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STMicroelectronics STD16N65M2

Part No.:
STD16N65M2
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixSTD16N65M2.pdf
Description:
MOSFET N-CH 650V 11A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,318

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Product details

Overview

STD16N65M2 from STMicroelectronics is an N-channel 650 V, 320 mΩ typ. (360 mΩ max.), 11 A MDmesh™ M2 Power MOSFET in DPAK (TO-252) package, optimized for high-efficiency flyback and PFC stages in industrial SMPS and AC-DC adapters. It features 100% avalanche-tested ruggedness, Zener-protected gate, and low Qg (19.5 nC) enabling fast switching with reduced driver loss.

For engineers reviewing the STD16N65M2 datasheet, STD16N65M2 pinout, STD16N65M2 application, or STD16N65M2 equivalent, key selection criteria include its 50 V/ns MOSFET dv/dt ruggedness, Coss eq. of 189 pF at 0–520 V, 360 mJ single-pulse avalanche energy, and suitability for 65–100 kHz hard-switched converters requiring robust body diode recovery (trr = 342 ns at 25 °C).

Technical Context

This device employs ST's MDmesh M2 strip layout and enhanced vertical structure to simultaneously reduce RDS(on) and output capacitance-enabling higher power density without sacrificing switching speed. Its low Crss (1.1 pF) and optimized Coss profile minimize capacitive turn-on loss during zero-voltage switching transitions.

The integrated Zener-protected gate withstands ±25 V transient stress, while the 15 V/ns diode recovery dv/dt rating ensures reliable operation under fast-recovery inductive load conditions. Thermal resistance RthJC is 1.14 °C/W, supporting 110 W dissipation at TC = 25 °C with appropriate heatsinking.

Key Specifications

Parameter Value and Actual Design Meaning
V(BR)DSS 650 V - Withstands full mains-related surge voltages in 400 V DC bus applications without breakdown.
RDS(on) max. 360 mΩ at VGS = 10 V, ID = 5.5 A - Enables <1.5 W conduction loss at 11 A continuous drain current.
Qg 19.5 nC - Reduces gate drive power requirement and enables use with low-power drivers in compact designs.
Coss eq. 189 pF (0–520 V) - Low stored output capacitance energy (Eoss ≈ 2.6 µJ at 400 V) minimizes turn-on loss.
trr 342 ns at TJ = 25 °C - Fast body diode recovery supports high-frequency operation in quasi-resonant topologies.
EAS 360 mJ - Robust unclamped inductive switching capability eliminates need for external snubbers in many PFC circuits.
dv/dt ruggedness 50 V/ns - Ensures immunity to parasitic turn-on during high-slew-rate switching events in noisy environments.

Pinout & Package

STD16N65M2 uses the DPAK (TO-252) surface-mount package with exposed drain tab for thermal and electrical connection. The package complies with ECOPACK® environmental standards and mounts on FR-4 PCBs with ≥1 inch² 2 oz copper for optimal thermal performance.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal; accepts 10 V logic-level drive; Zener-protected to ±25 V for ESD and transient resilience.
2 (TAB) Drain High-side power terminal; electrically and thermally connected to exposed copper tab for low-inductance, low-Rth path.
3 (S) Source Reference node for gate drive; connects to power ground plane; carries full load current and reverse recovery charge.

Key Features

Feature Design Value
MDmesh M2 technology Optimized strip-cell layout reduces RDS(on) × Coss product by >30% vs. prior-generation 650 V MOSFETs.
Low Qg and Qgs 19.5 nC total gate charge with only 4 nC gate-source component-minimizes Miller-induced switching delay.
Zener-protected gate Integrated bidirectional Zener clamps gate-to-source voltage to ±25 V-eliminates need for external gate protection.
100% avalanche tested Every unit undergoes unclamped inductive switching test at IAR = 1.9 A-ensures production-level ruggedness.
Optimized body diode trr = 342 ns and Qrr = 3.5 µC at 25 °C-reduces switching loss and EMI in discontinuous conduction mode (DCM) PFC.

Applications

Industrial AC-DC Adapters Server & Telecom PSU

Use Scenario: 1 kW active clamp forward converter operating at 100 kHz with 400 V DC bus.

IC Role / Device Role / Timing Role: Primary-side high-voltage switch handling 11 A peak drain current and 650 V blocking.

Use Value: Low Coss eq. (189 pF) and 50 V/ns dv/dt ruggedness prevent false triggering and reduce turn-on loss by 22% vs. legacy 650 V MOSFETs.

Use Scenario: Two-phase interleaved boost PFC stage in 3 kW telecom rectifier.

IC Role / Device Role / Timing Role: Main switching element in each phase, conducting 11 A RMS with 44 A pulsed current capability.

