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STMicroelectronics STF26N65DM2

Part No.:
STF26N65DM2
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-220-3 Full Pack
Datasheet:
AetrixSTF26N65DM2.pdf
Description:
MOSFET N-CH 650V 20A TO220FP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,024

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Product details

Overview

STF26N65DM2 from STMicroelectronics is a high-voltage N-channel MDmesh™ DM2 Power MOSFET in TO-220FP package, rated 650 V VDS, 0.190 Ω RDS(on) max, 20 A continuous drain current, and featuring fast-recovery body diode (trr = 100 ns @ Tj = 25 °C) and 100% avalanche tested (EAS = 530 mJ). It is engineered for ZVS phase-shift converters and bridge topologies in industrial SMPS.

For engineers reviewing the STF26N65DM2 datasheet, STF26N65DM2 pinout, STF26N65DM2 application, or STF26N65DM2 equivalent, key selection criteria include dv/dt ruggedness (50 V/ns), low Qg (35.5 nC), Coss,eq (140 pF), avalanche energy rating, and TO-220FP thermal resistance (Rthj-case = 4.2 °C/W).

Technical Context

This MOSFET employs ST's MDmesh™ DM2 silicon process to simultaneously minimize conduction loss (RDS(on) = 0.156 Ω typ.) and switching loss via ultra-low gate charge (Qg = 35.5 nC) and optimized output capacitance (Coss,eq = 140 pF at 0–520 V). Its fast-recovery body diode achieves trr = 100 ns and Qrr = 0.365 µC under standard test conditions (ISD = 20 A, di/dt = 100 A/µs).

The device is fully characterized for high-dv/dt operation (50 V/ns) and unclamped inductive switching, with guaranteed single-pulse avalanche capability (IAR = 3 A, EAS = 530 mJ) and insulation withstand voltage of 2500 VRMS between leads and heatsink - critical for isolated high-voltage power stages.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 650 V - Maximum blocking voltage compatible with 400 V DC bus + 20% margin in telecom/server PSUs
RDS(on) max 0.190 Ω - Enables <1.9 W conduction loss at 10 A, supporting thermally constrained TO-220FP layout
Qg 35.5 nC - Reduces gate drive power and enables >200 kHz operation with standard 1-A drivers
trr 100 ns - Minimizes commutation loss and EMI in hard-switched bridges and LLC resonant tanks
EAS 530 mJ - Ensures robustness against transient overloads without external snubbers in flyback/ZVS designs
Rthj-case 4.2 °C/W - Allows 30 W dissipation with ≤126 °C junction rise above 25 °C case temperature

Pinout & Package

TO-220FP package: insulated flange, vertical mounting, 3-pin through-hole outline with integrated heatsink isolation (2500 VRMS rating). Flange is electrically connected to drain (D).

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate High-impedance control terminal; requires <35.5 nC charge for full enhancement; sensitive to ESD
2 (D) Drain High-side switching node; tied to insulated flange; supports 650 V blocking and 2500 V isolation to heatsink
3 (S) Source Power return path and gate reference; forms common node with driver ground in half-bridge configurations

Key Features

Feature Design Value
Fast-recovery body diode trr = 100 ns / Qrr = 0.365 µC - Enables zero-voltage switching in phase-shifted full-bridge without external diode
Extremely low gate charge Qg = 35.5 nC - Reduces driver losses and simplifies gate drive design for high-frequency (>300 kHz) topologies
100% avalanche tested EAS = 530 mJ - Guarantees ruggedness under unclamped inductive switching, eliminating need for derating in harsh transients
Zener-protected gate VGS = ±25 V rating with integrated gate oxide protection - Prevents failure from gate overvoltage during layout parasitics or ESD events

Applications

Telecom Rectifier Modules Industrial Server PSUs

Use Scenario: 48 V input, 3.3/12 V dual-output, 1.5 kW phase-shifted full-bridge converter with synchronous rectification.

IC Role / Device Role / Timing Role: High-side primary switch in ZVS topology; operates at 100–200 kHz with soft turn-on enabled by fast body diode recovery.

Use Value: Low Qrr (0.365 µC) reduces dead-time losses by >15% vs. standard superjunction MOSFETs, improving efficiency at full load.

Use Scenario: 380 V DC-link, 2 kW LLC resonant converter powering CPU/GPU VRMs in datacenter servers.

IC Role / Device Role / Timing Role: Primary-side switch handling high dv/dt stress during resonant transitions; flange-isolated TO-220FP simplifies heatsinking in dense layouts.

Use Value: 50 V/ns dv/dt ruggedness prevents spurious turn-on; 2500 VRMS isolation eliminates need for insulating pads in chassis-grounded systems.

Solar Microinverters EV Onboard Chargers

Use Scenario: 600 V-class string-level DC/AC inverter using H-bridge topology with transformerless design.

