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STMicroelectronics STB10LN80K5

Part No.:
STB10LN80K5
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTB10LN80K5.pdf
Description:
MOSFET N-CHANNEL 800V 8A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:890

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Product details

Overview

STB10LN80K5 from STMicroelectronics is an N-channel 800 V, 550 mΩ typ. (630 mΩ max.), 8 A MDmesh K5 Power MOSFET in D²PAK package, designed for high-voltage switching in industrial SMPS, PFC stages, and HV DC-DC converters where low conduction loss and ultra-low gate charge are critical.

For engineers reviewing the STB10LN80K5 datasheet, STB10LN80K5 pinout, STB10LN80K5 application, or STB10LN80K5 equivalent, key selection criteria include RDS(on) × area efficiency, 15 nC total gate charge, 100% avalanche-tested ruggedness, Zener-protected gate, and 50 V/ns MOSFET dv/dt ruggedness under 640 V operation.

Technical Context

This device implements ST's MDmesh K5 vertical superjunction architecture to achieve industry-leading figure of merit (RDS(on) × Qg = 9.45 Ω·nC) and 4.5 V/ns diode recovery dv/dt capability. Its Zener-protected gate structure enables robust ±30 V gate-source tolerance without external clamping.

The MOSFET delivers 240 mJ single-pulse avalanche energy at TJ = 25 °C with IAR = 2.7 A, and supports fast switching with td(off) = 28 ns and tf = 13 ns under 400 V/4 A resistive load conditions using 4.7 Ω gate resistance.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 800 V - Withstands full bridge or clamp-mode topologies up to 640 V bus voltage with margin.
RDS(on) max 630 mΩ at VGS = 10 V, ID = 4 A - Enables <1.3 W conduction loss at 8 A continuous drain current.
Qg 15 nC - Reduces gate drive power and allows use of smaller, lower-cost gate drivers.
EAS 240 mJ - Supports unclamped inductive switching without external snubbers in flyback or resonant converters.
RthJC 1.14 °C/W - Enables 96.5 W usable power dissipation at TC = 100 °C before reaching 150 °C junction limit.
dv/dt ruggedness 50 V/ns - Ensures reliable turn-off immunity against parasitic ringing in high-di/dt hard-switched topologies.
VSD 1.5 V at ISD = 4.5 A - Low forward drop improves synchronous rectification efficiency in LLC secondary side.

Pinout & Package

D²PAK (TO-263) package: 3-pin surface-mount outline with exposed drain tab (pin 2) for thermal and electrical connection; standard footprint per Figure 21 (DS10992 Rev 3, p.11); RoHS-compliant ECOPACK2 grade.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal accepting 0–10 V logic-level drive; Zener-protected to ±30 V for ESD and transient immunity.
2 (TAB/D) Drain (exposed tab) Main high-side power path; electrically and thermally connected to PCB copper pour for ≤1.14 °C/W junction-to-case transfer.
3 (S) Source Reference node for gate drive and current sensing; tied to source of upstream driver or ground-referenced control circuitry.

Key Features

Feature Design Value
Ultra-low FoM (RDS(on) × Qg) 9.45 Ω·nC - Delivers highest power density among 800 V MOSFETs in D²PAK, reducing board area by ≥20% vs prior-gen devices.
100% avalanche tested Single-pulse EAS = 240 mJ at TJ = 25 °C - Guarantees ruggedness in overvoltage fault conditions without derating.
Zener-protected gate ±30 V VGS rating - Eliminates need for external gate Zener clamps in noisy industrial environments.
Low Coss & Crss 43 pF Coss, 0.25 pF Crss - Minimizes capacitive losses and improves zero-voltage switching (ZVS) behavior in resonant topologies.

Applications

Industrial Switch-Mode Power Supplies Active PFC Front-End Stages

Use Scenario: Primary-side switch in 1–3 kW telecom and server SMPS operating at 100 kHz with 400 V DC bus.

IC Role / Device Role / Timing Role: High-voltage power switch handling full input power conversion; operates in hard-switched or quasi-resonant mode.

Use Value: 630 mΩ RDS(on) and 15 nC Qg reduce conduction + switching losses by 18% versus STW20NK80Z, improving full-load efficiency to >95%.

Use Scenario: Boost switch in 3.3 kW three-phase active front-end for motor drives and UPS systems.

IC Role / Device Role / Timing Role: Fast-turning, high-dv/dt tolerant switch managing 800 V peak line-to-line transients during regeneration.

Use Value: 50 V/ns MOSFET dv/dt ruggedness prevents false turn-on during rapid bus collapse, eliminating need for gate resistors >10 Ω.

High-Voltage DC-DC Converters Inductive Load Drivers (HV Solenoids/Valves)

Use Scenario: Primary switch in isolated 1.5 kV output DC-DC for EV battery management and grid-tied inverters.

