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STMicroelectronics STB22N60DM6

Part No.:
STB22N60DM6
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTB22N60DM6.pdf
Description:
MOSFET N-CH 600V 15A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,565

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Product details

Overview

STB22N60DM6 from STMicroelectronics is a high-voltage N-channel Power MOSFET in the MDmesh DM6 series, featuring 600 V VDS, 240 mΩ max RDS(on) at 10 V VGS, and 15 A continuous drain current at TC = 25 °C. It integrates a fast-recovery body diode with 88 ns trr (Tj = 25 °C) and 0.299 µC Qrr, enabling high-efficiency ZVS phase-shift converters and bridge topologies.

For engineers reviewing the STB22N60DM6 datasheet, STB22N60DM6 pinout, STB22N60DM6 application, or STB22N60DM6 equivalent, key selection criteria include its 100 V/ns dv/dt ruggedness, 20.6 nC total gate charge, 1.6 V forward diode voltage at 15 A, 100% avalanche tested rating (320 mJ EAS), and D²PAK thermal resistance of 0.96 °C/W.

Technical Context

This MOSFET employs ST's MDmesh DM6 silicon process, optimized for ultra-low Qrr and trr while maintaining industry-leading RDS(on)/area. Its Zener-protected gate structure ensures ±25 V VGS tolerance and robust ESD immunity.

The device delivers 100 V/ns MOSFET dv/dt ruggedness and 100 V/ns diode recovery dv/dt capability under defined conditions (VDD = 400 V, ISD ≤ 15 A). Its Coss,eq of 157 pF supports soft-switching performance in resonant topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - Withstands DC bus voltages up to 480 V in ZVS operation with margin
RDS(on) max 240 mΩ at VGS = 10 V, ID = 7.5 A - Enables low conduction loss in 15 A switching applications
Qg 20.6 nC - Reduces gate drive power and enables faster switching with moderate gate resistance
trr 88 ns at Tj = 25 °C - Minimizes diode reverse recovery loss in hard- and soft-switched bridges
RthJC 0.96 °C/W - Supports 130 W dissipation with efficient heatsinking in D²PAK package
EAS 320 mJ - Confirmed single-pulse avalanche energy for unclamped inductive load robustness
dv/dt ruggedness 100 V/ns - Sustains rapid voltage transients without spurious turn-on in high-noise environments

Pinout & Package

Package: D²PAK (TO-263) type A - Surface-mount power package with exposed drain tab for thermal and electrical connection; 3-pin configuration with standard footprint per Figure 20 (DS12932 Rev 3).

Pin/Terminal Circuit Role Design Meaning
D (Tab) Drain terminal / Heat sink interface Electrically connected to internal die drain; requires insulated mounting or grounded heatsink
G (Pin 1) Gate control input Zener-protected input accepting ±25 V; 5.8 Ω intrinsic gate resistance affects drive loop damping
S (Pin 3) Source reference and return path Common node for gate drive return and current sensing; low-inductance layout critical for dv/dt stability

Key Features

Feature Design Value
Fast-recovery body diode trr = 88 ns and Qrr = 0.299 µC enable reduced switching loss in synchronous rectification and LLC resonant converters
Low RDS(on) per area 200 mΩ typ. at 10 V VGS improves power density vs prior MDmesh generations without increasing die size
100% avalanche tested Each unit validated for 3.5 A repetitive avalanche current and 320 mJ single-pulse energy per JEDEC JESD24-11
Extremely high dv/dt ruggedness 100 V/ns rating verified under VDS ≤ 480 V ensures reliable operation in high-frequency half-bridge snubberless designs
Zener-protected gate Integrated gate oxide protection sustains ±25 V VGS stress, eliminating need for external clamping in most gate driver circuits

Applications

Industrial Motor Drives Server PSU Primary Switches

Use Scenario: 3-phase inverter stage in 5–10 kW servo drives operating at 16–20 kHz PWM frequency.

IC Role / Device Role / Timing Role: High-side/low-side switching element in IGBT replacement topology with active freewheeling via integrated diode.

Use Value: 88 ns trr and 100 V/ns dv/dt ruggedness reduce shoot-through risk and EMI during commutation at elevated bus voltages.

Use Scenario: Primary-side switch in 80+ Titanium-certified 3.3 kW server PSUs using asymmetric half-bridge ZVS architecture.

IC Role / Device Role / Timing Role: Main power switch handling 400 V DC input with zero-voltage turn-on enabled by low Qrr and Coss,eq.

Use Value: 0.299 µC Qrr minimizes dead-time losses and improves efficiency above 96% at full load.

