Toshiba Semiconductor and Storage SSM3K7002KF,LXHF
- Part No.:
- SSM3K7002KF,LXHF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
SSM3K7002KF,LXHF.pdf
- Description:
- SMOS NCH I: 0.4A, V: 60V, P: 270
- Quantity:
- Payment:

- Shipping:

Inventory:17,109
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Product details
Overview
SSM3K7002KF,LXHF from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel MOSFET designed for high-speed switching in low-power load control circuits. It features RDS(ON) = 1.05 Ω (typ.) at VGS = 10 V, 60 V VDSS, and AEC-Q101 qualification for automotive-grade reliability. It is commonly used in LED drivers, power management modules, and signal-level switching in compact consumer and industrial electronics.
For engineers reviewing the SSM3K7002KF,LXHF datasheet, SSM3K7002KF,LXHF pinout, SSM3K7002KF,LXHF application, or SSM3K7002KF,LXHF equivalent, key selection criteria include gate threshold voltage (Vth = 1.1–1.75 V), pulsed drain current capability (IDP = 1.2 A), thermal resistance constraints on FR4 boards, and compatibility with 3.3 V/5 V logic-level drive.
Technical Context
This discrete MOSFET operates in enhancement mode with a single N-channel structure optimized for fast turn-on/turn-off via low gate charge (Qg = 0.39 nC typ.). Its dynamic characteristics-Ciss = 26 pF, tr = 3.6 ns, tf = 5.5 ns-are specified under VDD = 30 V, ID = 200 mA, and RG = 50 Ω conditions, supporting efficient switching in DC-DC converters and PWM-controlled loads.
The device integrates an intrinsic body diode (VDSF = −0.79 V typ. at ID = −115 mA) and exhibits channel temperature-limited operation up to 150 °C. Absolute maximum ratings assume specific PCB mounting conditions: 645 mm² copper pad for PD = 900 mW, or 0.8 mm² × 3 pads for PD = 270 mW-critical for thermal design validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - supports input rails up to 48 V nominal systems with margin against transients |
| RDS(ON) @ VGS = 4.5 V | 1.2 Ω (typ.) - enables efficient 100 mA switching with <12 mW conduction loss |
| Vth | 1.1–1.75 V - ensures reliable turn-on with 3.3 V GPIO or microcontroller outputs |
| Qg | 0.39 nC (typ.) - reduces gate drive power and speeds switching in high-frequency PWM |
| ID (DC) | 400 mA - suitable for driving small solenoids, LEDs, or logic-level interface loads |
| Ciss | 26 pF (typ.) - minimizes Miller effect and improves noise immunity in dense layouts |
| Tch max | 150 °C - defines maximum junction temperature for derating calculations per JEDEC JESD51 |
Pinout & Package
SSM3K7002KF,LXHF is housed in the S-Mini package (TOSHIBA designation: 2-3F1S), a surface-mount, 3-pin plastic mold case with 12 mg typical weight and 0.65 mm pitch. The package supports automated placement and reflow soldering per JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control terminal; requires ESD-safe handling and ≤10 kΩ series resistor for robustness |
| 2 | Source (S) | Reference node for gate drive; connects to ground or low-side return path |
| 3 | Drain (D) | Switched output terminal; carries load current and must be routed with thermal relief |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive applications including body electronics and infotainment power stages |
| Low RDS(ON) at 4.5 V | Enables direct drive from standard logic without level-shifting circuitry |
| Fast switching (tr/tf < 6 ns) | Reduces transition losses in 100 kHz–1 MHz PWM designs |
| ESD-sensitive construction | Requires ANSI/ESD S20.20-compliant handling during assembly and test |
| Body diode with low VDSF | Supports freewheeling in inductive loads without external catch diode |
Applications
| LED Lighting Control | USB Power Switching |
|---|---|
Use Scenario: Driving white LED strings in portable lighting or automotive interior lamps using PWM dimming. IC Role / Device Role / Timing Role: Low-side switch controlling current path to LED cathodes with precise duty-cycle modulation. Use Value: RDS(ON) ≤ 1.2 Ω limits I²R loss to <12 mW at 100 mA, preserving battery life and enabling compact thermal design. | Use Scenario: Enabling/disabling VBUS power in USB 2.0 peripheral ports with overcurrent protection coordination. IC Role / Device Role / Timing Role: Load switch isolating downstream devices during fault conditions or sleep states. Use Value: Fast 3.6 ns rise time ensures clean power sequencing aligned with USB enumeration timing requirements. |
| IoT Sensor Node Power Gating | Automotive Door Module Actuation |
Use Scenario: Powering intermittent sensors (e.g., PIR, humidity) only during active measurement cycles to extend coin-cell battery life. IC Role / Device Role / Timing Role: High-efficiency load switch activated by MCU GPIO to gate supply to sensor subsystems. Use Value: Vth range of 1.1–1.75 V guarantees turn-on with 1.8 V or 3.3 V I/O, eliminating need for gate driver ICs. | Use Scenario: Controlling small DC motors or solenoids in power window, mirror, or lock actuators within door modules. IC Role / Device Role / Timing Role: AEC-Q101-qualified N-channel switch interfacing MCU outputs to inductive actuator coils. Use Value: 150 °C channel temperature rating and 1.2 A pulsed current support meet automotive under-hood thermal and surge requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2004LK-7 | RDS(ON) = 1.4 Ω @ 4.5 V; higher Qg (0.5 nC); same SOT-23 package | Not AEC-Q101 qualified; intended for commercial-grade consumer electronics only | Select when automotive qualification is unnecessary and cost sensitivity outweighs minor RDS(ON) penalty |
| AO3400 | RDS(ON) = 0.85 Ω @ 4.5 V; higher ID (5.7 A); same pinout but larger thermal pad | Higher power dissipation capability; requires modified PCB copper area for thermal performance | Select when higher continuous current (>400 mA) or lower conduction loss is required, accepting layout revision |
Compared with DMN2004LK-7 and AO3400, the SSM3K7002KF,LXHF offers certified automotive reliability at moderate RDS(ON), making it optimal for space-constrained, thermally managed modules where qualification and consistency outweigh raw performance.
