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STMicroelectronics STD4N52K3

Part No.:
STD4N52K3
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixSTD4N52K3.pdf
Description:
MOSFET N-CH 525V 2.5A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,794

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Product details

Overview

STD4N52K3 from STMicroelectronics is an N-channel 525 V, 2.6 Ω max, 2.5 A MDmesh™ K3 Power MOSFET in DPAK (TO-252) package, designed for high-voltage switching in offline SMPS, PFC stages, and industrial motor drives where avalanche ruggedness and low gate charge are critical.

For engineers reviewing the STD4N52K3 datasheet, STD4N52K3 pinout, STD4N52K3 application, or STD4N52K3 equivalent, key selection criteria include its 11 nC total gate charge, 12 V/ns dv/dt capability, 110 mJ single-pulse avalanche energy, and built-in Zener-protected gate-source structure for ESD robustness.

Technical Context

This device employs ST's MDmesh™ K3 vertical superjunction architecture optimized for high-voltage operation with reduced specific on-resistance and minimized output capacitance. Its 334 pF input capacitance and 5 pF reverse transfer capacitance enable fast, low-loss switching at 420 V bus voltages.

The integrated source-drain diode features 173 ns reverse recovery time and 778 nC reverse recovery charge at 25 °C, with improved softness due to optimized carrier lifetime control-critical for reducing EMI in hard-switched converters.

Key Specifications

ParameterValue and Actual Design Meaning
VDS525 V - supports 400 V AC mains-derived DC bus with 30% margin for transients
RDS(on) max2.6 Ω - enables <1.6 W conduction loss at 2.5 A continuous drain current
ID cont @ TC=25°C2.5 A - defines maximum steady-state current with heatsink at ambient temperature
Qg11 nC - determines gate driver power requirement and switching speed in 100–500 kHz applications
EAS110 mJ - quantifies unclamped inductive switching robustness without external snubbers
dv/dt capability12 V/ns - ensures reliable operation under high-slew-rate voltage transients in bridge configurations
V(BR)GSO30 V - Zener clamping protects gate oxide from ±30 V transient overstress

Pinout & Package

DPAK (TO-252) package: surface-mount, 3-terminal, exposed drain tab for thermal and electrical connection; requires minimum 1 inch² FR-4 PCB copper area for Rthj-pcb = 50 °C/W performance.

Pin/TerminalCircuit RoleDesign Meaning
D (Drain / Tab)Main high-side current path and thermal interfaceExposed metal tab electrically connected to drain; must be soldered to large copper pour for thermal dissipation and low-inductance return path
G (Gate)Control electrode for channel modulationHigh-impedance input requiring <11 nC charge for full enhancement; sensitive to ESD-Zener protection active
S (Source)Reference node for gate drive and current returnLow-side reference point; connects to power ground plane; source inductance directly impacts switching stability

Key Features

FeatureDesign Value
100% avalanche testedGuarantees minimum 1.3 A repetitive avalanche current and 110 mJ single-pulse energy at Tj = 25 °C
Extremely high dv/dt capability12 V/ns rating validated per JEDEC JESD24-11, enabling noise-immune operation in half-bridge layouts
Very low intrinsic capacitanceCiss = 334 pF and Crss = 5 pF reduce Miller effect and improve turn-off controllability
Zener-protected gateIntegrated back-to-back 30 V Zeners eliminate need for external gate clamps in most industrial designs
Improved diode reverse recoverytrr = 173 ns and Qrr = 778 nC at 25 °C enable lower EMI and reduced body-diode losses in synchronous rectification

Applications

AC-DC Power SuppliesIndustrial Motor Drives

Use Scenario: Primary-side switch in 65–150 W offline flyback and forward converters with universal AC input.

IC Role / Device Role / Timing Role: High-voltage switching element controlling energy transfer during PWM on-time; operates at 65–135 kHz.

Use Value: Low RDS(on) and 11 nC Qg minimize conduction and switching losses, improving efficiency by ≥0.8% over legacy 600 V MOSFETs.

Use Scenario: Upper-leg switch in 3-phase IGBT/MOSFET inverter stages for HVAC blowers and pump controllers.

IC Role / Device Role / Timing Role: High-side switching device in hard-switched topology; handles 400 V DC link with 12 V/ns voltage transients.

Use Value: 12 V/ns dv/dt immunity and 110 mJ EAS prevent false triggering and destructive failure during load dump or short-circuit events.

Power Factor CorrectionLED Driver Circuits

Use Scenario: Boost switch in continuous conduction mode (CCM) PFC front-end for commercial lighting and office equipment.

