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STMicroelectronics STB34NM60N

Part No.:
STB34NM60N
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTB34NM60N.pdf
Description:
MOSFET N-CH 600V 29A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:500

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Product details

Overview

STB34NM60N from STMicroelectronics is an N-channel 600 V, 105 mΩ (max), 31.5 A MDmesh™ II Power MOSFET in D²PAK (TO-263) package, optimized for high-efficiency hard-switching and resonant converters. It delivers low gate charge (84 nC), low input capacitance (2722 pF), and 100% avalanche-tested ruggedness for reliable operation in industrial SMPS, PFC stages, and solar inverters.

For engineers reviewing the STB34NM60N datasheet, STB34NM60N pinout, STB34NM60N application, or STB34NM60N equivalent, key selection criteria include its 600 V VDS, 92 mΩ typical RDS(on), 15 V/ns diode recovery dv/dt rating, and D²PAK thermal resistance of 0.5 °C/W (junction-to-case), critical for high-power density designs.

Technical Context

This device employs ST's second-generation MDmesh vertical strip architecture to minimize conduction and switching losses simultaneously. Its low Ciss/Coss ratio (2722 pF / 173 pF) and 458 pF equivalent output capacitance support fast, low-loss switching up to 100 kHz in continuous conduction mode PFC.

The integrated body diode exhibits 412 ns reverse recovery time at 31.5 A and 100 A/µs di/dt, with 8 µC Qrr, enabling robust performance in bridge-leg and synchronous rectification topologies without external snubbers.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - Withstands DC bus voltages up to 480 V in 3-phase rectified systems with margin.
RDS(on) max 105 mΩ at VGS = 10 V, ID = 14.5 A - Enables <1.5 W conduction loss at 31.5 A in thermally optimized layouts.
Qg 84 nC - Reduces gate drive power and allows use of smaller, lower-cost drivers in high-frequency designs.
ID cont @ TC = 100 °C 20 A - Supports sustained 20 A load current with heatsink mounting at 100 °C case temperature.
RthJC 0.5 °C/W - Delivers 250 W total dissipation capability when mounted on a low-thermal-resistance heatsink.
EAS 345 mJ - Withstands single-pulse inductive energy events without failure, simplifying overcurrent protection design.

Pinout & Package

STB34NM60N is housed in a surface-mount D²PAK (TO-263) package with exposed drain tab for thermal and electrical connection. The package features gull-wing leads, 2.54 mm lead pitch, and a 9.35 mm × 10.40 mm footprint per ST's recommended land pattern (DS6904 Fig. 20).

Pin/Terminal Circuit Role Design Meaning
D (Tab) Drain Exposed copper tab - electrically connected to drain; must be soldered to PCB copper pour or heatsink for thermal and EMI control.
G (Pin 1) Gate High-impedance control terminal - requires low-inductance gate loop and 10 V drive for full enhancement and minimal switching loss.
S (Pin 3) Source Reference node for gate drive and current sensing - forms return path for load current and body diode conduction.

Key Features

Feature Design Value
MDmesh™ II vertical structure Reduces RDS(on) × Qg figure-of-merit by >30% vs. first-gen superjunction MOSFETs, improving efficiency across 50–200 kHz range.
100% unclamped inductive avalanche tested Guarantees robustness under transient overvoltage conditions without derating, eliminating need for external clamping in many PFC designs.
Low Ciss and Coss 2722 pF input and 173 pF output capacitance enable faster turn-on/turn-off transitions and reduced Miller-induced shoot-through risk.
Low gate input resistance 2.9 Ω - Minimizes gate oscillation and improves EMI behavior during switching edges without requiring external gate resistors.

Applications

Industrial Switch-Mode Power Supplies Three-Phase Motor Drives

Use Scenario: Primary-side switching in 1–3 kW telecom and server PSUs operating at 70–100 kHz.

IC Role / Device Role / Timing Role: High-voltage power switch in LLC resonant half-bridge, handling 400 V DC bus and 31.5 A peak current.

Use Value: 92 mΩ RDS(on) and 84 nC Qg reduce conduction + switching losses to <2.1 W at full load, enabling >95% efficiency.

Use Scenario: Inverter leg switching in 2.2 kW variable-frequency drives for HVAC compressors.

IC Role / Device Role / Timing Role: Upper-leg N-channel MOSFET in 3-phase IGBT replacement topology, switching at 8 kHz with 600 V blocking.

Use Value: 15 V/ns diode dv/dt rating and 412 ns trr prevent commutation failure during high-di/dt motor phase reversal.

