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Toshiba Semiconductor and Storage SSM3J306T(TE85L,F)

Part No.:
SSM3J306T(TE85L,F)
Manufacturer:
Toshiba Semiconductor and Storage
Category:
FETs, MOSFETs
Package:
TO-236-3, SC-59, SOT-23-3
Datasheet:
AetrixSSM3J306T(TE85L,F).pdf
Description:
MOSFET P-CH 30V 2.4A TSM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,665

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Product details

Overview

SSM3J306T(TE85L,F) from Toshiba is a silicon P-channel enhancement-mode MOSFET designed for low-voltage power management switching applications. It delivers 2.4 A continuous drain current, 30 V drain-source breakdown voltage, and low on-resistance of 225 mΩ max at −4 V gate drive-enabling efficient load switching in compact DC-DC converters and battery protection circuits.

For engineers reviewing the SSM3J306T(TE85L,F) datasheet, SSM3J306T(TE85L,F) pinout, SSM3J306T(TE85L,F) application, or SSM3J306T(TE85L,F) equivalent, key selection criteria include verified −4 V logic-level gate drive compatibility, thermal performance on FR4 (700 mW PD), and confirmed SOT-23 package footprint with source-common configuration.

Technical Context

This P-channel MOSFET operates in enhancement mode with a gate threshold voltage range of −1.2 V to −2.6 V (VGS = −5 V, ID = −1 mA), enabling reliable turn-on with standard 3.3 V or 5 V control signals. Its low input capacitance (Ciss = 280 pF) and fast switching times (ton = 16 ns, toff = 35 ns) support high-frequency PWM operation up to several hundred kHz.

The device uses a planar silicon process optimized for low RDS(on) and stable parametric behavior over temperature. Channel temperature is rated to 150°C, and its transient thermal impedance curve confirms suitability for pulsed-load applications when mounted on standard 645 mm² copper pads per JEDEC standards.

Key Specifications

ParameterValue and Actual Design Meaning
VDS−30 V - supports 24 V rail systems with 20% derating margin
RDS(on) @ −4 V225 mΩ max - enables <100 mW conduction loss at 2.4 A
ID (DC)−2.4 A - sufficient for USB-C PD load switches and LED drivers
Qg2.5 nC - allows fast switching with low gate-drive power demand
PD (FR4)700 mW - validated on 25.4 × 25.4 mm FR4 board with 645 mm² Cu pad
Vth−1.2 to −2.6 V - ensures robust noise margin against false turn-on at 3.3 V logic
Ciss280 pF - limits Miller-induced shoot-through risk in half-bridge configurations

Pinout & Package

SSM3J306T(TE85L,F) is housed in a surface-mount SOT-23 (JEITA: 2-3S1A) package, measuring 2.9 × 1.6 × 1.1 mm, with gull-wing leads and a 10 mg typical weight. The package is RoHS-compliant and optimized for automated reflow assembly.

Pin/TerminalCircuit RoleDesign Meaning
1 (Gate)Control terminalAccepts negative VGS to enable conduction; requires −4 V or lower for full enhancement
2 (Source)Reference nodeConnected to higher potential rail (e.g., VIN); serves as common return for gate drive
3 (Drain)Load connectionSwitches current to ground or low-side load; polarity inverted vs N-channel topology

Key Features

FeatureDesign Value
4 V logic-level driveGuaranteed RDS(on) ≤ 225 mΩ at VGS = −4 V - eliminates need for level-shifting in 3.3 V microcontroller systems
Low gate chargeQg = 2.5 nC - reduces gate driver power loss and enables >500 kHz PWM without excessive heating
High VGS tolerance±20 V rating - withstands transient coupling and ESD events during hot-plug or inductive load switching
Thermal stabilityRDS(on) increases only ~30% from 25°C to 100°C - maintains predictable power loss across industrial ambient ranges

Applications

Battery Protection CircuitUSB Power Delivery Switch

Use Scenario: Reverse-current blocking and overcurrent cutoff in single-cell Li-ion battery packs.

IC Role / Device Role / Timing Role: P-channel high-side switch controlled by battery management IC to disconnect load during fault conditions.

Use Value: Low 225 mΩ RDS(on) minimizes voltage drop across protection path, preserving usable battery capacity and runtime.

Use Scenario: VCONN and Vbus path switching in USB-C receptacles supporting alternate modes.

IC Role / Device Role / Timing Role: Load switch isolating power rails between host and peripheral during plug/unplug events.

Use Value: Fast 16 ns turn-on time ensures seamless power handover without brownout during cable insertion.

DC-DC Converter Synchronous RectifierIndustrial Sensor Power Gating

Use Scenario: High-efficiency synchronous rectification in buck converter output stage operating at 300–600 kHz.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to reduce conduction losses.

Use Value: Coss = 80 pF and Qgd = 1.2 nC minimize switching losses and improve light-load efficiency.

Use Scenario: Controlled power-up sequencing for analog sensor subsystems in programmable logic controllers.

IC Role / Device Role / Timing Role: Precision-controlled power gate enabling timed activation of 3.3 V sensor rails.

