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STMicroelectronics STB300NH02L

Part No.:
STB300NH02L
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTB300NH02L.pdf
Description:
MOSFET N-CH 24V 120A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,795

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Product details

Overview

STB300NH02L from STMicroelectronics is an N-channel 24 V, 120 A Power MOSFET in D²PAK (TO-263) package, featuring <1.8 mΩ RDS(on) at VGS = 10 V and 80 A, 109.4 nC total gate charge, and optimized for high-current OR-ing and DC/DC converter applications.

For engineers reviewing the STB300NH02L datasheet, STB300NH02L pinout, STB300NH02L application, or STB300NH02L equivalent, key selection criteria include low conduction loss (<1.8 mΩ), low-profile D²PAK thermal performance (Rthj-case = 0.5 °C/W), avalanche ruggedness (1.6 J EAS), and suitability for high-efficiency power path management in redundant supply systems.

Technical Context

This MOSFET employs ST's STripFET™ III process to minimize RDS(on) × Qg product-the industry benchmark for switching efficiency-enabling reduced conduction and switching losses simultaneously. Its 24 V VDS rating and 120 A continuous drain current support high-current, low-voltage power rails.

The device integrates a robust body diode with 120 A forward current capability and fast reverse recovery (trr = 63 ns at Tj = 25°C), making it suitable for synchronous rectification and OR-ing topologies where bidirectional conduction and low VSD (1.3 V) are critical.

Key Specifications

ParameterValue and Actual Design Meaning
VDS24 V - Maximum blocking voltage for 12 V and 24 V bus systems
RDS(on)<1.8 mΩ @ VGS=10 V, ID=80 A - Enables sub-200 W conduction loss at 120 A
ID (cont)120 A @ TC=25°C - Supports high-current power distribution without derating
Qg109.4 nC - Low gate drive energy requirement for efficient PWM control
Rthj-case0.5 °C/W - Enables high-power dissipation with minimal junction-to-case temperature rise
EAS1.6 J - Withstands single-pulse unclamped inductive energy in OR-ing fault events

Pinout & Package

STB300NH02L is housed in a surface-mount D²PAK (TO-263) package with exposed drain pad for enhanced thermal conduction and low parasitic inductance. The package complies with ECOPACK® environmental standards and JEDEC JESD97 marking requirements.

Pin/TerminalCircuit RoleDesign Meaning
1 (Gate)Control inputHigh-impedance MOS gate requiring ≤±20 V bias; drives with 4.4 Ω typical gate resistance
2 (Source)Power return referenceCommon source node for load current return; tied to PCB ground plane for low-inductance layout
3 (Drain)Power output / high-side connectionExposed copper pad on underside-must be soldered to large copper pour for thermal and current handling

Key Features

FeatureDesign Value
RDS(on) × Qg benchmarkIndustry-leading figure-of-merit enabling simultaneous reduction of conduction and switching losses
Low-profile D²PAK15.85 mm max height enables compact board stacking and improved airflow in dense power modules
Robust body diode120 A continuous / 640 A pulsed source-drain current with 1.3 V forward drop at 120 A
Avalanche-ratedRated for 60 A non-repetitive avalanche current and 1.6 J single-pulse energy-supports fault-tolerant OR-ing

Applications

Server Redundant Power SuppliesIndustrial DC/DC Converters

Use Scenario: Dual 12 V input supplies feeding a common load with automatic failover during supply loss.

IC Role / Device Role / Timing Role: High-side OR-ing switch controlling power path selection via gate-controlled conduction.

Use Value: <1.8 mΩ RDS(on) minimizes voltage drop and heat generation during parallel operation, improving system efficiency and reliability.

Use Scenario: Primary-side synchronous rectifier in isolated 24 V–12 V step-down converters for factory automation controllers.

IC Role / Device Role / Timing Role: Low-side power switch in synchronous buck topology with fast turn-on/off timing (td(on) = 18 ns).

Use Value: 109.4 nC Qg and 26.4 nC Qgd enable clean, low-loss switching at >300 kHz, reducing EMI and filter size.

Telecom Line CardsHigh-Current Hot-Swap Circuits

Use Scenario: Backplane power rail protection on carrier-grade line cards with hot-plug capability.

IC Role / Device Role / Timing Role: Inrush-limiting and fault-isolation switch placed between backplane and card-level power domain.

Use Value: 480 A pulsed drain current (IDM) and 0.5 °C/W Rthj-case sustain transient overloads during insertion without thermal runaway.

