STMicroelectronics STB7ANM60N
- Part No.:
- STB7ANM60N
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
STB7ANM60N.pdf
- Description:
- MOSFET N-CH 600V 5A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:1,848
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STB7ANM60N from STMicroelectronics is an AEC-Q101-qualified N-channel 600 V, 900 mΩ (max), 5 A Power MOSFET in DPAK (TO-252) package, built on MDmesh™ II vertical strip technology. It delivers ultra-low gate charge (14 nC) and input capacitance (363 pF), enabling high-efficiency hard-switching and resonant topologies in automotive and industrial power converters.
For engineers reviewing the STB7ANM60N datasheet, STB7ANM60N pinout, STB7ANM60N application, or STB7ANM60N equivalent, this device is selected for high-voltage DC-DC stages, auxiliary power supplies, and motor control inverters where avalanche ruggedness, low RDS(on), and fast switching (td(off) = 26 ns) are critical.
Technical Context
This MOSFET employs ST's second-generation MDmesh™ II process, combining a vertical drift region with optimized strip layout to minimize conduction and switching losses simultaneously. Its 100% unclamped inductive avalanche tested capability (EAS = 119 mJ) supports robust operation under transient overloads without external snubbers.
The device features low intrinsic gate resistance (5.4 Ω) and tightly controlled threshold voltage (2–4 V), ensuring stable turn-on behavior across temperature (–55 °C to 150 °C). Its Coss eq. of 130 pF enables predictable soft-recovery characteristics in ZVS circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Supports 400 V DC bus designs with ≥50% voltage margin for surge immunity. |
| RDS(on) max | 900 mΩ at VGS = 10 V, ID = 2.5 A - Enables <1.1 W conduction loss at 5 A continuous drain current. |
| Qg | 14 nC - Reduces gate drive power and allows use of smaller, lower-cost drivers in high-frequency SMPS. |
| Ciss | 363 pF at VDS = 50 V - Low input capacitance minimizes Miller effect and improves switching controllability. |
| EAS | 119 mJ (single-pulse, TJ = 25 °C) - Withstands repetitive energy transients in automotive load-dump conditions. |
| RthJC | 2.78 °C/W - Enables 45 W power dissipation with ≤125 °C junction rise above case, supporting compact heatsink design. |
| dv/dt rating | 15 V/ns - Ensures reliable commutation in noisy high-di/dt environments without spurious turn-on. |
Pinout & Package
DPAK (TO-252) package: surface-mount, single-ended lead frame with exposed drain tab for thermal and electrical connection. Standard type A2 variant per DS9116 Rev 4, featuring 6.0–6.2 mm body width (D), 6.4–6.6 mm body length (E), and 2.16–2.41 mm lead pitch (e).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TAB (Drain) | Main power output terminal / heat sink interface | Exposed copper pad electrically connected to drain; must be soldered to PCB copper pour for thermal management and low-inductance return path. |
| Pin 1 (Gate) | Control input | Low-impedance gate node requiring <5.4 Ω series resistance to damp oscillation; sensitive to ESD (±25 V absolute max). |
| Pin 3 (Source) | Power reference / return path | Common source node for gate drive loop; must be routed with minimal inductance to reduce switching overshoot and improve stability. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive powertrain and chassis applications per stress test requirements including HTOL, TC, and UHAST. |
| 100% avalanche tested | Each unit undergoes unclamped inductive switching test at IAR = 2 A, confirming ruggedness without derating. |
| Low Qgd/Qgs ratio | 7.7 nC / 2.7 nC ≈ 2.85 - Improves hard-switching immunity and reduces Miller-induced false turn-on risk. |
| Low Coss eq. | 130 pF - Enables faster VDS fall time and lower capacitive switching loss in high-frequency converters (>100 kHz). |
| Enhanced diode recovery | Qrr = 1.5 µC (TJ = 25 °C), trr = 213 ns - Reduces reverse recovery loss and EMI in synchronous rectifier and half-bridge configurations. |
Applications
| Automotive HVAC Blower Control | Industrial AC-DC Auxiliary Supply |
|---|---|
|
Use Scenario: High-side switch in 12 V/24 V blower motor driver with PWM speed regulation and overcurrent protection. IC Role / Device Role / Timing Role: Main power switch handling up to 5 A continuous load; operates at 20–50 kHz with fast turn-off (tf = 12 ns) to limit shoot-through risk. Use Value: AEC-Q101 qualification ensures reliability in under-hood temperature cycling; low RDS(on) reduces thermal stress on PCB copper. |
Use Scenario: Primary-side switch in 600 V flyback converter powering microcontroller, sensors, and CAN transceivers in PLC modules. IC Role / Device Role / Timing Role: High-voltage switching element with 600 V blocking capability; used in discontinuous conduction mode (DCM) with 65 kHz switching frequency. Use Value: Low Qg and Ciss enable efficient gate driving with low-power controllers; avalanche rating eliminates need for clamping diodes. |
| Server PSU Hold-Up Capacitor Charger | EV Onboard Charger (OBC) PFC Stage |
|