EV Onboard Chargers High-Frequency Induction Heaters

Use Scenario: AC/DC PFC boost switch in 11 kW bidirectional OBCs operating at 100–150 kHz with interleaved topology.

IC Role / Device Role / Timing Role: Fast-switching boost FET requiring low Qg and stable RDS(on) over temperature for digital current-mode control.

Use Value: 20.6 nC Qg and 1.6 V VSD support precise average-current regulation with minimal gate drive overhead.

Use Scenario: Half-bridge inverter in 50–100 kHz induction heating systems driving 10–30 kW loads with variable frequency control.

IC Role / Device Role / Timing Role: Resonant switch subjected to high di/dt and voltage reversal; relies on body diode for freewheeling.

Use Value: 1000 A/µs di/dt capability and 100 V/ns dv/dt rating ensure reliable operation under extreme transient stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STW22N60DM6 TO-247 package; identical silicon die and electrical specs; higher RthJC (0.75 °C/W) but larger heatsink interface Better suited for forced-air-cooled industrial inverters where mechanical mounting flexibility outweighs PCB space constraints Select when thermal interface design favors through-hole mounting and higher peak power cycling is required
IPP60R190C7 650 V rating; 190 mΩ RDS(on); CoolMOS C7 technology; lower Qg (17.5 nC) but higher Qrr (0.42 µC) Preferred in high-frequency SMPS where gate drive loss dominates, but less optimal in ZVS topologies demanding ultra-low Qrr Choose for >200 kHz flyback or active-clamp forward designs; avoid where trr < 100 ns is mandatory

Compared with STW22N60DM6 and IPP60R190C7, STB22N60DM6 offers the lowest Qrr among 600 V-class devices in surface-mount form, making it uniquely suitable for ZVS and resonant converters where diode recovery loss dominates efficiency.

Availability

STB22N60DM6 is available at Aetrix Electronics and suitable for industrial motor drives, server power supplies, and EV onboard chargers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for STB22N60DM6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

This device belongs to the MDmesh DM6 high-voltage power MOSFET product line, engineered specifically for high-efficiency resonant and soft-switching topologies in datacenter, industrial, and EV infrastructure applications.

FAQ

What is the maximum recommended gate resistor value for reliable switching?

A 4.7 Ω gate resistor is specified in the datasheet test circuit for resistive load switching. For ZVS operation, values between 2.2 Ω and 10 Ω balance turn-on speed against ringing suppression; values above 15 Ω increase switching time and may compromise dv/dt immunity due to slower gate voltage slew rate.

Can STB22N60DM6 replace STP22N60DM6 in existing designs?

Yes, STB22N60DM6 is the D²PAK variant of the same MDmesh DM6 die used in STP22N60DM6 (TO-220FP). Electrical parameters are identical, but thermal performance differs: RthJC is 0.96 °C/W vs 1.25 °C/W, and PCB layout must accommodate the D²PAK footprint and thermal pad requirements.

Is the body diode suitable for synchronous rectification?

No - the integrated body diode is optimized for fast recovery in freewheeling roles, not bidirectional conduction. Its 1.6 V forward voltage and 88 ns trr make it unsuitable for synchronous rectification, where discrete Schottky or GaN FETs with sub-0.5 V VF are preferred.

What is the safe operating area (SOA) limitation at 100 °C case temperature?

At TC = 100 °C, the continuous drain current is derated to 9.5 A. The SOA curve (Figure 1) shows pulse-width-limited operation beyond 1 ms; for 10 ms pulses, maximum VDS drops to ~200 V at 15 A, constrained by RDS(on) heating and thermal runaway limits.

STB22N60DM6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ M6
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
15A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
240mOhm @ 7.5A, 10V
Vgs(th) (Max) @ Id:
4.75V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
20.6 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
800 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
130W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

STB22N60DM6 FAQ

1.How can I place an order for STB22N60DM6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STB22N60DM6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STB22N60DM6 reliable?

The price and inventory of STB22N60DM6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB22N60DM6 is usually 5 days.

3.What payment methods are accepted for STB22N60DM6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB22N60DM6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STB22N60DM6?

STB22N60DM6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STB22N60DM6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STB22N60DM6?

For technical support, including STB22N60DM6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB22N60DM6 requirements.

6.How does Aetrix verify that STB22N60DM6 is sourced from the original manufacturer or authorized distributors?

All STB22N60DM6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB22N60DM6 meets industry standards.

7.What is the process for return or replacement of STB22N60DM6?

All STB22N60DM6 units undergo pre-shipment inspection (PSI). If there is an issue with STB22N60DM6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STB22N60DM6 part is unused and in its original packaging.

Return procedure for STB22N60DM6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STB22N60DM6 Tags

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