Availability
SSM3K7002KF,LXHF is available at Aetrix Electronics and suitable for LED lighting control, USB power switching, and IoT sensor node power gating requiring stable component supply across production lifecycles.
Supply support for SSM3K7002KF,LXHF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with global distribution and automotive qualification expertise.
The SSM3K7002KF,LXHF belongs to Toshiba's S-Mini series of small-signal MOSFETs, engineered for high-reliability, low-voltage switching in space-constrained automotive and industrial control applications.
FAQ
What is the gate threshold voltage range for SSM3K7002KF,LXHF?
The SSM3K7002KF,LXHF has a gate threshold voltage (Vth) range of 1.1 V to 1.75 V at ID = 250 µA. This allows reliable turn-on with common 1.8 V, 3.3 V, and 5 V logic outputs. The typical value is 1.2 V, and variation across temperature is characterized in Fig. 8.6 of the official datasheet. Designers should verify gate drive margin under worst-case Vth and temperature conditions for their specific SSM3K7002KF,LXHF implementation.
Is SSM3K7002KF,LXHF suitable for automotive applications?
Yes, the SSM3K7002KF,LXHF is AEC-Q101 qualified, confirming its suitability for automotive applications such as body electronics, door modules, and infotainment power stages. The qualification applies specifically to the SSM3K7002KF,LXHF orderable part number, as noted in the "Orderable part number" table. Automotive use requires adherence to Toshiba's handling precautions, thermal derating guidelines, and board layout recommendations for reliability.
What is the maximum continuous drain current for SSM3K7002KF,LXHF?
The maximum continuous drain current (ID) for SSM3K7002KF,LXHF is 400 mA at Ta = 25 °C, assuming proper PCB thermal design. This rating assumes mounting on a 25.4 mm × 25.4 mm × 1.6 mm FR4 board with three 0.8 mm² copper pads. At elevated ambient temperatures or reduced copper area, derating is required per the Rth(ch-a) curves in the datasheet to prevent exceeding the 150 °C channel temperature limit.
Does SSM3K7002KF,LXHF include a body diode, and what is its forward voltage?
Yes, the SSM3K7002KF,LXHF includes an integrated body diode with a typical forward voltage (VDSF) of −0.79 V at ID = −115 mA and VGS = 0 V. This diode supports freewheeling current in inductive loads like relays or small motors. Its performance is pulse-tested and documented in Section 6.5 of the datasheet; designers should account for its reverse recovery behavior in high-frequency switching applications involving the SSM3K7002KF,LXHF.
What package type does SSM3K7002KF,LXHF use, and are there footprint considerations?
The SSM3K7002KF,LXHF uses the S-Mini package (TOSHIBA designation: 2-3F1S), a 3-pin SOT-23 variant with 0.65 mm lead pitch and 12 mg typical weight. Its pinout is Gate–Source–Drain (1–2–3). Footprint considerations include thermal pad clearance, solder mask defined pads per IPC-7351B, and ESD-safe handling during placement. The package is compatible with standard reflow profiles but requires attention to moisture sensitivity level (MSL) per Toshiba's packaging documentation for the SSM3K7002KF,LXHF.
SSM3K7002KF,LXHF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 400mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 1.5Ohm @ 100mA, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.6 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 40 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 270mW (Ta)
- Operating Temperature:
- 150°C
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- S-Mini
SSM3K7002KF,LXHF FAQ
1.How can I place an order for SSM3K7002KF,LXHF through Aetrix?
Please submit a Request for Quotation (RFQ) for SSM3K7002KF,LXHF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SSM3K7002KF,LXHF reliable?
The price and inventory of SSM3K7002KF,LXHF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SSM3K7002KF,LXHF is usually 5 days.
3.What payment methods are accepted for SSM3K7002KF,LXHF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SSM3K7002KF,LXHF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SSM3K7002KF,LXHF?
SSM3K7002KF,LXHF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SSM3K7002KF,LXHF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SSM3K7002KF,LXHF?
For technical support, including SSM3K7002KF,LXHF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SSM3K7002KF,LXHF requirements.
6.How does Aetrix verify that SSM3K7002KF,LXHF is sourced from the original manufacturer or authorized distributors?
All SSM3K7002KF,LXHF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SSM3K7002KF,LXHF meets industry standards.
7.What is the process for return or replacement of SSM3K7002KF,LXHF?
All SSM3K7002KF,LXHF units undergo pre-shipment inspection (PSI). If there is an issue with SSM3K7002KF,LXHF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SSM3K7002KF,LXHF part is unused and in its original packaging.
Return procedure for SSM3K7002KF,LXHF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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