STMicroelectronics STB32NM50N
- Part No.:
- STB32NM50N
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
STB32NM50N.pdf
- Description:
- MOSFET N CH 500V 22A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,034
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Product details
Overview
STB32NM50N from STMicroelectronics is an N-channel 500 V, 130 mΩ (max), 22 A Power MOSFET in D²PAK package, built on MDmesh™ II vertical strip technology. It delivers ultra-low gate charge (62.5 nC) and input capacitance (1973 pF), enabling high-efficiency hard-switching and resonant topologies in industrial SMPS, solar inverters, and UPS systems.
For engineers reviewing the STB32NM50N datasheet, STB32NM50N pinout, STB32NM50N application, or STB32NM50N equivalent, key selection criteria include avalanche ruggedness (340 mJ EAS), fast switching (td(on) = 21.5 ns, tf = 23.6 ns), and thermal performance (RthJC = 0.66 °C/W) in compact surface-mount D²PAK packaging.
Technical Context
This MOSFET employs ST's second-generation MDmesh™ II process, combining a vertical drift region with optimized strip layout to minimize RDS(on) × Qg figure-of-merit. Its 500 V V(BR)DSS rating and 150 °C max junction temperature support operation in high-voltage DC-link stages.
The integrated body diode features low forward voltage (1.6 V at 22 A) and controlled reverse recovery (Qrr = 5 µC, trr = 328 ns at 25 °C), reducing commutation losses in bridge configurations. Avalanche capability is 100% production-tested to 7 A repetitive current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 500 V - supports 400 V DC bus designs with 25% margin for transients and ripple |
| RDS(on) max | 130 mΩ at VGS = 10 V, ID = 11 A - enables <1.5 W conduction loss at 11 A continuous |
| Qg | 62.5 nC - reduces gate drive power and allows use of smaller, lower-cost drivers |
| EAS | 340 mJ - ensures robust unclamped inductive switching without external snubbers |
| RthJC | 0.66 °C/W - permits 190 W dissipation at TC = 25 °C, supporting high-power density layouts |
| Ciss | 1973 pF - low input capacitance improves high-frequency switching efficiency and dv/dt immunity |
| ID cont @ TC=100°C | 13.86 A - defines usable current derating for thermally constrained PCBs or heatsink-limited enclosures |
Pinout & Package
D²PAK (TO-263) package: surface-mount, single-ended heat transfer via exposed drain tab (pin 2/TAB); requires minimum 1 in² 2-oz copper pad for rated RthJA = 30 °C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D (Pin 2 / TAB) | Drain | Exposed metal tab - primary thermal path and high-current return; must be electrically connected to system ground or DC bus negative |
| G (Pin 1) | Gate | Control terminal - low gate input resistance (3.8 Ω) minimizes ringing; requires <10 Ω series gate resistor for stable turn-on/turn-off |
| S (Pin 3) | Source | Reference node for gate drive - forms common-source configuration; connects to load return or sense resistor for current monitoring |
Key Features
| Feature | Design Value |
|---|---|
| MDmesh™ II vertical structure | Reduces RDS(on) × Qg by >30% vs first-gen MDmesh, enabling higher frequency operation without efficiency penalty |
| 100% avalanche tested | Guarantees single-pulse ruggedness up to 340 mJ and repetitive 7 A, eliminating need for overvoltage clamping in flyback or LLC primary switches |
| Low Coss eq. (325 pF) | Minimizes capacitive turn-on loss during ZVS transitions and improves light-load efficiency in resonant converters |
| Optimized body diode | Qrr = 5 µC and soft recovery reduce EMI and stress on complementary switch in half-bridge topologies |
| ECOPACK® compliant | Meets RoHS and halogen-free requirements without compromising thermal or electrical performance |
Applications
| Industrial Switch-Mode Power Supplies | Solar DC Optimizers |
|---|---|
|
Use Scenario: Primary-side switch in 500–1000 W telecom rectifiers and server PSUs operating at 100–300 kHz. IC Role / Device Role / Timing Role: High-voltage, high-current switching element in active clamp forward or LLC resonant converter primary leg. Use Value: 130 mΩ RDS(on) and 62.5 nC Qg enable >95% full-load efficiency while maintaining thermal headroom on 2-layer PCBs. |
Use Scenario: DC-DC buck converter switch in module-level power electronics (MLPE) for photovoltaic panels. IC Role / Device Role / Timing Role: Fast-switching, high-reliability power stage handling 40–80 V input and 15–30 A output under partial shading conditions. Use Value: 150 °C TJ(max) and 340 mJ EAS ensure survival during rapid irradiance transients and string-level fault events. |
| Uninterruptible Power Supplies (UPS) | Motor Drive Inverter Stages |
|
Use Scenario: Output inverter H-bridge in 1–3 kVA line-interactive UPS units with battery backup. IC Role / Device Role / Timing Role: Low-loss, high-di/dt capable switch managing bidirectional energy flow between battery bank and AC output. Use Value: Low Qgd/Qgs ratio (33 nC / 8.6 nC) enables clean zero-voltage switching transitions and reduces shoot-through risk during dead-time control. |
