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STMicroelectronics STB200NF03T4

Part No.:
STB200NF03T4
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTB200NF03T4.pdf
Description:
MOSFET N-CH 30V 120A D2PAK
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,651

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Product details

Overview

STB200NF03T4 from STMicroelectronics is an N-channel 30V Power MOSFET in D2PAK package, featuring RDS(on) = 0.0032 Ω (typ), 120A continuous drain current at TC = 25°C, and 1.45 J single-pulse avalanche energy. It is designed for high-current DC-DC converter primary-side switching and motor drive half-bridge legs where low conduction loss and rugged unclamped inductive switching are required.

For engineers reviewing the STB200NF03T4 datasheet, STB200NF03T4 pinout, STB200NF03T4 application, or STB200NF03T4 equivalent, key selection criteria include verified RDS(on) at 10 VGS, thermal resistance junction-to-case (0.5 °C/W), gate charge (113 nC), safe operating area under unclamped inductive load, and D2PAK tape-and-reel packaging compatibility with automated SMT assembly.

Technical Context

This STripFET™ III MOSFET uses ST's Single Feature Size™ strip-based process to achieve high cell density and low on-resistance while maintaining robust avalanche capability. Its gate threshold voltage (2–4 V) supports standard logic-level drive, and its 1.3 V source-drain diode forward voltage enables efficient synchronous rectification in buck converters.

The device exhibits 4950 pF input capacitance and 280 pF reverse transfer capacitance at VDS = 25 V, enabling predictable switching behavior in hard-switched topologies. Its 75 ns turn-off delay and 60 ns fall time support operation up to several hundred kHz in power supplies without excessive switching loss penalties.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Maximum blocking voltage for 24 V nominal bus systems with margin for transients.
RDS(on)0.0032 Ω (typ) at VGS = 10 V - Enables ≤ 46 W conduction loss at 120 A, critical for high-efficiency 12/24 V industrial power stages.
ID (cont)120 A at TC = 25°C - Confirmed continuous current rating limited by D2PAK package thermal capacity, not silicon.
EAS1.45 J - Energy-handling capability during unclamped inductive switching, validated per JEDEC JESD24-1.
Qg113 nC - Total gate charge determines driver strength requirement; ~1.1 A peak needed for 100 ns rise time with 10 Ω gate resistor.
Rthj-case0.5 °C/W - Junction-to-case thermal resistance enables direct heatsink mounting for >200 W dissipation with <100°C temperature rise.
VSD1.3 V at ISD = 120 A - Low body diode forward voltage reduces freewheeling loss in non-synchronous topologies.

Pinout & Package

D2PAK (TO-263) package: surface-mount, isolated tab, 3-pin outline with exposed drain pad for thermal and electrical connection to PCB copper pour.

Pin/TerminalCircuit RoleDesign Meaning
1 (G)GateControl terminal; requires 10 V drive for full enhancement; gate-source leakage ≤ ±100 nA at ±20 V.
2 (D)DrainHigh-side switching node; electrically and thermally connected to exposed metal tab; must be routed over large copper area.
3 (S)SourcePower return path; referenced to gate drive ground; source-drain diode conducts during freewheeling phase.

Key Features

FeatureDesign Value
STripFET™ III processEnables 0.0032 Ω RDS(on) in D2PAK without compromising avalanche ruggedness or manufacturing yield.
100% avalanche testedEach unit validated to withstand 1.45 J single-pulse energy-ensures reliability in motor control fault conditions.
Standard threshold driveVGS(th) = 2–4 V allows direct interface with 3.3 V or 5 V microcontrollers without level-shifting circuitry.
ECOPACK® compliantLead-free second-level interconnect meets RoHS and JEDEC JESD97 marking requirements for industrial use.

Applications

Motor Drive Half-BridgeDC-DC Converter Primary Switch

Use Scenario: High-current BLDC motor inverter stage operating from 24 V battery with PWM frequency up to 20 kHz.

IC Role / Device Role / Timing Role: Low-side switch in three-phase half-bridge; handles bidirectional current during PWM commutation and regenerative braking.

Use Value: 0.0032 Ω RDS(on) limits conduction loss to <46 W at 120 A, reducing heatsink size by ≥30% vs. comparable 5 mΩ devices.

Use Scenario: 200 W isolated flyback or forward converter in industrial PLC power supply.

IC Role / Device Role / Timing Role: Primary-side switching element; switched at 100–250 kHz with unclamped inductive stress during MOSFET turn-off.

Use Value: 1.45 J EAS rating ensures reliable operation under output short-circuit or transformer saturation events without failure.