Use Scenario: Hot-swap controller companion MOSFET in 48 V intermediate bus modules for data center racks.

IC Role / Device Role / Timing Role: Main power path switch controlled by external hot-swap IC to manage inrush and short-circuit response.

Use Value: Fast reverse recovery (trr = 63 ns) and low Qrr (85 nC) prevent shoot-through and oscillation during dynamic load transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP300NH02LRDS(on) = <2.2 mΩ (TO-220); higher Rthj-case = 0.65 °C/WThrough-hole mounting; lower power density; less suitable for space-constrained OR-ingSelect when TO-220 mechanical compatibility or manual assembly is required
IRF1404ZPBFVDS = 40 V; RDS(on) = 3.7 mΩ; Qg = 131 nC; not avalanche-ratedHigher voltage margin but significantly higher conduction loss and no EAS ratingAcceptable only if 24 V system margin allows higher RDS(on) and fault energy is externally clamped

Compared with STP300NH02L and IRF1404ZPBF, STB300NH02L delivers superior power density, lower thermal resistance, and guaranteed avalanche ruggedness-making it the preferred choice for high-reliability, high-current OR-ing and DC/DC converter designs where board space and fault tolerance are critical.

Availability

STB300NH02L is available at Aetrix Electronics and suitable for server redundant power supplies, industrial DC/DC converters, and telecom line card applications requiring stable component supply and long-term production continuity.

Supply support for STB300NH02L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, digital, and mixed-signal ICs, discrete devices, and MEMS sensors for automotive, industrial, and consumer markets.

STB300NH02L belongs to ST's STripFET™ Power MOSFET product line, engineered specifically for high-efficiency, high-current power conversion and OR-ing applications in enterprise and industrial infrastructure equipment.

FAQ

What is the maximum safe operating temperature for STB300NH02L?

The device supports an operating junction temperature range of –55°C to +175°C. Its absolute maximum rating is defined by thermal limits: at TC = 25°C, total dissipation is 300 W with a derating factor of 2 W/°C above 25°C. For reliable long-term operation, design must maintain Tj ≤ 150°C under worst-case load and ambient conditions using appropriate heatsinking.

Does STB300NH02L require a gate driver IC?

Yes-due to its 109.4 nC total gate charge and low RDS(on), efficient switching requires a dedicated gate driver capable of sourcing/sinking ≥2 A peak current. Driving directly from microcontroller GPIO is insufficient and risks slow transitions, excessive switching loss, and thermal stress. Recommended drivers include ST's STD4N60M2 or TI's UCC27531.

Is STB300NH02L RoHS-compliant and lead-free?

Yes-STB300NH02L is supplied in an ECOPACK®-compliant D²PAK package with lead-free second-level interconnect, conforming to RoHS Directive 2011/65/EU and JEDEC Standard JESD97. The inner box label and package marking indicate the lead-free status and moisture sensitivity level (MSL3).

Can STB300NH02L be used in parallel configurations?

Yes-its positive temperature coefficient for RDS(on) (normalized vs. temperature curves confirm monotonic increase) enables inherent current sharing when paralleled. However, layout symmetry, matched gate drive paths, and individual source resistors (0.01–0.02 Ω) are required to ensure balanced dynamic current distribution and avoid oscillation or thermal runaway.

STB300NH02L Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STripFET™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
24 V
Current - Continuous Drain (Id) @ 25°C:
120A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
1.8mOhm @ 80A, 10V
Vgs(th) (Max) @ Id:
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
109.4 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
7055 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

STB300NH02L FAQ

1.How can I place an order for STB300NH02L through Aetrix?

Please submit a Request for Quotation (RFQ) for STB300NH02L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STB300NH02L reliable?

The price and inventory of STB300NH02L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB300NH02L is usually 5 days.

3.What payment methods are accepted for STB300NH02L?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB300NH02L transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STB300NH02L?

STB300NH02L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STB300NH02L order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STB300NH02L?

For technical support, including STB300NH02L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB300NH02L requirements.

6.How does Aetrix verify that STB300NH02L is sourced from the original manufacturer or authorized distributors?

All STB300NH02L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB300NH02L meets industry standards.

7.What is the process for return or replacement of STB300NH02L?

All STB300NH02L units undergo pre-shipment inspection (PSI). If there is an issue with STB300NH02L, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STB300NH02L part is unused and in its original packaging.

Return procedure for STB300NH02L:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STB300NH02L Tags

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