STMicroelectronics STF2N62K3
- Part No.:
- STF2N62K3
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
STF2N62K3.pdf
- Description:
- MOSFET N-CH 620V 2.2A TO220FP
- Quantity:
- Payment:

- Shipping:

Inventory:729
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STF2N62K3 from STMicroelectronics is an N-channel 620 V, 2.9 Ω typ. (3.6 Ω max), 2.2 A MDmesh™ K3 Power MOSFET in TO-220FP package, featuring built-in Zener-protected gate, 12 V/ns dv/dt capability, and 85 mJ single-pulse avalanche energy - deployed in offline SMPS flyback converters requiring high-voltage switching robustness.
For engineers reviewing the STF2N62K3 datasheet, STF2N62K3 pinout, STF2N62K3 application, or STF2N62K3 equivalent, this device is evaluated for high-efficiency 65–100 W AC/DC adapters, industrial auxiliary supplies, and LED driver primary-side switches where low RDS(on), fast diode recovery (200 ns trr), and unclamped inductive switching resilience are critical selection criteria.
Technical Context
This MOSFET employs ST's MDmesh™ K3 vertical superjunction architecture optimized for high-voltage operation with reduced specific on-resistance and minimized output capacitance (Coss = 26 pF). Its integrated gate-source Zener diodes (±30 V breakdown) provide intrinsic ESD protection without external clamping components.
The device delivers enhanced dynamic performance via low gate charge (Qg = 15 nC), fast switching (td(off) = 21 ns, tf = 22 ns), and improved source-drain diode characteristics (VSD = 1.6 V at 2.2 A, Qrr = 0.9 µC), enabling efficient hard-switched topologies operating up to 150 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 620 V - supports 400 V AC mains input with ≥20% derating margin in offline converters |
| RDS(on) max | 3.6 Ω at VGS = 10 V, ID = 1.1 A - determines conduction loss in continuous 2.2 A operation |
| ID cont @ TC = 25 °C | 2.2 A - defines maximum DC current handling with heatsink at 25 °C case temperature |
| EAS | 85 mJ - enables reliable unclamped inductive switching in flyback snubberless designs |
| dv/dt capability | 12 V/ns - ensures immunity to parasitic turn-on during high-speed voltage transients |
| trr | 200 ns @ Tj = 25 °C - reduces switching loss and EMI in diode commutation phase |
| Qg | 15 nC - sets gate drive power requirement and influences switching speed control |
Pinout & Package
TO-220FP package: insulated tab (DRAIN), 3-pin through-hole outline with internal thermal isolation between drain tab and leads. Pin 1 = GATE, Pin 2 = DRAIN (tab), Pin 3 = SOURCE.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Pin 1) | Gate control terminal | Receives 10 V logic-level drive; ±30 V Zener-protected to prevent overvoltage damage |
| D (Pin 2 / Tab) | Drain connection (exposed metal tab) | High-voltage power node; electrically isolated from mounting surface (2500 V RMS insulation) |
| S (Pin 3) | Source return path | Reference node for gate drive; connects to power ground or source of upstream switch in half-bridge |
Key Features
| Feature | Design Value |
|---|---|
| MDmesh™ K3 superjunction structure | Reduces RDS(on) × area by 35% vs prior K2 generation, improving power density in compact adapters |
| 100% avalanche tested | Guarantees minimum 85 mJ single-pulse energy rating across production lot - no screening waivers |
| Zener-protected gate | Integrated back-to-back Zeners clamp VGS to ±30 V, eliminating need for external gate protection diodes |
| Low Ciss/Coss ratio | Ciss = 340 pF, Coss = 26 pF - enables stable high-frequency operation with minimal Miller effect |
| Improved diode reverse recovery | Qrr = 0.9 µC, IRRM = 9 A - lowers diode switching loss and reduces voltage overshoot in discontinuous mode |
Applications
| AC/DC Flyback Converter | Industrial Auxiliary Power Supply |
|---|---|
Use Scenario: Primary-side switch in 65 W universal-input offline flyback converter for PLC I/O modules. IC Role / Device Role / Timing Role: High-voltage power switch controlling energy transfer during PWM on-time; operates at 65 kHz with zero-voltage switching assist. Use Value: 2.9 Ω typ. RDS(on) minimizes conduction loss at 2.2 A peak current; 12 V/ns dv/dt rating prevents false triggering from transformer leakage spikes. |
Use Scenario: Main switch in 36 V/1 A auxiliary supply powering microcontroller and sensors in motor drive cabinet. IC Role / Device Role / Timing Role: Standby-mode active switch enabling >90% light-load efficiency; handles 300 V surge transients per IEC 61000-4-5. Use Value: 85 mJ EAS withstands repeated line surges without degradation; TO-220FP insulated tab allows direct heatsink mounting without isolation pads. |
| LED Driver (Primary Side) | Smart Home Power Adapter |
Use Scenario: Switching element in constant-voltage LED driver for architectural lighting (120 V AC input). IC Role / Device Role / Timing Role: Regulates output via primary-side sensing; conducts 2.2 A during 50% duty cycle at 100 kHz. Use Value: Low Qg (15 nC) enables clean gate drive with low-power controller; fast tr/tf (4.4 ns/22 ns) reduces switching loss at high frequency. |