IC Role / Device Role / Timing Role: Main energy storage control switch operating at 65–100 kHz; subjected to high di/dt and reverse recovery stress.

Use Value: Optimized diode trr (173 ns) and Qrr (778 nC) reduce switching losses and thermal stress on the boost diode and MOSFET.

Use Scenario: Primary-side switch in isolated LED drivers for streetlights and high-bay fixtures with 230 V AC input.

IC Role / Device Role / Timing Role: High-voltage power switch in quasi-resonant flyback topology; rated for 525 V blocking with safety margin.

Use Value: 525 V VDS rating provides 30% overvoltage headroom above 400 V DC bus, ensuring long-term reliability in outdoor environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP4N52K3Same die, TO-220 package; Rthj-case = 2.78 °C/W vs DPAK's 2.78 °C/W but higher Rthj-amb (100 vs 62.5 °C/W)Better suited for forced-air-cooled industrial modules where through-hole mounting and mechanical robustness are prioritizedSelect when board space allows larger footprint and thermal design includes heatsink mounting hardware
STU4N52K3Same die, IPAK (TO-251) package; identical Rthj-case, but no tape-and-reel option-tube onlyPreferred for wave-soldered legacy production lines or where lead-forming compatibility with TO-92 tooling is requiredChoose for cost-sensitive, medium-volume manufacturing with existing IPAK-compatible assembly infrastructure

Compared with STP4N52K3 and STU4N52K3, STD4N52K3 offers superior thermal performance in compact SMT layouts due to its DPAK tape-and-reel packaging, lower Rthj-amb, and compatibility with automated pick-and-place-making it optimal for high-density power supply PCBs.

Availability

STD4N52K3 is available at Aetrix Electronics and suitable for AC-DC power supplies, industrial motor drives, and LED driver circuits requiring stable component supply across extended product lifecycles.

Supply support for STD4N52K3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, microcontrollers, and analog ICs for industrial, automotive, and consumer markets.

STD4N52K3 belongs to the MDmesh™ K3 Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in 400–600 V applications such as server PSUs, solar inverters, and industrial automation systems.

FAQ

What is the maximum continuous drain current for STD4N52K3 at 100 °C case temperature?

The maximum continuous drain current is 2 A at TC = 100 °C, as specified in Table 1 of DS7026 Rev 3. This derating reflects thermal limits of the DPAK package under sustained high-temperature operation and must be applied in thermal design calculations for enclosed or high-ambient environments.

Does STD4N52K3 include integrated gate protection?

Yes-STD4N52K3 integrates back-to-back Zener diodes between gate and source with a 30 V breakdown voltage (V(BR)GSO), providing inherent ESD protection and eliminating the need for external gate clamping components in most standard industrial applications.

Can STD4N52K3 replace older MDmesh™ K2 devices in existing designs?

Yes-STD4N52K3 is a direct drop-in replacement for ST's MDmesh™ K2 series (e.g., STD4N52K2) with identical pinout, package, and voltage rating, but delivers lower RDS(on) (2.6 Ω vs 3.0 Ω typ.), reduced Qg, and improved dv/dt immunity-enabling efficiency gains without layout changes.

What is the safe operating area (SOA) limitation for pulsed operation at 100 µs duration?

At 100 µs pulse width and TC = 25 °C, the SOA is limited by RDS(on) to approximately 1.2 A at 400 V, as shown in Figure 1 of DS7026 Rev 3. This limit assumes no second breakdown and accounts for junction temperature rise during the pulse.

STD4N52K3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
SuperMESH3™
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
525 V
Current - Continuous Drain (Id) @ 25°C:
2.5A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.6Ohm @ 1.25A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 50µA
Gate Charge (Qg) (Max) @ Vgs:
2 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
334 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
45W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK

STD4N52K3 FAQ

1.How can I place an order for STD4N52K3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STD4N52K3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STD4N52K3 reliable?

The price and inventory of STD4N52K3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STD4N52K3 is usually 5 days.

3.What payment methods are accepted for STD4N52K3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STD4N52K3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STD4N52K3?

STD4N52K3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STD4N52K3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STD4N52K3?

For technical support, including STD4N52K3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STD4N52K3 requirements.

6.How does Aetrix verify that STD4N52K3 is sourced from the original manufacturer or authorized distributors?

All STD4N52K3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STD4N52K3 meets industry standards.

7.What is the process for return or replacement of STD4N52K3?

All STD4N52K3 units undergo pre-shipment inspection (PSI). If there is an issue with STD4N52K3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STD4N52K3 part is unused and in its original packaging.

Return procedure for STD4N52K3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STD4N52K3 Tags

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