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STMicroelectronics STD3NK60ZD
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- Part No.:
- STD3NK60ZD
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
STD3NK60ZD.pdf
- Description:
- MOSFET N-CH 600V 2.4A DPAK
- Quantity:
- Payment:
- Shipping:
Inventory:4,808
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Product details
Overview
STD3NK60ZD from STMicroelectronics is an N-channel 600 V, 3.3 Ω (max), 2.4 A SuperFREDMesh™ Power MOSFET in DPAK package, featuring 100% avalanche tested operation, 15 V/ns dv/dt capability, and integrated fast recovery body diode-used in offline SMPS, PFC stages, and industrial motor control inverters.
For engineers reviewing the STD3NK60ZD datasheet, STD3NK60ZD pinout, STD3NK60ZD application, or STD3NK60ZD equivalent, key selection criteria include its 600 V blocking voltage, low gate charge (11.8 nC), fast diode recovery (98 ns trr), thermal resistance (Rthj-pcb = 50 °C/W), and DPAK footprint compatibility with high-voltage switching layouts.
Technical Context
This MOSFET employs ST's SuperFREDMesh™ process, combining Zener-protected gate structure with minimized intrinsic capacitances (Ciss = 311 pF, Crss = 8 pF) and optimized charge distribution to enable robust high-dv/dt switching at 600 V. Its internal fast-recovery body diode supports synchronous rectification and inductive load commutation without external diodes.
The device operates across –55 °C to 150 °C junction temperature range, delivers 150 mJ single-pulse avalanche energy, and maintains stable RDS(on) up to 100 °C case temperature-enabling reliable use in thermally constrained industrial power supplies and AC-DC adapters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 600 V - supports primary-side switching in universal-input offline converters up to 265 VAC mains. |
| RDS(on) max | 3.3 Ω @ VGS = 10 V, ID = 1.2 A - enables low conduction loss in <3 W output SMPS designs. |
| ID (continuous) | 2.4 A @ TC = 25 °C - suitable for medium-power flyback or forward converter primary switches. |
| Qg / Qgd | 11.8 nC / 6.4 nC - reduces gate drive power and enables efficient operation with standard 10 V logic-level drivers. |
| trr / Qrr | 98 ns / 170 nC - minimizes switching loss and EMI during diode reverse recovery in hard-switched topologies. |
| dv/dt capability | 15 V/ns - ensures immunity to parasitic turn-on in high-noise, high-frequency power stages. |
| Rthj-pcb | 50 °C/W - allows direct PCB copper pour heatsinking without dedicated heatsink in ≤5 W applications. |
Pinout & Package
DPAK (TO-252) package: surface-mount, 3-terminal, single-drain tab configuration with exposed drain pad for thermal and electrical connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Receives 10 V logic-level signal; Zener-protected to ±30 V for robust gate drive interface. |
| 2 (Source) | Reference node | Serves as return path for load current and gate drive loop; connects to power ground plane. |
| 3 (Drain) | High-voltage switch node | Exposed metal tab carries full 600 V blocking and 2.4 A conduction; must be isolated from other layers. |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees 2.4 A repetitive avalanche current and 150 mJ single-pulse energy handling without derating. |
| SuperFREDMesh™ diode | Integrates fast 98 ns trr, 1.6 V VSD body diode-eliminates need for external snubber or freewheeling diode in flyback designs. |
| Low Coss eq | 27 pF equivalent output capacitance reduces turn-off loss and improves efficiency in high-frequency (>100 kHz) operation. |
| ECOPACK® compliance | Lead-free second-level interconnect meets RoHS and JEDEC JESD97 standards for industrial environmental requirements. |
| High dv/dt immunity | 15 V/ns rating prevents false triggering in noisy high-side configurations with fast-rising bus voltages. |
Applications
| Offline Flyback SMPS | PFC Pre-regulator Stage |
|---|---|
Use Scenario: Primary-side switch in 5–24 W universal-input AC-DC adapters for consumer electronics. IC Role / Device Role / Timing Role: High-voltage N-channel switch operating at 65–130 kHz with zero-voltage switching assistance. Use Value: Low 3.3 Ω RDS(on) and 11.8 nC Qg reduce conduction and gate loss, enabling >85% efficiency at full load. | Use Scenario: Boost switch in active PFC circuits for LED drivers and industrial power supplies. IC Role / Device Role / Timing Role: Fast-switching, high-reliability boost transistor handling 385 V DC bus and 2.4 A peak current. Use Value: 15 V/ns dv/dt capability and 100% avalanche testing ensure stable operation under line transients and overloads. |
| Industrial Motor Control Inverter | DC-DC Isolated Gate Driver Supply |
