STMicroelectronics STF12N60M2
- Part No.:
- STF12N60M2
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
STF12N60M2.pdf
- Description:
- MOSFET N-CH 600V 9A TO220FP
- Quantity:
- Payment:

- Shipping:

Inventory:947
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Product details
Overview
STF12N60M2 from STMicroelectronics is an N-channel 600 V, 395 mΩ typ., 9 A MDmesh M2 Power MOSFET in TO-220FP package, optimized for high-efficiency SMPS, PFC stages, and industrial motor drives with low turn-off switching losses and Zener-protected gate.
For engineers reviewing the STF12N60M2 datasheet, STF12N60M2 pinout, STF12N60M2 application, or STF12N60M2 equivalent, key selection criteria include avalanche ruggedness (117 mJ), COSS profile (29 pF), gate charge (16 nC), dv/dt capability (50 V/ns), and insulated case rating (2.5 kV RMS).
Technical Context
This MOSFET employs ST's MDmesh M2 strip layout and enhanced vertical structure to simultaneously reduce RDS(on) and output capacitance while maintaining high voltage blocking. Its Zener-protected gate and 100% avalanche-tested construction ensure robustness in hard-switching and inductive load conditions.
The device delivers low turn-off losses via minimized Qgd (8.5 nC) and optimized Crss (1.1 pF), enabling efficient operation at high frequencies up to 100 kHz in continuous conduction mode converters. Its 5 °C/W RthJC supports thermal management in compact heatsinked designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Supports primary-side switching in universal-input offline SMPS up to 400 V DC bus. |
| RDS(on) typ. | 395 mΩ at VGS = 10 V, ID = 4.5 A - Enables <1.8 W conduction loss at 9 A, critical for thermal budget in sealed enclosures. |
| Qg / Qgd | 16 nC total gate charge, 8.5 nC gate-drain charge - Reduces driver power demand and improves switching efficiency in high-frequency PFC. |
| EAS | 117 mJ single-pulse avalanche energy - Allows reliable unclamped inductive switching without external snubbers in motor control H-bridges. |
| VISO | 2.5 kV RMS insulation withstand - Permits direct mounting to grounded heatsinks in Class I safety-compliant AC/DC adapters. |
| dv/dt ruggedness | 50 V/ns - Ensures noise-immune operation in fast-edge gate drive circuits without false turn-on in multi-MOSFET stacks. |
| COSS | 29 pF at VDS = 100 V - Low stored output capacitance reduces turn-on loss and improves light-load efficiency in resonant topologies. |
Pinout & Package
TO-220FP (Type B) package: insulated plastic case with integral heatsink tab, 3-pin through-hole mounting, 5 °C/W junction-to-case thermal resistance, and 2.5 kV RMS isolation between leads and heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | High-impedance MOSFET control terminal; requires ≤±25 V drive; Zener-clamped to protect against ESD and overvoltage transients. |
| 2 (D) | Drain | High-voltage power terminal connected to drain region; electrically isolated from heatsink by molded plastic body. |
| 3 (S) | Source | Power return path and gate reference node; bonded directly to source metallization; forms common reference for gate drive circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| MDmesh M2 technology | Combines ultra-low RDS(on) and reduced COSS via optimized strip layout and vertical doping profile for high-voltage efficiency. |
| 100% avalanche tested | Each unit validated for 2.6 A repetitive avalanche current and 117 mJ single-pulse energy-no derating required in inductive switching. |
| Zener-protected gate | Integrated gate-body Zener clamps VGS to ±20 V during transients, eliminating need for external gate protection components. |
| Low Qgd/Crss ratio | 8.5 nC Qgd and 1.1 pF Crss minimize Miller effect, enabling stable 100+ kHz operation with standard gate drivers. |
| Insulated TO-220FP package | 2.5 kV RMS isolation allows direct heatsink mounting without insulating pads-reducing thermal resistance and assembly cost. |
Applications
| Server PSU Primary Switch | Industrial PFC Boost Stage |
|---|---|
|
Use Scenario: High-density 1 kW server power supply operating at 75 kHz with active clamp forward topology. IC Role / Device Role / Timing Role: Primary-side high-voltage switch handling 400 V DC bus and 9 A peak current. Use Value: 395 mΩ RDS(on) and 16 nC Qg enable >95% efficiency at full load; 2.5 kV isolation simplifies heatsink integration. |
Use Scenario: Three-phase industrial PFC module requiring 600 V blocking and low EMI in 25 kHz boost converter. IC Role / Device Role / Timing Role: Fast-switching boost switch with low Qgd to suppress di/dt-induced noise in shared gate drive layouts. Use Value: 50 V/ns dv/dt ruggedness prevents spurious turn-on; 29 pF COSS reduces switching loss and EMI filter size. |
| Motor Drive Half-Bridge | LED Driver Flyback Switch |
|
Use Scenario: 750 W brushless DC motor inverter with discrete half-bridge configuration and 10 kHz PWM. IC Role / Device Role / Timing Role: Low-side switching element subjected to repetitive unclamped inductive energy during commutation. Use Value: 117 mJ EAS rating eliminates need for external avalanche-rated snubbers; 150 °C max TJ supports sealed enclosure operation. |
