STMicroelectronics STB190NF04T4

Overview

STB190NF04 from STMicroelectronics is an N-channel enhancement-mode Power MOSFET in D2PAK package, rated for 40 V drain-source voltage, 0.0039 Ω typical R_DS(on) at V_GS = 10 V and 95 A, and 120 A continuous drain current at T_C = 25 °C. It delivers high-current switching in motor drives and DC-DC converters with rugged avalanche capability (860 mJ single-pulse E_AS) and standard gate threshold (2–4 V).

For engineers reviewing the STB190NF04 datasheet, STB190NF04 pinout, STB190NF04 application, or STB190NF04 equivalent, key selection criteria include low on-resistance under 10 V drive, 480 A pulsed drain current capability, thermal resistance of 0.48 °C/W (junction-to-case), and D2PAK tape-and-reel packaging for automated assembly.

Technical Context

This STripFET™ III device uses a strip-based "Single Feature Size™" process to achieve high cell density and low R_DS(on), with fully characterized dynamic parameters including 130 nC total gate charge and 5800 pF input capacitance at V_DS = 25 V. Its 7 V/ns dv/dt rating supports fast-switching inductive loads without spurious turn-on.

The integrated body diode exhibits 1.3 V forward voltage at 120 A and 90 ns reverse recovery time under harsh conditions (T_j = 150 °C, di/dt = 100 A/µs), enabling reliable synchronous rectification and freewheeling in high-efficiency power stages.

Key Specifications

Pinout & Package

D2PAK (TO-263) package: surface-mount, isolated tab (drain), three terminals-Drain (Tab), Source (Pin 1), Gate (Pin 2). Pin 3 is unused (thermal pad only, electrically tied to Drain).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 40 V power MOSFET applications.

Compared with IRF1404PBF and IXTH120N04S, STB190NF04 offers superior thermal performance (0.48 °C/W), RoHS-compliant D2PAK tape-and-reel packaging, and tighter R_DS(on) distribution-making it optimal for high-volume, space-constrained, and thermally demanding automotive and industrial power designs.

Availability

STB190NF04 is available at Aetrix Electronics and suitable for motor drive inverters, DC-DC synchronous rectifiers, and industrial power supply primary switches requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for STB190NF04 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs, discrete devices, and MEMS sensors for industrial, automotive, and consumer markets.

The STripFET™ III product line targets high-efficiency power conversion systems, emphasizing low R_DS(on), rugged avalanche performance, and manufacturability across automotive-grade and industrial-grade MOSFETs.

FAQ

Is STB190NF04 suitable for 3.3 V microcontroller gate drive?

Yes. With a gate threshold voltage range of 2–4 V and guaranteed turn-on at V_GS = 4.5 V, STB190NF04 achieves full enhancement using 3.3 V logic when paired with a low-impedance gate driver stage. However, R_DS(on) increases to ~0.0055 Ω at V_GS = 4.5 V, so thermal design must account for higher conduction loss.

What is the maximum PCB copper area needed to sustain 120 A continuous current?

Per Figure 14 in the datasheet, sustaining 120 A continuously at T_C = 100 °C requires ≥400 cm² of 2 oz copper on the top layer, directly connected to the D2PAK thermal pad. For 100 A at 85 °C case temperature, ≥250 cm² is sufficient with 1.5 oz copper and thermal vias to inner ground planes.

Does STB190NF04 have integrated ESD protection on the gate?

No. The device lacks on-chip gate ESD protection structures. External 10 kΩ gate resistor and 12 V Zener clamp between gate and source are recommended to prevent damage during handling and PCB assembly, especially in automated SMT lines with static-prone environments.

Can STB190NF04 replace STP190NF04 in existing TO-220 designs?

No direct replacement. STB190NF04 uses D2PAK (surface-mount) while STP190NF04 uses TO-220 (through-hole). Mechanical footprint, thermal interface, and solder reflow profile differ significantly. A board redesign is required to accommodate the D2PAK's thermal pad and smaller outline, though electrical specs are functionally identical.