STMicroelectronics STF10N60DM2
- Part No.:
- STF10N60DM2
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
STF10N60DM2.pdf
- Description:
- MOSFET N-CH 600V 8A TO220FP
- Quantity:
- Payment:

- Shipping:

Inventory:1,890
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STF10N60DM2 from STMicroelectronics is a high-voltage N-channel Power MOSFET in the MDmesh DM2 fast-recovery diode series, rated at 600 V VDS, 440 mΩ typ. RDS(on), and 8 A continuous drain current at TC = 25 °C. It integrates a Zener-protected gate and features extremely low Qg (15 nC) and Ciss (529 pF), enabling high-frequency switching in bridge topologies and ZVS phase-shift converters.
For engineers reviewing the STF10N60DM2 datasheet, STF10N60DM2 pinout, STF10N60DM2 application, or STF10N60DM2 equivalent, key selection criteria include its 90 ns trr, 40 V/ns diode dv/dt ruggedness, 100% avalanche-tested reliability, and TO-220FP insulated package with 2.5 kV RMS isolation rating.
Technical Context
This MOSFET employs ST's MDmesh DM2 silicon technology to simultaneously minimize conduction loss (via ultra-low RDS(on)) and switching loss (via fast-recovery body diode with Qrr = 225 nC at 25 °C). Its gate structure delivers low input capacitance and high dv/dt immunity-50 V/ns MOSFET ruggedness under VDD ≤ 480 V conditions.
The integrated body diode is optimized for hard-switched and resonant topologies: trr remains stable up to 190 ns at TJ = 150 °C, and EAS = 300 mJ ensures robust unclamped inductive switching capability without external snubbers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - supports primary-side switching in 400 V DC bus and offline SMPS applications |
| RDS(on) max | 530 mΩ - enables low conduction loss at 8 A, critical for thermal management in compact designs |
| Qg | 15 nC - reduces gate drive power and allows use of smaller, lower-cost drivers |
| trr | 90 ns - minimizes reverse recovery loss and EMI in bridge-leg commutation |
| VISO | 2.5 kV RMS - provides reinforced insulation between leads and heatsink in isolated power stages |
| dv/dt ruggedness | 50 V/ns - prevents spurious turn-on during high-slew-rate transients in half/full-bridge operation |
| EAS | 300 mJ - sustains single-pulse avalanche stress without degradation in ZVS or LLC startup events |
Pinout & Package
Supplied in TO-220FP (Type B) package: insulated plastic case with integral heatsink mounting flange, 2.5 kV RMS isolation rating, and footprint compatible with standard TO-220 heatsinks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Low-impedance control terminal; Zener-protected against ±25 V transients |
| 2 (D) | Drain | Main high-voltage power terminal; connected to internal die backside and heatsink interface |
| 3 (S) | Source | Power return path and gate reference; electrically isolated from heatsink via molded plastic |
Key Features
| Feature | Design Value |
|---|---|
| Fast-recovery body diode | Qrr = 225 nC and trr = 90 ns at 25 °C enable efficient synchronous rectification replacement in PSFB converters |
| Extremely low gate charge | Qg = 15 nC reduces driver losses and simplifies gate drive design for >100 kHz operation |
| 100% avalanche tested | Each unit validated for EAS ≥ 300 mJ ensures field reliability in unclamped inductive switching |
| Zener-protected gate | Integrated gate-source Zener clamps transients to ±25 V, eliminating need for external TVS on gate |
| High dv/dt ruggedness | 50 V/ns MOSFET immunity prevents false triggering in high-noise bridge environments |
Applications
| Server PSU Primary Switch | Industrial Motor Drive Half-Bridge |
|---|---|
Use Scenario: High-efficiency 3.3 kW server power supply operating at 100–200 kHz with active clamp forward topology. IC Role / Device Role / Timing Role: Primary-side high-side switch handling 400 V DC bus and delivering regulated +12 V output. Use Value: Low Qrr and fast trr reduce diode recovery loss by >40% versus standard superjunction MOSFETs, improving full-load efficiency by 0.8%. | Use Scenario: 7.5 kW three-phase inverter driving PMSM motor in CNC spindle control with space-constrained heatsink layout. IC Role / Device Role / Timing Role: Upper-leg switch in IGBT-replacement half-bridge module operating at 16 kHz PWM frequency. Use Value: 2.5 kV isolation and TO-220FP package eliminate need for insulating pads, reducing thermal resistance by 1.2 °C/W versus non-isolated alternatives. |
| ZVS Phase-Shift Full-Bridge | Telecom Rectifier Module |
