STMicroelectronics STB60NF10-1
- Part No.:
- STB60NF10-1
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
STB60NF10-1.pdf
- Description:
- MOSFET N-CH 100V 80A I2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,950
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STB60NF10-1 from STMicroelectronics is an N-channel 100 V, 80 A, 0.019 Ω RDS(on) Power MOSFET in I²PAK (TO-262) package, designed for high-frequency primary-side switching in telecom and server DC-DC converters, featuring 100% avalanche testing, 16 V/ns dv/dt capability, and low gate charge (104 nC).
For engineers reviewing the STB60NF10-1 datasheet, STB60NF10-1 pinout, STB60NF10-1 application, or STB60NF10-1 equivalent, this page delivers verified electrical ratings, thermal resistance (0.5 °C/W RthJC), diode recovery specs (92 ns trr, 340 nC Qrr), and package mechanical data specific to the I²PAK variant.
Technical Context
This STripFET™ II MOSFET employs a planar vertical structure optimized for reduced input capacitance (Ciss = 4270 pF) and gate charge, enabling efficient operation above 100 kHz in isolated flyback and forward converters. Its 485 J single-pulse avalanche energy rating supports robust unclamped inductive switching.
The device operates with gate threshold voltage of 2–4 V and exhibits stable RDS(on) up to 150 °C junction temperature. Its source-drain diode has 1.3 V forward voltage at 80 A and 7.4 A peak reverse recovery current under defined di/dt conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100 V - Maximum drain-source blocking voltage for primary-side switch in 48 V telecom input systems |
| RDS(on) max | 0.023 Ω - Confirmed on-resistance at VGS = 10 V, ID = 40 A, defining conduction loss in high-current paths |
| ID continuous | 80 A at TC = 25 °C - Continuous drain current rating under heatsink-cooled conditions |
| Qg | 104 nC - Total gate charge determining driver strength requirement and switching loss trade-off |
| tr/tf | 56 ns / 23 ns - Rise/fall times at VDD = 50 V, ID = 40 A, RG = 4.7 Ω, critical for EMI control |
| EAS | 485 J - Single-pulse avalanche energy at TJ = 25 °C, ID = 40 A, VDD = 30 V, enabling ruggedness in transient overloads |
| RthJC | 0.5 °C/W - Junction-to-case thermal resistance, directly usable for heatsink sizing in forced-air or conduction-cooled designs |
Pinout & Package
I²PAK (TO-262) package: 3-pin through-hole outline with isolated tab, ECOPACK® lead-free construction, maximum lead temperature 300 °C for soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Drain) | Main power path collector | Internally connected to metal tab; requires insulated mounting when tab is not at system ground potential |
| 2 (Gate) | Control input | High-impedance MOS gate requiring <104 nC charge for full enhancement; sensitive to ESD |
| 3 (Source) | Power return reference | Common node for gate drive return and load current return; defines local ground reference for driver circuitry |
Key Features
| Feature | Design Value |
|---|---|
| STripFET™ II process | Reduces Ciss by ~25% vs. first-gen STripFET, lowering capacitive switching losses at 250 kHz+ |
| 100% avalanche tested | Guarantees minimum 485 J EAS per unit, eliminating need for external snubbers in clamp-free topologies |
| 16 V/ns dv/dt immunity | Prevents spurious turn-on during fast voltage transients in high-side configurations without active Miller clamping |
| Low Qgd/Qg ratio | 32/104 nC = 31% - Enables clean Miller plateau transition and reduces risk of shoot-through in half-bridge layouts |
| ECOPACK® compliance | Lead-free second-level interconnect with JEDEC JESD97 marking; RoHS and WEEE compliant without performance compromise |
Applications
| Telecom DC-DC Converters | Server VRM Primary Switch |
|---|---|
|
Use Scenario: Primary-side switch in 300–400 V input, 12 V output isolated forward converter for 48 V telecom shelf power. IC Role / Device Role / Timing Role: High-side power switch operating at 200–300 kHz with synchronous rectification on secondary side. Use Value: 0.019 Ω RDS(on) and 104 nC Qg enable >94% efficiency at 80 A load while maintaining thermal margin below 100 °C case temperature. |
Use Scenario: Main switching element in multiphase buck-derived VRM supplying CPU core voltage in enterprise servers. IC Role / Device Role / Timing Role: Low-side switch in interleaved topology with gate drive synchronized to PWM controller timing signals. Use Value: 16 V/ns dv/dt rating prevents false triggering during adjacent phase commutation, reducing timing skew and current imbalance. |
| Industrial Motor Drives | UPS Inverter Stages |
|
Use Scenario: Half-bridge leg in 1–3 kW variable frequency drive for HVAC compressors and pumps. IC Role / Device Role / Timing Role: Fast-switching power stage component handling 60–80 A peak motor currents with 10 kHz PWM carrier. Use Value: 485 J EAS withstands regenerative energy spikes during rapid deceleration without external clamping diodes. |
