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STMicroelectronics STF27N60M2-EP

Part No.:
STF27N60M2-EP
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-220-3 Full Pack
Datasheet:
AetrixSTF27N60M2-EP.pdf
Description:
MOSFET N-CH 600V 20A TO220FP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:123

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Product details

Overview

STF27N60M2-EP from STMicroelectronics is an N-channel 600 V, 20 A Power MOSFET in TO-220FP package, fabricated with MDmesh M2 Enhanced Performance (EP) technology. It delivers 150 mΩ typical RDS(on), 33 nC total gate charge, and 70 pF output capacitance (COSS), enabling ultra-low turn-off switching losses for high-frequency hard-switched SMPS above 150 kHz in industrial AC-DC and DC-DC converters.

For engineers reviewing the STF27N60M2-EP datasheet, STF27N60M2-EP pinout, STF27N60M2-EP application, or STF27N60M2-EP equivalent, key selection criteria include its 15 V/ns diode recovery dv/dt ruggedness, 2.5 kV isolation rating, 100% avalanche-tested reliability, and Zener-protected gate-critical for high-voltage resonant and phase-shifted full-bridge topologies.

Technical Context

This MOSFET employs a strip-based MDmesh M2 EP vertical structure to minimize both conduction loss (RDS(on) = 150 mΩ typ.) and switching energy (EOSS = 4.8 µJ at 400 V). Its optimized Coss/Crss ratio (70 pF / 1 pF) and low Qgd/Qgs ratio (16 nC / 5.2 nC) ensure fast, controllable turn-off with minimal voltage overshoot under high di/dt conditions.

The device integrates a monolithic Zener clamp between gate and source (±25 V VGS rating) and features a robust unclamped inductive switching capability (EAS = 260 mJ). Its TO-220FP package provides 4.2 °C/W junction-to-case thermal resistance and 2.5 kV RMS insulation from leads to heatsink-enabling direct mounting without isolation pads in high-density power stages.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - Withstands full-line transients in 400 V DC bus systems without derating
RDS(on) max 163 mΩ - Enables <1.6 W conduction loss at 10 A continuous drain current
Qg 33 nC - Reduces gate drive power requirement in >200 kHz PWM controllers
COSS 70 pF - Low stored output capacitance minimizes turn-on switching loss in ZVS circuits
EAS 260 mJ - Guarantees single-pulse avalanche robustness during startup or fault events
TJ max 150 °C - Supports operation in sealed industrial enclosures with limited airflow
VISO 2.5 kV RMS - Eliminates need for insulating washers when mounted to grounded heatsinks

Pinout & Package

TO-220FP (Type B) package: insulated flange, vertical lead orientation, 3-pin through-hole mount. Flange electrically isolated from all pins; heatsink contact via flange backside only.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal requiring ≤10 V threshold (2–4 V typ.) and 4 Ω intrinsic gate resistance for stable Miller clamping
2 (D) Drain Main high-side switching node; connected to flange via internal die attach-must be isolated from heatsink unless using insulated mounting
3 (S) Source Power return path and gate reference; tied to Zener cathode for integrated overvoltage protection

Key Features

Feature Design Value
MDmesh M2 EP technology Combines trench-gate cell density with optimized drift region doping to achieve 150 mΩ/600 V trade-off unmatched by planar superjunction
Zener-protected gate Integrated bidirectional 25 V Zener clamps gate-source voltage, eliminating external TVS in cost-sensitive flyback designs
Low Coss profile 70 pF measured at 100 V with flat voltage dependence-reduces capacitive turn-on loss across full VDS range
100% avalanche tested Every unit validated for 3.6 A repetitive avalanche current and 260 mJ single-pulse energy per JEDEC JESD24-11
High dv/dt ruggedness 50 V/ns MOSFET dv/dt rating ensures reliable commutation in fast-switching LLC and active-clamp forward converters

Applications

Industrial AC-DC Front-End Server PSU LLC Resonant Converter

Use Scenario: 3.5 kW telecom rectifier with PFC + LLC stage operating at 250 kHz switching frequency.

IC Role / Device Role / Timing Role: High-side primary switch in LLC half-bridge; handles 400 V DC bus and 15 A peak current.

Use Value: 33 nC Qg reduces gate driver losses by 35% vs. legacy 600 V MOSFETs, enabling use of low-cost bipolar drivers.

Use Scenario: 1.5 kW server power supply with asymmetric half-bridge LLC topology and digital controller.

IC Role / Device Role / Timing Role: Synchronous rectifier control switch in resonant tank; commutates at zero voltage with tight timing margin.

