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STMicroelectronics STF16N65M2

Part No.:
STF16N65M2
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-220-3 Full Pack
Datasheet:
AetrixSTF16N65M2.pdf
Description:
MOSFET N-CH 650V 11A TO220FP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:998

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Product details

Overview

STF16N65M2 from STMicroelectronics is an N-channel 650 V, 11 A MDmesh M2 Power MOSFET in TO-220FP package with 320 mΩ typical RDS(on), 19.5 nC total gate charge, and 360 mJ single-pulse avalanche energy-designed for high-efficiency AC-DC and DC-DC converters operating at >100 kHz switching frequencies.

For engineers reviewing the STF16N65M2 datasheet, STF16N65M2 pinout, STF16N65M2 application, or STF16N65M2 equivalent, key selection criteria include its low Coss (32 pF), Zener-protected gate, 100% avalanche tested ruggedness, and insulated package enabling direct heatsink mounting without isolation hardware.

Technical Context

This MOSFET employs ST's MDmesh M2 strip layout and optimized vertical structure to simultaneously reduce conduction loss (RDS(on)) and switching loss (Qgd/Qg ratio of 0.43). Its 189 pF Coss,eq over 0–520 V enables predictable soft-switching behavior in resonant topologies.

The device integrates a fast-recovery body diode (trr = 342 ns at 25 °C) with low Qrr (3.5 µC) and IRRM = 20.4 A, supporting synchronous rectification and hard-switched PFC stages where diode reverse recovery stress must be minimized.

Key Specifications

ParameterValue and Actual Design Meaning
VDS650 V - supports 400 VAC input systems with ≥20% margin against line surges
RDS(on) max360 mΩ - limits conduction loss to ≤4.3 W at 11 A continuous drain current
Qg19.5 nC - enables efficient gate drive with <1 W driver power at 200 kHz
EAS360 mJ - withstands unclamped inductive switching events in motor drives and SMPS
VISO2.5 kV RMS - eliminates need for insulating pads when mounted to grounded heatsinks
Coss,eq189 pF - reduces capacitive turn-off loss and improves ZVS initiation in LLC converters
tr/tf8.2/11.3 ns - supports clean edge control in high-frequency half-bridge configurations

Pinout & Package

TO-220FP (Type B) package with insulated tab: electrically isolated metal backside rated for 2.5 kV RMS insulation; compact 10.4 mm height; footprint compatible with standard TO-220 heatsink clips.

Pin/TerminalCircuit RoleDesign Meaning
1 (G)GateHigh-impedance MOSFET control terminal; requires ≤±25 V drive; Zener-clamped internally
2 (D)DrainMain high-side power terminal; connected to internal die backside; electrically isolated from tab
3 (S)SourcePower return path and gate reference; bonded directly to source metallization; low-inductance connection

Key Features

FeatureDesign Value
Extremely low gate charge19.5 nC total charge enables <1 W gate driver dissipation at 200 kHz switching
Optimized Coss profile32 pF measured at 100 V, but 189 pF Coss,eq over full 0–520 V range ensures consistent soft-switching
Very low turn-off switching lossesQgd/Qg = 0.43 minimizes Miller-induced voltage overshoot during dV/dt transitions
Zener-protected gateIntegrated 25 V gate-source Zener clamps transients without external TVS diodes
100% avalanche testedEach unit validated to 360 mJ EAS at 25 °C-guarantees ruggedness in unclamped inductive loads

Applications

Server PSU Primary SwitchIndustrial PFC Boost Stage

Use Scenario: 3.3 kW front-end converter in 1U server power supply operating at 125 kHz with active clamp forward topology.

IC Role / Device Role / Timing Role: High-side primary switch handling 11 A RMS current and 520 V DC bus with ZVS-assisted turn-on.

Use Value: Low Coss,eq (189 pF) and fast tf (11.3 ns) reduce dead-time loss and improve efficiency by 0.4% at full load vs. legacy 600 V MOSFETs.

Use Scenario: Continuous conduction mode (CCM) boost PFC stage in factory automation drive feeding 690 VAC three-phase input.

IC Role / Device Role / Timing Role: Fast-switching boost switch managing 11 A peak current with 15 V/ns diode recovery dv/dt immunity.

Use Value: 342 ns trr and 3.5 µC Qrr cut diode recovery loss by 37% versus standard superjunction devices, lowering thermal stress on heatsink.

Solar Microinverter H-BridgeEV Onboard Charger DC-DC Stage

Use Scenario: Full-bridge DC-AC inverter stage in 1.2 kW residential solar microinverter using SiC diode hybrid configuration.

IC Role / Device Role / Timing Role: Low-side switch in phase-leg topology requiring robust body diode commutation at 50 kHz.