Use Scenario: Core switch in compact 25 mm × 25 mm wall-plug adapter for smart speakers (100 W peak). IC Role / Device Role / Timing Role: High-efficiency main switch in quasi-resonant topology; operates up to 150 °C junction temperature. Use Value: Rth(j-case) = 6.25 °C/W enables thermal management with minimal heatsink; ECOPACK® RoHS-compliant packaging meets global environmental mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP2N62K3 | Same die, D²PAK package; Rth(j-case) = 2.78 °C/W (vs 6.25 °C/W); higher PTOT = 45 W | Requires PCB copper pour for thermal dissipation; unsuitable for leaded through-hole assembly | Select when board space permits large thermal pad and surface-mount reflow is available |
| FQP2N62F | 620 V, 4.2 Ω max RDS(on), no integrated Zener; Qg = 18 nC; TO-220 (non-FP) package | Lacks gate insulation and Zener protection; requires external gate clamp and heatsink isolation | Choose only if cost sensitivity outweighs design simplicity and reliability requirements |
Compared with STF2N62K3, STP2N62K3 offers superior thermal performance but demands SMT layout and PCB thermal design, while FQP2N62F increases BOM count and layout complexity due to missing integrated protections - making STF2N62K3 optimal for through-hole, thermally constrained, and high-reliability offline power stages.
Availability
STF2N62K3 is available at Aetrix Electronics and suitable for AC/DC flyback converters, industrial auxiliary power supplies, and LED driver primary-side switching requiring stable component supply and long-term manufacturing continuity.
Supply support for STF2N62K3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and power applications.
STF2N62K3 belongs to the MDmesh™ K3 Power MOSFET product line, engineered specifically for high-efficiency, high-reliability offline switching power supplies operating up to 620 V with minimal conduction and switching losses.
FAQ
What is the maximum safe operating voltage for STF2N62K3 in continuous conduction?
The absolute maximum drain-source voltage (VDS) is 620 V DC, validated under all operating conditions including temperature extremes and transient surges. Operation above 500 V DC is permitted only with ≥20% design margin and adherence to SOA limits defined in Figure 3 of DS7248 - exceeding 620 V risks irreversible avalanche failure even with short pulses.
Does STF2N62K3 require external gate protection components?
No. The device integrates back-to-back Zener diodes between gate and source with ±30 V breakdown voltage, verified per Table 8 of DS7248. This eliminates the need for external gate clamps in standard 10 V gate-drive circuits, provided VGS does not exceed ±20 V during normal operation and layout avoids excessive gate loop inductance.
How does the TO-220FP package differ from standard TO-220 in thermal and isolation performance?
TO-220FP features full electrical isolation between the drain tab and leads, rated for 2500 V RMS insulation - unlike standard TO-220 which requires insulating pads. Its Rth(j-case) is 6.25 °C/W (vs ~1.5 °C/W for non-isolated TO-220), trading thermal efficiency for safety-critical isolation in grounded-heatsink applications.
Can STF2N62K3 replace STF2NK60Z in existing 600 V designs?
Yes, with validation: STF2N62K3 offers higher VDS (620 V vs 600 V), lower RDS(on) (3.6 Ω vs 4.5 Ω max), and improved dv/dt (12 V/ns vs 8 V/ns), but shares identical TO-220FP footprint and pinout. Gate charge is slightly higher (15 nC vs 13 nC), requiring minor gate driver strength verification in high-frequency layouts.
STF2N62K3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- SuperMESH3™
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 620 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.2A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 3.6Ohm @ 1.1A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 50µA
- Gate Charge (Qg) (Max) @ Vgs:
- 15 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 340 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 20W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220FP
STF2N62K3 FAQ
1.How can I place an order for STF2N62K3 through Aetrix?
Please submit a Request for Quotation (RFQ) for STF2N62K3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STF2N62K3 reliable?
The price and inventory of STF2N62K3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF2N62K3 is usually 5 days.
3.What payment methods are accepted for STF2N62K3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF2N62K3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STF2N62K3?
STF2N62K3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STF2N62K3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STF2N62K3?
For technical support, including STF2N62K3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF2N62K3 requirements.
6.How does Aetrix verify that STF2N62K3 is sourced from the original manufacturer or authorized distributors?
All STF2N62K3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF2N62K3 meets industry standards.
7.What is the process for return or replacement of STF2N62K3?
All STF2N62K3 units undergo pre-shipment inspection (PSI). If there is an issue with STF2N62K3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STF2N62K3 part is unused and in its original packaging.
Return procedure for STF2N62K3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STF2N62K3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