Use Scenario: Isolated 120 W constant-current LED driver using quasi-resonant flyback with 60 kHz switching. IC Role / Device Role / Timing Role: Main power switch managing 600 V transient spikes during demagnetization phase. Use Value: 600 V V(BR)DSS with <1 µA IDSS ensures long-term reliability under high-humidity conditions; low COSS improves QR timing accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP12N60M2 | Same die, TO-220 (non-insulated) package; RthJC = 4.5 °C/W; no VISO rating. | Requires insulating pad for heatsink mounting; unsuitable for Class I safety-critical designs. | Select when thermal performance is prioritized over safety isolation and board space permits pad installation. |
| FDPF12N60NZ | ON Semiconductor SuperFET II; 420 mΩ RDS(on); 18 nC Qg; 2.5 kV isolation not specified. | Lacks certified VISO rating; higher Qg increases driver loss at >50 kHz; lower avalanche energy (75 mJ). | Acceptable for non-safety-certified industrial controls where cost sensitivity outweighs isolation and ruggedness requirements. |
Compared with STP12N60M2 and FDPF12N60NZ, STF12N60M2 uniquely combines certified 2.5 kV isolation, 117 mJ avalanche energy, and 395 mΩ RDS(on) in a single TO-220FP package-making it the only option qualified for safety-critical, high-reliability offline power conversion without design compromises.
Availability
STF12N60M2 is available at Aetrix Electronics and suitable for server power supplies, industrial PFC modules, motor drive inverters, and LED driver flyback converters requiring stable component supply and long-term lifecycle support.
Supply support for STF12N60M2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
STF12N60M2 belongs to the MDmesh M2 high-voltage Power MOSFET product line, engineered specifically for high-efficiency, high-reliability offline power conversion systems demanding low conduction and switching losses.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The STF12N60M2 supports 5.7 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS11073 Rev 2. This derating reflects thermal limits imposed by its 5 °C/W RthJC and 150 °C maximum junction temperature, ensuring safe operation in thermally constrained environments without forced airflow.
Does the TO-220FP package provide galvanic isolation between leads and heatsink?
Yes-the TO-220FP (Type B) package features molded plastic insulation that provides 2.5 kV RMS withstand voltage between all three leads and the external heatsink surface for 1 second at 25 °C, enabling direct mechanical mounting without insulating hardware or thermal pads.
How does the MDmesh M2 technology improve switching performance versus standard planar MOSFETs?
MDmesh M2 uses a fine-pitch strip layout and optimized vertical doping to reduce both RDS(on) and COSS simultaneously. This yields lower turn-off energy (Eoff), improved dv/dt immunity (50 V/ns), and reduced gate charge (16 nC), enabling higher frequency operation with lower losses than conventional 600 V planar devices.
Is the STF12N60M2 suitable for use in zero-voltage switching (ZVS) resonant converters?
Yes-its low COSS (29 pF), low Crss (1.1 pF), and tightly controlled Coss eq. (106 pF across 0–480 V) support predictable resonant tank behavior. The 16 nC Qg and Zener-protected gate also enhance ZVS reliability at high frequencies up to 300 kHz in LLC and phase-shifted full-bridge topologies.
STF12N60M2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ M2
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 9A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 450mOhm @ 4.5A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 16 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 538 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 25W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220FP
STF12N60M2 FAQ
1.How can I place an order for STF12N60M2 through Aetrix?
Please submit a Request for Quotation (RFQ) for STF12N60M2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STF12N60M2 reliable?
The price and inventory of STF12N60M2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF12N60M2 is usually 5 days.
3.What payment methods are accepted for STF12N60M2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF12N60M2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STF12N60M2?
STF12N60M2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STF12N60M2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STF12N60M2?
For technical support, including STF12N60M2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF12N60M2 requirements.
6.How does Aetrix verify that STF12N60M2 is sourced from the original manufacturer or authorized distributors?
All STF12N60M2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF12N60M2 meets industry standards.
7.What is the process for return or replacement of STF12N60M2?
All STF12N60M2 units undergo pre-shipment inspection (PSI). If there is an issue with STF12N60M2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STF12N60M2 part is unused and in its original packaging.
Return procedure for STF12N60M2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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