Use Scenario: Inrush limiter and hold-up charger for bulk capacitor banks after AC-DC rectification in telecom/server PSUs. IC Role / Device Role / Timing Role: Soft-start switch controlling pre-charge current into 400 V/1000 µF bus; rated for 20 A pulsed (IDM) during startup. Use Value: 100% avalanche-tested capability safely absorbs energy from capacitor charging transients without failure. |
Use Scenario: Boost switch in 3.3 kW two-phase interleaved PFC stage operating at 65–100 kHz with digital control. IC Role / Device Role / Timing Role: High-efficiency power switch with low conduction + switching loss trade-off; leverages low Coss eq. for ZVS-assisted transitions. Use Value: MDmesh™ II architecture achieves <0.8 Ω typical RDS(on), reducing conduction loss by ~15% vs. first-gen 600 V MOSFETs at same die size. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP7NM60FD | 600 V, 1.2 Ω max RDS(on), 7 A, TO-220 package; no AEC-Q101, higher Qg (22 nC) | Non-automotive industrial use only; requires larger heatsink due to higher RDS(on) and TO-220 thermal resistance | Select when cost sensitivity outweighs automotive qualification and board space constraints. |
| IXTP50N10D2 | 100 V, 50 A, TO-220; incompatible voltage rating; not suitable for 400 V+ bus applications | Only viable in low-voltage (<150 V) DC-DC or motor drives - not a functional substitute | Reject for any 600 V system; included only to clarify non-interchangeability due to voltage mismatch. |
Compared with STP7NM60FD, STB7ANM60N offers 25% lower RDS(on), 36% lower Qg, and automotive qualification - critical for space-constrained, thermally demanding, or safety-critical systems. IXTP50N10D2 is electrically incompatible due to 100 V rating versus required 600 V blocking.
Availability
STB7ANM60N is available at Aetrix Electronics and suitable for automotive HVAC systems, industrial AC-DC auxiliary supplies, and EV onboard charger PFC stages requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for STB7ANM60N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for automotive, industrial, and consumer markets.
This device belongs to ST's MDmesh™ II high-voltage Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in automotive and industrial power conversion systems up to 600 V.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The STB7ANM60N supports 3 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS9116 Rev 4. This derating reflects thermal limits of the DPAK package and ensures safe operation within its SOA boundary at elevated ambient temperatures.
Is the source-drain diode suitable for synchronous rectification?
No - the integrated body diode has trr = 213 ns and Qrr = 1.5 µC at 25 °C, making it unsuitable for high-frequency synchronous rectification. External Schottky or GaN FETs are recommended for that function; this MOSFET is intended as a controlled switch, not a rectifier.
Does STB7ANM60N have a guaranteed minimum gate threshold voltage?
Yes - VGS(th) is guaranteed between 2 V and 4 V (min/max) at ID = 250 µA, per Table 4. This ensures reliable turn-on with standard 10 V gate drivers while preventing accidental activation from noise below 2 V.
Can STB7ANM60N replace STD7ANM60N in existing designs?
Yes - STB7ANM60N is the updated orderable part number for the same silicon and DPAK package as STD7ANM60N, per DS9116 Rev 4 revision history. Pinout, ratings, and performance are identical; only marking and ordering designation changed.
STB7ANM60N Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ II
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 900mOhm @ 2.5A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250mA
- Gate Charge (Qg) (Max) @ Vgs:
- 14 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 363 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 45W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
STB7ANM60N FAQ
1.How can I place an order for STB7ANM60N through Aetrix?
Please submit a Request for Quotation (RFQ) for STB7ANM60N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STB7ANM60N reliable?
The price and inventory of STB7ANM60N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STB7ANM60N is usually 5 days.
3.What payment methods are accepted for STB7ANM60N?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STB7ANM60N transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STB7ANM60N?
STB7ANM60N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STB7ANM60N order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STB7ANM60N?
For technical support, including STB7ANM60N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STB7ANM60N requirements.
6.How does Aetrix verify that STB7ANM60N is sourced from the original manufacturer or authorized distributors?
All STB7ANM60N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STB7ANM60N meets industry standards.
7.What is the process for return or replacement of STB7ANM60N?
All STB7ANM60N units undergo pre-shipment inspection (PSI). If there is an issue with STB7ANM60N, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STB7ANM60N part is unused and in its original packaging.
Return procedure for STB7ANM60N:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STB7ANM60N Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