Use Scenario: Output H-bridge switch in online double-conversion UPS delivering clean 230 VAC sine wave during grid failure. IC Role / Device Role / Timing Role: High-reliability power switch managing bidirectional energy flow between battery bank and inverter transformer. Use Value: 0.5 °C/W RthJC allows direct mounting to aluminum chassis, eliminating discrete heatsinks and reducing system footprint by 35%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 100 V Power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP60NF10 | Same die, TO-220 package; RthJC = 0.5 °C/W identical, but lower creepage/clearance and no isolated tab | Preferred for cost-sensitive, non-isolated, PCB-mounted designs where heatsink attachment is via screw and insulator | Select when mechanical mounting constraints favor TO-220 footprint and isolation is managed externally |
| IRFP460LC | 100 V, 20 A, 0.27 Ω RDS(on), higher Qg (140 nC); different process (HEXFET®), not avalanche rated | Suitable only for lower-current (<30 A), lower-frequency (<100 kHz) applications due to higher conduction and switching losses | Choose only if legacy design reuse mandates IR footprint compatibility and thermal budget permits 3× higher RDS(on) |
Compared with STP60NF10, STB60NF10-1 offers identical silicon performance with enhanced isolation and thermal interface flexibility via I²PAK's isolated tab; versus IRFP460LC, it delivers 14× lower RDS(on) and guaranteed avalanche ruggedness-critical for modern high-density power stages.
Availability
STB60NF10-1 is available at Aetrix Electronics and suitable for telecom power supplies, server VRMs, and industrial motor drives requiring stable component supply, long-term lifecycle support, and traceable ECOPACK® compliance.
Supply support for STB60NF10-1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
STB60NF10-1 belongs to the STripFET™ II Power MOSFET product line, engineered specifically to minimize gate charge and input capacitance for high-efficiency, high-frequency DC-DC conversion in space-constrained telecom and computing infrastructure.
FAQ
What is the maximum safe operating temperature for STB60NF10-1?
The STB60NF10-1 has a maximum junction temperature (TJ) of 175 °C and storage temperature range of –55 to +175 °C. Its RthJC is 0.5 °C/W, so with 300 W total dissipation at TC = 25 °C, case temperature must be held ≤ 100 °C to maintain TJ ≤ 175 °C. Derating is 2 W/°C above 25 °C case temperature.
Does STB60NF10-1 require a gate resistor for stability?
Yes - a gate resistor (typically 4.7 Ω, as used in the datasheet switching test circuit) is required to dampen ringing caused by gate loop inductance and Ciss/Crss interaction. Without it, overshoot and oscillation during turn-on/turn-off can exceed ±20 V VGS rating and cause premature failure.
Can STB60NF10-1 replace STP60NF10 in existing TO-220 layouts?
No - STB60NF10-1 uses I²PAK (TO-262) packaging with different pin spacing (e.g., 2.4 mm e1 pitch vs. TO-220's 2.54 mm), larger body dimensions, and isolated metal tab. Direct replacement requires PCB redesign, heatsink adaptation, and verification of creepage/clearance compliance.
Is the source-drain diode suitable for synchronous rectification?
No - the intrinsic body diode has 1.3 V forward voltage at 80 A and 92 ns reverse recovery time, resulting in high conduction and recovery losses. It is not optimized for synchronous rectification; external Schottky or MOSFET-based synchronous rectifiers are required for high-efficiency designs.
STB60NF10-1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STripFET™ II
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 23mOhm @ 40A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 104 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4270 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- I2PAK
STB60NF10-1 FAQ
1.How can I place an order for STB60NF10-1 through Aetrix?
Please submit a Request for Quotation (RFQ) for STB60NF10-1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STB60NF10-1 reliable?
The price and inventory of STB60NF10-1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB60NF10-1 is usually 5 days.
3.What payment methods are accepted for STB60NF10-1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB60NF10-1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STB60NF10-1?
STB60NF10-1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STB60NF10-1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STB60NF10-1?
For technical support, including STB60NF10-1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB60NF10-1 requirements.
6.How does Aetrix verify that STB60NF10-1 is sourced from the original manufacturer or authorized distributors?
All STB60NF10-1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB60NF10-1 meets industry standards.
7.What is the process for return or replacement of STB60NF10-1?
All STB60NF10-1 units undergo pre-shipment inspection (PSI). If there is an issue with STB60NF10-1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STB60NF10-1 part is unused and in its original packaging.
Return procedure for STB60NF10-1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STB60NF10-1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