Use Value: 20.4 A IRRM and 1.6 V VSD ensure reliable bidirectional current handling during zero-voltage switching transitions.

Use Scenario: Isolated DC-DC stage in 6.6 kW EV onboard charger converting 400 V battery to 14 V auxiliary rail.

IC Role / Device Role / Timing Role: Primary-side switch in asymmetric half-bridge LLC resonant converter with 2.5 kV isolation barrier.

Use Value: 2.5 kV VISO rating allows direct mounting to chassis-grounded heatsink-eliminating insulator pads and reducing thermal resistance by 1.2 °C/W.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP16N65M2Same die, TO-220 (non-isolated) package; no VISO rating; RthJC = 4.5 °C/W vs. 5.0 °C/WRequires external insulator for heatsink mounting; higher thermal performance but lower safety marginSelect when cost-sensitive industrial designs permit added isolation hardware and tighter thermal budget
IPP65R190C7Infineon CoolMOS C7; 190 mΩ RDS(on); 22 nC Qg; no integrated gate Zener; 2 kV VISO (if in TO-247-4L)Lower conduction loss but higher gate drive demand; requires external gate protectionPrefer when optimizing for ultra-high efficiency >96% at light load, accepting added BOM complexity

Compared with STP16N65M2, STF16N65M2 trades 0.5 °C/W higher junction-to-case thermal resistance for 2.5 kV isolation-enabling safer, simpler mechanical integration. Versus IPP65R190C7, it offers lower Qg and built-in gate protection at the cost of 40 mΩ higher RDS(on), favoring reliability-critical 24/7 operation.

Availability

STF16N65M2 is available at Aetrix Electronics and suitable for server power supplies, industrial PFC modules, solar microinverters, and EV onboard chargers requiring stable component supply across multi-year production cycles.

Supply support for STF16N65M2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and power applications since 1987.

This device belongs to ST's MDmesh™ M2 superjunction MOSFET product line-engineered specifically for high-efficiency, high-frequency switched-mode power supplies demanding low switching loss and robust avalanche capability.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STF16N65M2 supports 6.9 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS10678 Rev 2. This derating reflects thermal limitations of the TO-220FP package, not device degradation. At this condition, RDS(on) rises to ~470 mΩ due to temperature coefficient, resulting in ~22 W conduction loss-requiring ≥100 cm² heatsink area with forced air.

Does the body diode support synchronous rectification in LLC resonant converters?

Yes-the integrated body diode has trr = 342 ns and Qrr = 3.5 µC at 25 °C, with IRRM = 20.4 A, making it suitable for synchronous rectification in sub-200 kHz LLC topologies. However, its VSD = 1.6 V at 11 A is higher than discrete Schottky diodes, so efficiency gain depends on duty cycle and frequency-dependent switching loss trade-offs.

Can STF16N65M2 replace STW16N65M2 in existing designs?

No-STW16N65M2 uses TO-247 package with lower RthJC (3.5 °C/W) and higher PTOT (190 W), while STF16N65M2 (TO-220FP) is limited to 25 W at TC = 25 °C. Direct replacement would cause thermal runaway unless heatsink area is increased by ≥3× and PCB copper pour is expanded to handle 5 °C/W junction-to-ambient rise.

Is the 2.5 kV VISO rating certified to any safety standard?

The 2.5 kV RMS insulation rating is verified per IEC 60747-5-2 for basic insulation, with test duration of 1 second at TC = 25 °C. It meets requirements for reinforced insulation in EN 62368-1 Class II equipment but does not constitute UL/CSA recognition-designers must validate system-level creepage/clearance and perform end-product certification.

STF16N65M2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ M2
Package/Case:
TO-220-3 Full Pack
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
11A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
360mOhm @ 5.5A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
19.5 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
718 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
25W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220FP

STF16N65M2 FAQ

1.How can I place an order for STF16N65M2 through Aetrix?

Please submit a Request for Quotation (RFQ) for STF16N65M2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STF16N65M2 reliable?

The price and inventory of STF16N65M2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF16N65M2 is usually 5 days.

3.What payment methods are accepted for STF16N65M2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF16N65M2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STF16N65M2?

STF16N65M2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STF16N65M2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STF16N65M2?

For technical support, including STF16N65M2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF16N65M2 requirements.

6.How does Aetrix verify that STF16N65M2 is sourced from the original manufacturer or authorized distributors?

All STF16N65M2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF16N65M2 meets industry standards.

7.What is the process for return or replacement of STF16N65M2?

All STF16N65M2 units undergo pre-shipment inspection (PSI). If there is an issue with STF16N65M2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STF16N65M2 part is unused and in its original packaging.

Return procedure for STF16N65M2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STF16N65M2 Tags

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