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STMicroelectronics STD13N60DM2

Part No.:
STD13N60DM2
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixSTD13N60DM2.pdf
Description:
MOSFET N-CH 600V 11A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,633

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Product details

Overview

STD13N60DM2 from STMicroelectronics is a high-voltage N-channel Power MOSFET in the MDmesh DM2 series, featuring 600 V VDS, 0.365 Ω max RDS(on) at 10 V VGS, and 11 A continuous drain current at TC = 25 °C. It integrates a fast-recovery body diode with 90 ns trr (Tj = 25 °C) and 252 nC Qrr, enabling high-efficiency bridge topologies and ZVS phase-shift converters.

For engineers reviewing the STD13N60DM2 datasheet, STD13N60DM2 pinout, STD13N60DM2 application, or STD13N60DM2 equivalent, key selection criteria include its 40 V/ns diode dv/dt ruggedness, 19 nC total gate charge, 730 pF input capacitance, and DPAK (TO-252) thermal resistance of 1.14 °C/W junction-to-case - critical for high-frequency SMPS and industrial motor drives.

Technical Context

This MOSFET employs ST's MDmesh DM2 superjunction architecture to achieve low RDS(on) × Qg figure-of-merit (0.365 Ω × 19 nC), optimized for hard-switched and resonant converters. Its Zener-protected gate withstands ±25 V VGS, and the body diode is 100% avalanche tested to 340 mJ EAS.

The device delivers stable switching performance across –55 to 150 °C operating range, with normalized RDS(on) variation ≤2.2× from –75 to 125 °C and V(BR)DSS drift <±8% over temperature. Its Coss eq. of 70 pF (0–480 V) supports low output capacitance energy (EOSS = 5 µJ at 600 V).

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - Withstands DC bus voltages up to 480 V in ZVS operation with 50 V margin.
RDS(on) max 0.365 Ω at VGS = 10 V, ID = 5.5 A - Enables <1.5 W conduction loss at 11 A, reducing heatsink requirements.
Qg 19 nC - Low gate drive power demand supports >300 kHz switching without excessive driver loss.
trr / Qrr 90 ns / 252 nC at Tj = 25 °C - Minimizes diode reverse recovery losses in LLC and phase-shift full-bridge topologies.
dv/dt ruggedness 40 V/ns (diode), 50 V/ns (MOSFET) - Ensures reliable operation under fast voltage transients in high-dV/dt inverters.
RthJC 1.14 °C/W - Allows 96 W continuous dissipation at TC = 100 °C before exceeding 150 °C Tj.
EAS 340 mJ - Supports unclamped inductive switching in PFC and motor control without external snubbers.

Pinout & Package

STD13N60DM2 is housed in a surface-mount DPAK (TO-252) package with exposed drain tab for thermal and electrical connection. The package complies with ECOPACK environmental standards and is supplied in tape-and-reel format (2500 pcs/reel).

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal; requires 10 V drive for full enhancement; Zener-protected to ±25 V.
2 (D, TAB) Drain / Thermal Pad Main high-side current path and primary thermal interface; soldered to PCB copper pour for heat dissipation.
3 (S) Source Reference node for gate drive and current sensing; connects to power ground in low-side configurations.

Key Features

Feature Design Value
Fast-recovery body diode trr = 90 ns (25 °C), Qrr = 252 nC - Reduces switching loss and EMI in synchronous rectification and half-bridge freewheeling.
Low gate charge Qg = 19 nC, Qgd = 9.9 nC - Enables clean turn-off with minimal Miller-induced shoot-through risk in high-side drivers.
High dv/dt ruggedness 50 V/ns MOSFET, 40 V/ns diode - Eliminates false triggering in noisy industrial environments with rapid bus transients.
100% avalanche rated EAS = 340 mJ - Permits robust operation in inductive load switching without derating or external clamping.
Thermal performance RthJC = 1.14 °C/W - Delivers 96 W power handling on standard FR-4 with 2 oz Cu, simplifying thermal design.

Applications

Industrial Motor Drives Server & Telecom SMPS

Use Scenario: Half-bridge inverter stage for 750 W BLDC motor control with 400 V DC bus.

IC Role / Device Role / Timing Role: High-side switching element with integrated fast diode for regenerative braking commutation.

Use Value: 90 ns trr and 50 V/ns dv/dt rating prevent shoot-through during high-di/dt current reversal, improving system reliability.

Use Scenario: Primary-side switch in 1 kW LLC resonant converter for 48 V telecom rectifier.

IC Role / Device Role / Timing Role: Zero-voltage switching (ZVS) active clamp MOSFET with low Coss eq. (70 pF) for soft turn-on.

Use Value: 70 pF Coss eq. reduces dead-time loss and enables stable ZVS down to 200 kHz, boosting efficiency by ≥0.8%.