Use Scenario: 2.5 kW telecom rectifier using phase-shifted full-bridge with zero-voltage switching to achieve >96% efficiency at 48 V output. IC Role / Device Role / Timing Role: Lagging-leg switch subjected to hard-commutation during ZVS transition dead-time. Use Value: 50 V/ns dv/dt ruggedness and 100% avalanche testing prevent failure during transient overvoltage spikes during soft-start and load dump. | Use Scenario: Hot-swappable -48 V DC/DC converter module in carrier-grade base station requiring 15-year field life and no derating at 70 °C ambient. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier replacement in LLC resonant converter with 300 kHz switching. Use Value: Stable RDS(on) vs. temperature (±10% from -55 to 150 °C) ensures predictable conduction loss across full operating range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STF10N60DM6 | RDS(on) max = 450 mΩ, Qg = 13.5 nC, trr = 75 ns - improved switching speed but higher cost | Better suited for >300 kHz ZVS designs where Qrr reduction outweighs RDS(on) trade-off | Select when optimizing for peak efficiency above 200 kHz; verify gate drive strength due to lower threshold voltage (VGS(th) = 2.5–3.5 V) |
| IPP60R099C7 | RDS(on) max = 99 mΩ, Qg = 36 nC, no integrated fast diode - requires external anti-parallel SiC Schottky | Lower conduction loss but higher system complexity and EMI risk in hard-switched bridges | Prefer for high-current, low-frequency (<50 kHz) industrial inverters where thermal margin dominates switching loss |
Compared with STF10N60DM6 and IPP60R099C7, STF10N60DM2 delivers optimal balance of low gate charge, proven fast-recovery diode integration, and cost-effective TO-220FP packaging-making it ideal for mid-power telecom and server PSUs where reliability and ease of implementation are prioritized over marginal efficiency gains.
Availability
STF10N60DM2 is available at Aetrix Electronics and suitable for server power supplies, industrial motor drives, ZVS phase-shift converters, and telecom rectifier modules requiring stable component supply and long-term lifecycle support.
Supply support for STF10N60DM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
The MDmesh DM2 product line targets high-efficiency AC-DC and DC-DC conversion, specifically engineered to replace older superjunction MOSFETs in demanding resonant and phase-shifted topologies while maintaining robustness and manufacturability.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The STF10N60DM2 supports 5 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS11668 Rev 2. This derating reflects thermal limits of the TO-220FP package with RthJC = 5 °C/W; actual achievable current depends on heatsink performance and ambient conditions.
Does the body diode require external snubbering in hard-switched bridge applications?
No external snubber is required for typical hard-switched operation due to the device's 90 ns trr and 40 V/ns diode dv/dt rating. However, in high-di/dt (>500 A/µs) or high-VDD (>400 V) conditions, a small RC network across D–S may further suppress ringing per Figure 15 test circuit guidelines.
Can STF10N60DM2 be used as a direct replacement for STF10N60M2?
No-it is not a drop-in replacement. While both share the same package and voltage rating, STF10N60DM2 has significantly lower Qrr (225 nC vs. 1200 nC) and trr (90 ns vs. 250 ns), requiring gate drive timing adjustments. Its lower RDS(on) also increases peak current stress during turn-on if gate resistance is unchanged.
What is the safe operating area (SOA) limitation at 10 ms pulse width?
At tp = 10 ms, the SOA is limited by RDS(on) to approximately 4 A at 400 V VDS, as shown in Figure 1. This reflects thermal constraints rather than avalanche or breakdown limits, and operation must remain within the bounded curve to avoid secondary breakdown or thermal runaway.
STF10N60DM2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ DM2
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 530mOhm @ 4A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 15 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 529 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 25W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220FP
STF10N60DM2 FAQ
1.How can I place an order for STF10N60DM2 through Aetrix?
Please submit a Request for Quotation (RFQ) for STF10N60DM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STF10N60DM2 reliable?
The price and inventory of STF10N60DM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF10N60DM2 is usually 5 days.
3.What payment methods are accepted for STF10N60DM2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF10N60DM2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STF10N60DM2?
STF10N60DM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STF10N60DM2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STF10N60DM2?
For technical support, including STF10N60DM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF10N60DM2 requirements.
6.How does Aetrix verify that STF10N60DM2 is sourced from the original manufacturer or authorized distributors?
All STF10N60DM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF10N60DM2 meets industry standards.
7.What is the process for return or replacement of STF10N60DM2?
All STF10N60DM2 units undergo pre-shipment inspection (PSI). If there is an issue with STF10N60DM2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STF10N60DM2 part is unused and in its original packaging.
Return procedure for STF10N60DM2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STF10N60DM2 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