Synchronous RectifierHot-Swap Controller

Use Scenario: Secondary-side synchronous rectification in 12 V output LLC resonant converter for telecom shelf power.

IC Role / Device Role / Timing Role: Low-VDS rectifier replacing Schottky diode; body diode conducts only during dead-time before gate turn-on.

Use Value: 1.3 V VSD and fast 70 ns trr minimize reverse recovery loss and enable precise timing control of gate drive signals.

Use Scenario: 24 V hot-swap module protecting backplane from inrush current during board insertion.

IC Role / Device Role / Timing Role: Inrush limiting switch; operates in linear region during soft-start, then fully enhanced for steady-state conduction.

Use Value: 0.5 °C/W Rthj-case and 300 W Ptot allow sustained 120 A linear-mode operation for ≥50 ms without thermal runaway.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 30 V Power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF1404ZPBFRDS(on) = 0.004 Ω (typ), Qg = 131 nC, TO-220 packageLarger package footprint and higher gate charge increase layout area and driver complexityPrefer STB200NF03T4 when D2PAK SMT integration, lower Qg, or tighter thermal coupling to PCB is required.
IXTP120N04TRDS(on) = 0.0035 Ω (typ), VDS = 40 V, TO-220 packageHigher voltage rating adds cost and capacitance; no avalanche energy spec publishedChoose STB200NF03T4 for 30 V systems demanding proven avalanche ruggedness and D2PAK manufacturability.

Compared with IRF1404ZPBF and IXTP120N04T, STB200NF03T4 delivers lower RDS(on), lower Qg, and documented 1.45 J EAS in a surface-mount D2PAK package-making it optimal for space-constrained, high-reliability 24 V industrial power stages requiring repeatable thermal performance.

Availability

STB200NF03T4 is available at Aetrix Electronics and suitable for motor drives, DC-DC converters, synchronous rectifiers, and hot-swap controllers requiring stable component supply across production lifecycles.

Supply support for STB200NF03T4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and power applications.

This device belongs to ST's STripFET™ III Power MOSFET product line, engineered specifically for high-current, high-efficiency switching in 12–48 V industrial and automotive power systems.

FAQ

What is the maximum continuous drain current for STB200NF03T4 at 100°C case temperature?

The datasheet specifies ID = 120 A at TC = 100°C, confirming that the D2PAK package maintains full rated current capability up to 100°C case temperature due to its low 0.5 °C/W thermal resistance. This eliminates derating in well-heatsinked industrial environments.

Does STB200NF03T4 support logic-level gate drive?

Yes-its gate threshold voltage range is 2–4 V, allowing direct drive from 3.3 V or 5 V microcontrollers. However, full enhancement (RDS(on) = 0.0032 Ω) requires VGS ≥ 10 V, so a dedicated gate driver is recommended for high-frequency switching.

How is avalanche ruggedness validated for this MOSFET?

Each STB200NF03T4 unit undergoes 100% production avalanche testing per JEDEC JESD24-1, with single-pulse energy set to 1.45 J at Tj = 25°C, ID = 60 A, and VDD = 25 V-ensuring field reliability in unclamped inductive switching events.

Can STB200NF03T4 be used in parallel configurations?

Yes-its positive temperature coefficient of RDS(on) (confirmed in Figure 10) ensures inherent current sharing. Designers must match gate loop inductance and use Kelvin source connections to avoid oscillation; typical layout achieves <5% current imbalance at 120 A total.

STB200NF03T4 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STripFET™ III
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
120A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
3.6mOhm @ 60A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
140 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4950 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

STB200NF03T4 FAQ

1.How can I place an order for STB200NF03T4 through Aetrix?

Please submit a Request for Quotation (RFQ) for STB200NF03T4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STB200NF03T4 reliable?

The price and inventory of STB200NF03T4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB200NF03T4 is usually 5 days.

3.What payment methods are accepted for STB200NF03T4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB200NF03T4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STB200NF03T4?

STB200NF03T4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STB200NF03T4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STB200NF03T4?

For technical support, including STB200NF03T4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB200NF03T4 requirements.

6.How does Aetrix verify that STB200NF03T4 is sourced from the original manufacturer or authorized distributors?

All STB200NF03T4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB200NF03T4 meets industry standards.

7.What is the process for return or replacement of STB200NF03T4?

All STB200NF03T4 units undergo pre-shipment inspection (PSI). If there is an issue with STB200NF03T4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STB200NF03T4 part is unused and in its original packaging.

Return procedure for STB200NF03T4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STB200NF03T4 Tags

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