Industrial PFC Boost Stage EV Onboard Charger (OBC)

Use Scenario: Continuous conduction mode (CCM) boost switch in 3.3 kW single-phase PFC front-end.

IC Role / Device Role / Timing Role: Main switching transistor handling 11 A RMS current with 600 V blocking capability.

Use Value: 0.365 Ω RDS(on) limits conduction loss to <1.4 W at full load, reducing thermal stress on heatsink.

Use Scenario: Isolated DC-DC stage in bidirectional OBC using dual-active-bridge (DAB) topology.

IC Role / Device Role / Timing Role: Synchronous rectifier MOSFET in secondary-side full-bridge with body-diode conduction during dead time.

Use Value: 1.6 V VSD at 11 A ensures low forward loss during body-diode conduction, minimizing dead-time energy loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP12N60DM2 12 A ID, 0.42 Ω RDS(on) max, identical DPAK package and MDmesh DM2 process. Slightly lower current rating; reduced conduction loss margin at >10 A continuous loads. Select when thermal budget allows higher RDS(on) or cost sensitivity outweighs 1 A current headroom.
IPP60R190C7 650 V VDS, 0.19 Ω RDS(on), TO-220 package, CoolMOS C7 technology. Higher voltage rating but larger footprint and higher Qg (32 nC); no integrated fast diode (trr > 200 ns). Prefer for 650 V systems requiring lower RDS(on), but avoid where fast diode recovery or DPAK mounting is mandatory.

Compared with STP12N60DM2 and IPP60R190C7, STD13N60DM2 uniquely balances 600 V rating, DPAK form factor, 11 A current, fast diode (90 ns trr), and low Qg (19 nC) - making it optimal for space-constrained, high-frequency industrial SMPS where diode recovery and thermal density are critical.

Availability

STD13N60DM2 is available at Aetrix Electronics and suitable for industrial motor drives, server/telecom SMPS, industrial PFC boost stages, and EV onboard chargers requiring stable component supply and long-term production continuity.

Supply support for STD13N60DM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, microcontrollers, sensors, and automotive ICs.

STD13N60DM2 belongs to the MDmesh DM2 Power MOSFET product line, engineered specifically for high-efficiency, high-frequency switched-mode power supplies and industrial motor control where low RDS(on), fast diode recovery, and avalanche ruggedness are essential.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STD13N60DM2 supports 7 A continuous drain current at TC = 100 °C, as specified in Table 1 (Absolute Maximum Ratings). This derating reflects thermal limitations of the DPAK package and must be applied in thermal design calculations alongside RthJC = 1.14 °C/W to ensure Tj ≤ 150 °C under steady-state conditions.

Does the body diode require external anti-parallel diode placement?

No - the STD13N60DM2 integrates a fast-recovery body diode with trr = 90 ns (25 °C) and Qrr = 252 nC, fully characterized and 100% tested. It is designed for direct use in freewheeling, synchronous rectification, and bridge-leg commutation without supplemental diodes in most high-frequency topologies.

What is the safe operating area (SOA) limitation at 10 µs pulse width?

At tp = 10 µs, the SOA curve (Figure 1) limits operation to ≤25 A at VDS = 100 V and ≤10 A at VDS = 400 V, constrained by RDS(on) and peak power. This defines maximum pulsed current capability in short-circuit or overload events without thermal runaway or second breakdown.

Is the DPAK package offered in both type A2 and type C3 variants for this part?

Yes - per DS11596 Rev 4 Section 4.1 and 4.2, STD13N60DM2 is qualified in both DPAK (TO-252) type A2 and type C3 mechanical variants. Type A2 features a 0.90–1.10 mm A1 height and 5.10–5.25 mm D1 width; type C3 has A1 = 0.00–0.10 mm and D1 = 5.20–5.70 mm, enabling compatibility with different PCB assembly processes.

STD13N60DM2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ DM2
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
11A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
365mOhm @ 5.5A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
19 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
730 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
110W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK

STD13N60DM2 FAQ

1.How can I place an order for STD13N60DM2 through Aetrix?

Please submit a Request for Quotation (RFQ) for STD13N60DM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STD13N60DM2 reliable?

The price and inventory of STD13N60DM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STD13N60DM2 is usually 5 days.

3.What payment methods are accepted for STD13N60DM2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STD13N60DM2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STD13N60DM2?

STD13N60DM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STD13N60DM2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STD13N60DM2?

For technical support, including STD13N60DM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STD13N60DM2 requirements.

6.How does Aetrix verify that STD13N60DM2 is sourced from the original manufacturer or authorized distributors?

All STD13N60DM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STD13N60DM2 meets industry standards.

7.What is the process for return or replacement of STD13N60DM2?

All STD13N60DM2 units undergo pre-shipment inspection (PSI). If there is an issue with STD13N60DM2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STD13N60DM2 part is unused and in its original packaging.

Return procedure for STD13N60DM2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STD13N60DM2 Tags

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