Use Scenario: Half-bridge high-side switch in 24–48 V BLDC motor controllers for HVAC and pumps. IC Role / Device Role / Timing Role: Medium-power switching element with integrated diode for bootstrap supply recirculation. Use Value: 98 ns trr and 170 nC Qrr minimize shoot-through risk and improve gate driver timing margin. | Use Scenario: Primary switch in isolated auxiliary supply powering gate drivers and MCU in IGBT/MOSFET inverters. IC Role / Device Role / Timing Role: 600 V-rated switch delivering regulated 15 V/100 mA to isolated secondary side. Use Value: Rthj-pcb = 50 °C/W allows direct PCB heatsinking-no heatsink needed in compact 15 mm × 15 mm layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP3NK60Z | TO-220 package, higher Rthj-amb (62.5 °C/W), same VDSS/RDS(on)/Qg specs | Requires mechanical heatsink; unsuitable for space-constrained SMT designs | Select when board-level thermal management is impractical but higher power dissipation is acceptable. |
| FQP3N60C | 600 V, 3.3 Ω, 2.4 A, TO-220, no avalanche rating, slower trr (200 ns) | Lacks 100% avalanche test and fast diode-requires external snubber in inductive loads | Choose only for cost-sensitive non-critical applications where reliability under overload is not required. |
Compared with STP3NK60Z and FQP3N60C, STD3NK60ZD uniquely combines DPAK SMT compatibility, guaranteed avalanche ruggedness, and fast integrated diode-making it optimal for compact, high-reliability offline power stages where board area and transient immunity are critical.
Availability
STD3NK60ZD is available at Aetrix Electronics and suitable for offline flyback SMPS, PFC pre-regulator stages, and industrial motor control inverters requiring stable component supply and long-term design continuity.
Supply support for STD3NK60ZD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
STD3NK60ZD belongs to ST's SuperFREDMesh™ Power MOSFET product line, engineered specifically for high-efficiency, high-reliability AC-DC and DC-DC conversion in space- and thermal-constrained applications.
FAQ
Is STD3NK60ZD suitable for 230 VAC input PFC circuits?
Yes. With 600 V VDSS and 2.4 A continuous ID rating, it supports boost PFC operation up to 385 V DC bus. Its 15 V/ns dv/dt rating and 100% avalanche testing ensure robustness against line surges and inductive kickback in real-world mains environments.
What is the maximum recommended PCB copper area for thermal performance?
For optimal Rthj-pcb = 50 °C/W, ST recommends ≥100 mm² of 2 oz copper connected directly to the exposed drain pad on a single layer, with thermal vias to inner ground planes. Larger areas further reduce junction temperature but yield diminishing returns beyond 200 mm².
Does the integrated body diode replace an external freewheeling diode in flyback designs?
Yes-the SuperFREDMesh™ diode has 98 ns trr and 1.6 V VSD at 10 A, enabling direct use as the freewheeling path in discontinuous conduction mode (DCM) flyback. However, for continuous conduction mode (CCM) or high-current designs, an external ultrafast diode may still be preferred.
Can STD3NK60ZD be driven directly by a 3.3 V microcontroller GPIO?
No. Its VGS(th) ranges from 3.0–4.5 V, and full enhancement requires ≥10 V. A dedicated gate driver (e.g., STMicro's STL6N3LLH6) or level-shifting circuit is required to ensure low RDS(on) and prevent partial turn-on during switching transitions.
STD3NK60ZD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- SuperFREDmesh™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.4A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 3.6Ohm @ 1.2A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 50µA
- Gate Charge (Qg) (Max) @ Vgs:
- 11.8 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 311 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 45W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
STD3NK60ZD FAQ
1.How can I place an order for STD3NK60ZD through Aetrix?
Please submit a Request for Quotation (RFQ) for STD3NK60ZD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STD3NK60ZD reliable?
The price and inventory of STD3NK60ZD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STD3NK60ZD is usually 5 days.
3.What payment methods are accepted for STD3NK60ZD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STD3NK60ZD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STD3NK60ZD?
STD3NK60ZD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STD3NK60ZD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STD3NK60ZD?
For technical support, including STD3NK60ZD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STD3NK60ZD requirements.
6.How does Aetrix verify that STD3NK60ZD is sourced from the original manufacturer or authorized distributors?
All STD3NK60ZD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STD3NK60ZD meets industry standards.
7.What is the process for return or replacement of STD3NK60ZD?
All STD3NK60ZD units undergo pre-shipment inspection (PSI). If there is an issue with STD3NK60ZD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STD3NK60ZD part is unused and in its original packaging.
Return procedure for STD3NK60ZD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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