IC Role / Device Role / Timing Role: High-breakdown, low-loss switch enabling compact transformer design via higher frequency operation (up to 250 kHz).

Use Value: 800 V VDS rating with 2.7 A repetitive avalanche current supports safe operation during output short-circuit events without desat protection.

Use Scenario: High-side driver for 48–400 V solenoid valves in industrial automation PLC I/O modules.

IC Role / Device Role / Timing Role: Robust, Zener-gated switch delivering precise on/off timing with minimal shoot-through risk during PWM control.

Use Value: 1.5 V VSD forward drop ensures <1.2 W self-heating at 8 A pulsed loads, enabling direct PCB mounting without heatsink.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STW20NK80Z Higher RDS(on) (850 mΩ), higher Qg (35 nC), no Zener gate protection Limited to lower-frequency (<65 kHz), lower-efficiency designs due to higher switching/conduction losses Select when cost sensitivity outweighs efficiency targets and gate protection is implemented externally.
IPP60R190C7 650 V rating, lower RDS(on) (190 mΩ), but only 650 V breakdown limits use in 800 V bus systems Not suitable for 800 V topologies; requires redesign of bus voltage and snubber networks Choose only if system bus is ≤650 V and higher current density (12 A) is required in same footprint.

Compared with STW20NK80Z and IPP60R190C7, STB10LN80K5 uniquely combines 800 V rating, Zener gate protection, and sub-10 Ω·nC FoM-making it the sole option for space-constrained, high-efficiency 800 V switching where gate reliability and avalanche margin are non-negotiable.

Availability

STB10LN80K5 is available at Aetrix Electronics and suitable for industrial SMPS, active PFC front-ends, and high-voltage DC-DC converters requiring stable component supply, long-lifecycle support, and traceable sourcing for production ramp.

Supply support for STB10LN80K5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.

This device belongs to ST's MDmesh K5 high-voltage power MOSFET product line, engineered specifically for high-efficiency, high-power-density switching in 600–1000 V industrial power conversion systems.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STB10LN80K5 supports 5 A continuous drain current at TC = 100 °C, as specified in Table 1 (Absolute Maximum Ratings). This reflects thermal derating from its 8 A rating at 25 °C, based on RthJC = 1.14 °C/W and TJ(max) = 150 °C. Operation above 5 A at 100 °C case requires forced cooling or reduced duty cycle to maintain junction temperature within limits.

Does this MOSFET include integrated body diode recovery optimization?

Yes-the STB10LN80K5 features optimized source-drain diode characteristics with trr = 350 ns (TJ = 25 °C) and Qrr = 3.9 µC, verified under ISD = 8 A, di/dt = 100 A/µs, and VDD = 60 V. Its low reverse recovery charge and soft recovery profile reduce EMI and switching losses in hard-commutated circuits like boost PFC.

Can STB10LN80K5 be used in avalanche mode for energy clamping?

Yes-this device is 100% avalanche tested with EAS = 240 mJ (single pulse, TJ = 25 °C, IAR = 2.7 A, VDD = 50 V). It is qualified for controlled unclamped inductive switching in flyback or forward converters where energy must be safely absorbed in the silicon rather than dissipated externally.

Is the D²PAK package lead-free and RoHS compliant?

Yes-the STB10LN80K5 is manufactured in ECOPACK2-compliant D²PAK (TO-263) packaging, meeting RoHS Directive 2011/65/EU and REACH SVHC requirements. The device uses matte tin plating on leads and conforms to JEDEC J-STD-020 moisture sensitivity level (MSL) 3 for surface-mount assembly.

STB10LN80K5 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ K5
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
800 V
Current - Continuous Drain (Id) @ 25°C:
8A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
630mOhm @ 4A, 10V
Vgs(th) (Max) @ Id:
5V @ 100µA
Gate Charge (Qg) (Max) @ Vgs:
15 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
427 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
110W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

STB10LN80K5 FAQ

1.How can I place an order for STB10LN80K5 through Aetrix?

Please submit a Request for Quotation (RFQ) for STB10LN80K5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STB10LN80K5 reliable?

The price and inventory of STB10LN80K5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB10LN80K5 is usually 5 days.

3.What payment methods are accepted for STB10LN80K5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB10LN80K5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STB10LN80K5?

STB10LN80K5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STB10LN80K5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STB10LN80K5?

For technical support, including STB10LN80K5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB10LN80K5 requirements.

6.How does Aetrix verify that STB10LN80K5 is sourced from the original manufacturer or authorized distributors?

All STB10LN80K5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB10LN80K5 meets industry standards.

7.What is the process for return or replacement of STB10LN80K5?

All STB10LN80K5 units undergo pre-shipment inspection (PSI). If there is an issue with STB10LN80K5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STB10LN80K5 part is unused and in its original packaging.

Return procedure for STB10LN80K5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STB10LN80K5 Tags

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