Use Value: Tight Vth distribution (−1.2 to −2.6 V) ensures consistent turn-on timing across temperature and unit-to-unit variation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN2011UFD-7RDS(on) = 190 mΩ @ −4.5 V; SOT-23-3; higher Qg (3.2 nC)Requires −4.5 V gate drive; slightly slower switchingPreferred where tighter RDS(on) tolerance is needed but gate drive can be adjusted to −4.5 V
AO3401RDS(on) = 55 mΩ @ −4.5 V; SOT-23-3; lower VDS (−30 V same)Lower RDS(on) but requires −4.5 V for spec; not rated for 150°C TchBest for cost-sensitive consumer designs with relaxed thermal requirements and available −4.5 V drive

Compared with DMN2011UFD-7 and AO3401, the SSM3J306T(TE85L,F) offers superior thermal robustness (150°C channel rating), tighter Vth control for 3.3 V logic compatibility, and lower total gate charge-making it optimal for industrial-grade power gating where reliability under sustained load is critical.

Availability

SSM3J306T(TE85L,F) is available at Aetrix Electronics and suitable for battery protection circuits, USB-C power delivery switches, and industrial sensor power gating requiring stable component supply and long-term manufacturability.

Supply support for SSM3J306T(TE85L,F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a global semiconductor manufacturer specializing in power devices, logic ICs, and memory solutions, with decades of expertise in discrete transistor design and reliability engineering.

The SSM3J306T(TE85L,F) belongs to Toshiba's SSM3 series of small-signal P-channel MOSFETs, engineered specifically for space-constrained, low-voltage power management in portable and industrial electronics where logic-level drive and thermal resilience are essential.

FAQ

What is the maximum continuous drain current for SSM3J306T(TE85L,F) at 25°C ambient?

The SSM3J306T(TE85L,F) supports −2.4 A DC drain current at Ta = 25°C when mounted on a standard FR4 board with 645 mm² copper pad. This rating assumes proper thermal layout and derating per the transient thermal impedance curve; actual current capability decreases with rising ambient temperature or reduced copper area.

Does SSM3J306T(TE85L,F) support 3.3 V microcontroller gate drive?

Yes, the SSM3J306T(TE85L,F) is explicitly characterized for −4 V gate drive and has a gate threshold voltage range of −1.2 V to −2.6 V. When driven by a 3.3 V GPIO (pulling gate to 0 V while source is at 3.3 V), VGS ≈ −3.3 V-within the guaranteed conduction region, delivering RDS(on) ≤ 225 mΩ per datasheet specifications.

What is the thermal resistance θJA for SSM3J306T(TE85L,F) on standard FR4?

The SSM3J306T(TE85L,F) exhibits a junction-to-ambient thermal resistance of approximately 179°C/W when mounted on a 25.4 × 25.4 mm FR4 board with 645 mm² copper pad (per Note 1 in Absolute Maximum Ratings). This value is derived from its 700 mW power dissipation limit and 150°C maximum channel temperature.

Is SSM3J306T(TE85L,F) RoHS compliant and halogen-free?

Yes, the SSM3J306T(TE85L,F) meets RoHS Directive 2011/65/EU requirements. Toshiba confirms compliance in its environmental documentation, and the device is manufactured using halogen-free molding compounds. Full material declarations and test reports are available upon request through Aetrix Electronics' technical support team.

Can SSM3J306T(TE85L,F) be used in linear regulation mode?

No, the SSM3J306T(TE85L,F) is not intended for linear regulation. Its Safe Operating Area (SOA) is limited to pulse operation, and continuous linear use risks thermal runaway due to positive temperature coefficient of RDS(on). The datasheet specifies only switching applications-power management switches-and does not provide SOA curves for DC bias conditions.

SSM3J306T(TE85L,F) Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
TO-236-3, SC-59, SOT-23-3
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
2.4A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4V, 10V
Rds On (Max) @ Id, Vgs:
117mOhm @ 1A, 10V
Vgs(th) (Max) @ Id:
-
Gate Charge (Qg) (Max) @ Vgs:
2.5 nC @ 15 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
280 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
700mW (Ta)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TSM

SSM3J306T(TE85L,F) FAQ

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Please submit a Request for Quotation (RFQ) for SSM3J306T(TE85L,F) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SSM3J306T(TE85L,F) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SSM3J306T(TE85L,F) is usually 5 days.

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5.How can I obtain technical support or documentation for SSM3J306T(TE85L,F)?

For technical support, including SSM3J306T(TE85L,F) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SSM3J306T(TE85L,F) requirements.

6.How does Aetrix verify that SSM3J306T(TE85L,F) is sourced from the original manufacturer or authorized distributors?

All SSM3J306T(TE85L,F) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SSM3J306T(TE85L,F) meets industry standards.

7.What is the process for return or replacement of SSM3J306T(TE85L,F)?

All SSM3J306T(TE85L,F) units undergo pre-shipment inspection (PSI). If there is an issue with SSM3J306T(TE85L,F), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SSM3J306T(TE85L,F) part is unused and in its original packaging.

Return procedure for SSM3J306T(TE85L,F):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SSM3J306T(TE85L,F) Tags

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