Use Scenario: Phase-leg switch in 750–1500 W variable-frequency drives for HVAC blowers and pumps. IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in 3-phase inverter outputs driving inductive loads with high dv/dt demands. Use Value: 15 V/ns dv/dt rating and 100% avalanche test allow direct substitution without gate-drive redesign or snubber addition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW32NM50N | Same die, TO-247 package; RthJC = 0.66 °C/W identical, but RthJA = 50 °C/W (vs 30 °C/W for D²PAK) | Better mechanical mounting and heatsink interface; suited for through-hole prototyping or high-reliability industrial chassis mounts | Select when forced-air cooling or bolt-down heatsinking is available and board space permits larger footprint |
| IPP60R190C7 | 650 V, 190 mΩ, 19 A; CoolMOS™ C7; Qg = 42 nC, Ciss = 1250 pF - lower gate charge but higher RDS(on) | Higher voltage rating enables 480 VAC input designs; lower Qg favors >500 kHz operation but higher conduction loss limits <1 kW use | Prefer for universal-input PFC or 650 V DC-link applications where switching loss dominates over conduction loss |
Compared with STW32NM50N, STB32NM50N offers superior PCB thermal management in space-constrained designs; versus IPP60R190C7, it provides lower conduction loss at 500 V with proven avalanche ruggedness-critical for cost-sensitive industrial SMPS where reliability outweighs ultra-high-frequency optimization.
Availability
STB32NM50N is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, solar DC optimizers, uninterruptible power supplies, and motor drive inverter stages requiring stable component supply and long-term manufacturing continuity.
Supply support for STB32NM50N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
This device belongs to ST's MDmesh™ II Power MOSFET product line, engineered specifically for high-efficiency, high-voltage power conversion in industrial and renewable energy systems where low RDS(on) × Qg and avalanche robustness are critical.
FAQ
What is the maximum continuous drain current at case temperature of 100 °C?
The STB32NM50N supports 13.86 A continuous drain current when the case temperature is maintained at 100 °C, as specified in Table 1 of DS9167 Rev 2. This derating reflects thermal limitations of the D²PAK package and must be validated using measured TC under actual board layout and airflow conditions.
Does the STB32NM50N have an integrated body diode, and what are its key recovery characteristics?
Yes, it includes a monolithic source-drain body diode rated for 22 A continuous and 88 A pulsed current. At 25 °C, its reverse recovery charge is 5 µC and recovery time is 328 ns under standard test conditions (ISD = 22 A, di/dt = 100 A/µs, VDD = 60 V), enabling efficient operation in synchronous rectification and bridge configurations.
Can STB32NM50N replace STW32NM50N in existing designs?
Electrically identical, but package-dependent: STB32NM50N (D²PAK) replaces STW32NM50N (TO-247) only if PCB layout accommodates surface-mount assembly and thermal design meets RthJA = 30 °C/W requirements. Mechanical mounting, creepage/clearance, and reflow profile must be requalified.
Is the gate threshold voltage compatible with standard 10 V logic-level gate drivers?
Yes - VGS(th) is specified from 2 V to 4 V (typical 3 V), ensuring reliable turn-on with 10 V gate drive. The device achieves full enhancement at VGS = 10 V, delivering its rated RDS(on) of 130 mΩ, and remains fully enhanced up to the absolute maximum VGS of ±25 V.
STB32NM50N Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ II
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 22A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 130mOhm @ 11A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 62.5 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1973 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 190W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
STB32NM50N FAQ
1.How can I place an order for STB32NM50N through Aetrix?
Please submit a Request for Quotation (RFQ) for STB32NM50N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STB32NM50N reliable?
The price and inventory of STB32NM50N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB32NM50N is usually 5 days.
3.What payment methods are accepted for STB32NM50N?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB32NM50N transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STB32NM50N?
STB32NM50N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STB32NM50N order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STB32NM50N?
For technical support, including STB32NM50N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB32NM50N requirements.
6.How does Aetrix verify that STB32NM50N is sourced from the original manufacturer or authorized distributors?
All STB32NM50N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB32NM50N meets industry standards.
7.What is the process for return or replacement of STB32NM50N?
All STB32NM50N units undergo pre-shipment inspection (PSI). If there is an issue with STB32NM50N, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STB32NM50N part is unused and in its original packaging.
Return procedure for STB32NM50N:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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