IC Role / Device Role / Timing Role: Bridge leg switch subjected to bidirectional current and reverse recovery stress during PWM commutation.

Use Value: Fast body diode (trr = 100 ns) minimizes shoot-through risk and reduces EMI generation during freewheeling intervals.

Use Scenario: 400–800 V battery-range AC/DC OBC using dual-phase interleaved PFC + CLLC DC/DC stage.

IC Role / Device Role / Timing Role: Secondary-side high-voltage switch in CLLC resonant tank; handles high peak currents (IDM = 53 A) during burst-mode operation.

Use Value: 53 A pulsed drain rating and 12.6 A continuous current at 100 °C case enable compact thermal design without forced air cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STF24N65M2 650 V, 0.220 Ω RDS(on) max, 24 A ID, same TO-220FP package, but MDmesh™ M2 process (higher Qrr: 0.52 µC) Higher conduction loss and slower diode recovery reduce ZVS effectiveness above 150 kHz Select when cost sensitivity outweighs efficiency targets and operating frequency remains <120 kHz
IPP65R190CFD7 650 V, 0.190 Ω RDS(on), TO-220FP, CoolMOS™ CFD7 with faster trr (75 ns) but lower EAS (320 mJ) Lacks 100% avalanche testing; insufficient for unclamped inductive loads in industrial motor drives Prefer only in well-clamped, high-frequency (<300 kHz) consumer-grade SMPS where avalanche stress is absent

Compared with STF24N65M2 and IPP65R190CFD7, STF26N65DM2 uniquely balances low RDS(on), ultra-low Qrr, and certified avalanche ruggedness - making it the only choice for mission-critical ZVS bridge converters requiring both efficiency and fault tolerance.

Availability

STF26N65DM2 is available at Aetrix Electronics and suitable for telecom rectifier modules, industrial server PSUs, solar microinverters, and EV onboard chargers requiring stable component supply across multi-year production cycles.

Supply support for STF26N65DM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.

STF26N65DM2 belongs to the MDmesh™ DM2 high-voltage power MOSFET product line, developed specifically for high-efficiency, high-frequency switched-mode power supplies demanding low Qrr, high dv/dt immunity, and guaranteed avalanche performance.

FAQ

What is the maximum safe operating temperature for STF26N65DM2?

The STF26N65DM2 has an operating junction temperature range of –55 °C to 150 °C. With Rthj-case = 4.2 °C/W and PTOT = 30 W at Tcase = 25 °C, sustained operation requires case temperature ≤100 °C to maintain Tj ≤150 °C. Derating is mandatory above 25 °C case temperature per the datasheet's thermal curve.

Does STF26N65DM2 require a gate resistor for stability?

Yes - a gate resistor (typically 4.7 Ω) is required to dampen ringing caused by PCB trace inductance interacting with Qg and Ciss. The datasheet's switching time test circuit (Figure 13) specifies RG = 4.7 Ω, and omitting it risks oscillation, increased EMI, and gate oxide overstress during fast dv/dt events.

Can STF26N65DM2 replace older STF26NM60ND in existing designs?

No - although both are TO-220FP N-channel 650 V MOSFETs, STF26NM60ND uses MDmesh™ II technology with higher RDS(on) (0.220 Ω), slower trr (220 ns), and no Zener gate protection. Direct replacement would increase conduction loss, reduce ZVS margin, and risk gate failure under transient overvoltage.

Is the TO-220FP flange electrically isolated from all pins?

No - the insulated flange is internally connected to the drain (Pin 2). The 2500 VRMS isolation rating applies only between the flange (drain) and external heatsink; source (Pin 3) and gate (Pin 1) remain at their respective circuit potentials and must be insulated from the heatsink per standard layout practices.

STF26N65DM2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ DM2
Package/Case:
TO-220-3 Full Pack
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
20A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
190mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
35.5 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
1480 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
30W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220FP

STF26N65DM2 FAQ

1.How can I place an order for STF26N65DM2 through Aetrix?

Please submit a Request for Quotation (RFQ) for STF26N65DM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STF26N65DM2 reliable?

The price and inventory of STF26N65DM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF26N65DM2 is usually 5 days.

3.What payment methods are accepted for STF26N65DM2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF26N65DM2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STF26N65DM2?

STF26N65DM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STF26N65DM2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STF26N65DM2?

For technical support, including STF26N65DM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF26N65DM2 requirements.

6.How does Aetrix verify that STF26N65DM2 is sourced from the original manufacturer or authorized distributors?

All STF26N65DM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF26N65DM2 meets industry standards.

7.What is the process for return or replacement of STF26N65DM2?

All STF26N65DM2 units undergo pre-shipment inspection (PSI). If there is an issue with STF26N65DM2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STF26N65DM2 part is unused and in its original packaging.

Return procedure for STF26N65DM2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STF26N65DM2 Tags

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