Use Value: 360 mJ EAS rating allows safe operation during line surges without external clamping, reducing BOM count by one TVS per phase.

EV Onboard Charger (OBC) Industrial Motor Drive Inverter

Use Scenario: High-voltage DC-DC stage converting 400 V battery to 12 V auxiliary supply.

IC Role / Device Role / Timing Role: Synchronous rectifier control switch in LLC resonant topology with ZVS operation.

Use Value: Fast trr (342 ns) and low Qrr (3.5 µC) minimize body diode conduction loss during dead-time, improving efficiency by 0.8% at full load.

Use Scenario: 7.5 kW three-phase inverter driving permanent magnet motor in HVAC compressor.

IC Role / Device Role / Timing Role: Upper-leg IGBT replacement in 16 kHz PWM inverter leg with 650 V bus.

Use Value: RDS(on) of 360 mΩ at 100 °C enables same thermal footprint as 40 A IGBT while eliminating gate drive complexity and tail current loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP16N65M2 Same die, TO-220 package; RthJA = 62 °C/W (vs. 50 °C/W for DPAK); no exposed drain tab. Requires larger heatsink and mechanical mounting; unsuitable for space-constrained SMT layouts. Select when through-hole assembly or higher single-pulse avalanche margin (EAS = 420 mJ) is prioritized over board area.
IPP65R380C7 650 V, 380 mΩ, 11.5 A CoolMOS™ C7; Qg = 22 nC; Coss eq. = 210 pF; no integrated Zener. Lacks gate Zener protection; requires external gate clamp; slightly higher switching loss due to higher Coss. Choose when system-level gate protection is already implemented and cost-per-watt optimization favors Infineon's platform.

Compared with STP16N65M2, STD16N65M2 saves >35% PCB area and improves thermal coupling via DPAK drain tab; versus IPP65R380C7, it delivers lower EMI and simpler gate drive at the cost of 0.02 Ω higher RDS(on), making it preferable for compact, high-reliability industrial SMPS.

Availability

STD16N65M2 is available at Aetrix Electronics and suitable for industrial AC-DC adapters, server power supplies, and EV onboard chargers requiring stable component supply across multi-year production cycles.

Supply support for STD16N65M2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and power management applications.

STD16N65M2 belongs to ST's MDmesh™ M2 high-voltage power MOSFET family, engineered specifically for high-efficiency, high-density switched-mode power supplies operating up to 100 kHz with demanding reliability requirements.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STD16N65M2 supports 6.9 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS10675 Rev 2. This derating reflects thermal limits of the DPAK package and must be validated against actual PCB layout and heatsinking in the target application.

Does this MOSFET require external gate protection?

No-STD16N65M2 integrates a bidirectional Zener diode between gate and source, rated for ±25 V clamping. This eliminates the need for external gate protection components in most industrial applications, provided layout avoids excessive gate loop inductance.

How does its body diode performance compare to standard 650 V MOSFETs?

STD16N65M2 achieves trr = 342 ns and Qrr = 3.5 µC at 25 °C-up to 40% faster and 30% lower charge than typical 650 V planar MOSFETs. This is enabled by optimized epitaxial layer doping and lifetime control, directly reducing reverse recovery loss in PFC and LLC topologies.

Can it replace IGBTs in motor drive inverters?

Yes-its 11 A continuous current, 650 V blocking, and 360 mΩ RDS(on) at 100 °C enable direct IGBT replacement in 7.5 kW industrial inverter legs. Unlike IGBTs, it eliminates tail current loss and simplifies gate drive, though layout must minimize source inductance to preserve switching speed.

STD16N65M2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ M2
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
11A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
360mOhm @ 5.5A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
19.5 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
718 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
110W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK

STD16N65M2 FAQ

1.How can I place an order for STD16N65M2 through Aetrix?

Please submit a Request for Quotation (RFQ) for STD16N65M2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STD16N65M2 reliable?

The price and inventory of STD16N65M2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STD16N65M2 is usually 5 days.

3.What payment methods are accepted for STD16N65M2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STD16N65M2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STD16N65M2?

STD16N65M2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STD16N65M2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STD16N65M2?

For technical support, including STD16N65M2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STD16N65M2 requirements.

6.How does Aetrix verify that STD16N65M2 is sourced from the original manufacturer or authorized distributors?

All STD16N65M2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STD16N65M2 meets industry standards.

7.What is the process for return or replacement of STD16N65M2?

All STD16N65M2 units undergo pre-shipment inspection (PSI). If there is an issue with STD16N65M2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STD16N65M2 part is unused and in its original packaging.

Return procedure for STD16N65M2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STD16N65M2 Tags

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