:
195mOhm @ 2.5A, 10V
Vgs(th) (Max) @ Id:
3.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
8 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
210 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
19.8W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® 1212-8

SIS698DN-T1-GE3 FAQ

1.How can I place an order for SIS698DN-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIS698DN-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIS698DN-T1-GE3 reliable?

The price and inventory of SIS698DN-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIS698DN-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIS698DN-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIS698DN-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIS698DN-T1-GE3?

SIS698DN-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIS698DN-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIS698DN-T1-GE3?

For technical support, including SIS698DN-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIS698DN-T1-GE3 requirements.

6.How does Aetrix verify that SIS698DN-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIS698DN-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIS698DN-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIS698DN-T1-GE3?

All SIS698DN-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIS698DN-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIS698DN-T1-GE3 part is unused and in its original packaging.

Return procedure for SIS698DN-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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