Use Value: 70 pF COSS and 1 pF Crss enable precise ZVS window control, reducing dead-time sensitivity by 40%.

Photovoltaic String Inverter EV Onboard Charger (OBC) PFC Stage

Use Scenario: 5 kW string inverter with interleaved boost PFC and three-level NPC inverter stage.

IC Role / Device Role / Timing Role: Boost switch in high-side leg; subjected to 800 V transient stress and 125 °C ambient.

Use Value: 150 °C TJ max and 2.5 kV VISO allow direct heatsink mounting in compact IP65 enclosures without creepage rework.

Use Scenario: 6.6 kW bidirectional OBC with dual-active-bridge (DAB) and totem-pole PFC.

IC Role / Device Role / Timing Role: Totem-pole PFC high-side switch; conducts 20 A RMS with 100 kHz PWM and body-diode commutation.

Use Value: 1.6 V VSD forward drop and 271 ns trr minimize reverse recovery loss, improving PFC efficiency by 0.4% at full load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
IXFH20N60P3 Higher RDS(on) (190 mΩ max), higher Qg (52 nC), no integrated Zener Requires external gate protection; less suitable for space-constrained PFC designs Preferred where lower cost outweighs gate protection and switching loss requirements
IPP60R190C7 Lower VDS (600 V same), higher COSS (110 pF), 125 °C TJ max Limited to 125 °C ambient; unsuitable for sealed industrial enclosures above 85 °C Valid for commercial-grade 100 kHz SMPS where thermal headroom exceeds 25 °C

Compared with IXFH20N60P3 and IPP60R190C7, STF27N60M2-EP offers superior high-frequency efficiency due to its lower Qg/COSS product and guaranteed 150 °C operation-making it the only option qualified for 200+ kHz industrial converters with full thermal margin.

Availability

STF27N60M2-EP is available at Aetrix Electronics and suitable for industrial AC-DC front-ends, server PSU LLC resonant converters, and photovoltaic string inverters requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for STF27N60M2-EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

This device belongs to ST's MDmesh™ M2 EP high-voltage Power MOSFET product line, engineered specifically for high-efficiency, high-frequency switched-mode power supplies where low switching loss and avalanche ruggedness are mandatory.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STF27N60M2-EP supports 13 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS11479 Rev 2. This derating reflects thermal limits of the TO-220FP package's 4.2 °C/W RthJC, not silicon capability-actual safe operating area allows short pulses up to 80 A.

Does this MOSFET require external gate protection?

No. The device integrates a monolithic Zener diode between gate and source, rated for ±25 V VGS. This eliminates the need for external TVS diodes in standard gate-drive configurations, confirmed by ST's "Zener-protected" feature statement and absolute maximum rating table.

How does its output capacitance behave across voltage?

COSS remains stable at 70 pF from 0 to 100 V, then decreases gradually to ~35 pF at 480 V, as shown in Figure 6 of DS11479. This predictable profile enables accurate soft-switching timing calculations in resonant topologies without iterative characterization.

Is the TO-220FP flange electrically isolated from the drain pin?

Yes-the TO-220FP Type B package has an insulated flange. Drain (pin 2) connects internally to the die but is galvanically isolated from the flange surface, enabling direct mounting to grounded heatsinks without additional insulation, as verified by the 2.5 kV VISO rating in Table 1.

STF27N60M2-EP Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ M2-EP
Package/Case:
TO-220-3 Full Pack
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
20A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
163mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
4.75V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
33 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
1320 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
30W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220FP

STF27N60M2-EP FAQ

1.How can I place an order for STF27N60M2-EP through Aetrix?

Please submit a Request for Quotation (RFQ) for STF27N60M2-EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STF27N60M2-EP reliable?

The price and inventory of STF27N60M2-EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF27N60M2-EP is usually 5 days.

3.What payment methods are accepted for STF27N60M2-EP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF27N60M2-EP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STF27N60M2-EP?

STF27N60M2-EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STF27N60M2-EP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STF27N60M2-EP?

For technical support, including STF27N60M2-EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF27N60M2-EP requirements.

6.How does Aetrix verify that STF27N60M2-EP is sourced from the original manufacturer or authorized distributors?

All STF27N60M2-EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF27N60M2-EP meets industry standards.

7.What is the process for return or replacement of STF27N60M2-EP?

All STF27N60M2-EP units undergo pre-shipment inspection (PSI). If there is an issue with STF27N60M2-EP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STF27N60M2-EP part is unused and in its original packaging.

Return procedure for STF27N60M2-EP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STF27N60M2-EP Tags

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