Solar DC Optimizers EV On-Board Chargers (OBC)

Use Scenario: Module-level MPPT switching in string-level DC optimizers with 1000 V system voltage.

IC Role / Device Role / Timing Role: Synchronous rectifier and buck switch in bidirectional 400 V DC–DC stage, operating at 250 kHz.

Use Value: 458 pF Coss,eq and low Qgd/Qgs ratio (45 nC / 14 nC) suppress voltage spikes and improve ZVS initiation.

Use Scenario: Active clamp flyback primary switch in 3.3 kW OBC AC/DC front-end.

IC Role / Device Role / Timing Role: Main power switch handling 600 V DC link, 31.5 A peak current, and repetitive avalanche stress during clamp cycle.

Use Value: 345 mJ EAS and 7 A IAR allow reliable operation under active clamp energy recycling without snubber losses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP34NM60N Same die, TO-220 package; RthJA = 62.5 °C/W (vs. 30 °C/W for D²PAK); no tape-and-reel option. Preferred for prototyping and low-volume heatsink-mounted designs where manual assembly is acceptable. Select when mechanical mounting flexibility outweighs thermal performance and automated assembly needs.
IPP60R190C7 650 V, 190 mΩ, 21 A; CoolMOS™ C7; higher RDS(on) but lower Qg (42 nC) and superior VGS(th) stability. Better suited for ZVS/ZCS topologies above 200 kHz due to lower gate charge and optimized Coss nonlinearity. Choose for ultra-high-frequency resonant converters where switching loss dominates over conduction loss.

Compared with STP34NM60N, STB34NM60N offers 30% lower junction-to-ambient thermal resistance in automated assembly; versus IPP60R190C7, it provides 45% lower RDS(on) at the cost of higher Qg, making it optimal for medium-frequency, high-current PFC and hard-switched SMPS.

Availability

STB34NM60N is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, solar DC optimizers, EV on-board chargers, and three-phase motor drives requiring stable component supply and long-term production continuity.

Supply support for STB34NM60N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

This device belongs to ST's MDmesh™ II high-voltage Power MOSFET product line, engineered specifically for high-efficiency, high-power-density AC/DC and DC/DC conversion in industrial and renewable energy systems.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STB34NM60N supports 20 A continuous drain current when the case temperature is maintained at 100 °C, as specified in Table 1 of DS6904 Rev 10. This rating assumes proper PCB copper area and heatsinking to achieve the 0.5 °C/W RthJC thermal path.

Does STB34NM60N have an integrated body diode, and what are its key recovery parameters?

Yes, it includes a monolithic source-drain body diode rated for 31.5 A continuous and 126 A pulsed current. At TJ = 150 °C, its reverse recovery time is 490 ns with 10 µC Qrr and 43 A IRRM, measured under 31.5 A, 100 A/µs di/dt, and 60 V VDD conditions.

Can STB34NM60N replace STP34NM60N in existing TO-220 designs?

No direct drop-in replacement is possible due to package incompatibility: STB34NM60N uses D²PAK (TO-263) with gull-wing leads and exposed drain tab, while STP34NM60N uses through-hole TO-220. Layout, thermal interface, and assembly process must be redesigned for surface-mount implementation.

What is the gate threshold voltage range, and how does it vary with temperature?

VGS(th) is specified from 2 V to 4 V at 25 °C (Table 4), with typical value of 3 V. As shown in Figure 9 of DS6904, it decreases linearly to ~0.7× nominal at −50 °C and increases to ~1.1× at 150 °C, ensuring stable turn-on behavior across the full −55 °C to 150 °C operating junction range.

STB34NM60N Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ II
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
29A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
105mOhm @ 14.5A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
84 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
2722 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
250W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

STB34NM60N FAQ

1.How can I place an order for STB34NM60N through Aetrix?

Please submit a Request for Quotation (RFQ) for STB34NM60N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STB34NM60N reliable?

The price and inventory of STB34NM60N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB34NM60N is usually 5 days.

3.What payment methods are accepted for STB34NM60N?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB34NM60N transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STB34NM60N?

STB34NM60N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STB34NM60N order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STB34NM60N?

For technical support, including STB34NM60N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB34NM60N requirements.

6.How does Aetrix verify that STB34NM60N is sourced from the original manufacturer or authorized distributors?

All STB34NM60N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB34NM60N meets industry standards.

7.What is the process for return or replacement of STB34NM60N?

All STB34NM60N units undergo pre-shipment inspection (PSI). If there is an issue with STB34NM60N, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STB34NM60N part is unused and in its original packaging.

Return procedure for STB34NM60N:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STB34NM60N Tags

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