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STMicroelectronics STF30NM50N

Part No.:
STF30NM50N
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-220-3 Full Pack
Datasheet:
AetrixSTF30NM50N.pdf
Description:
MOSFET N-CH 500V 27A TO220FP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,413

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Product details

Overview

STF30NM50N from STMicroelectronics is an N-channel 500 V, 27 A, 0.090 Ω RDS(on) MDmesh™ II Power MOSFET in TO-220FP package, designed for high-efficiency switching converters operating up to 150 °C junction temperature. It delivers low gate charge (94 nC), high avalanche ruggedness (900 mJ EAS), and fast switching (tr = 20 ns) in hard-switched PFC and SMPS primary-side applications.

For engineers reviewing the STF30NM50N datasheet, STF30NM50N pinout, STF30NM50N application, or STF30NM50N equivalent, key selection criteria include its 500 V VDSS, 0.090 Ω RDS(on) at VGS = 10 V, 94 nC total gate charge, 150 °C Tj rating, and TO-220FP thermal resistance of 50 °C/W (Rthj-amb).

Technical Context

This device employs ST's second-generation MDmesh™ vertical structure with strip layout, achieving ultra-low on-resistance and gate charge simultaneously. Its 500 V breakdown voltage is rated at Tj = 150 °C, and it features 100% avalanche-tested ruggedness with 12 A IAR and 900 mJ EAS.

The integrated source-drain diode supports synchronous rectification and flyback recovery, exhibiting trr = 480 ns and Qrr = 8 µC at 25 °C. Gate input resistance is 2.7 Ω at 1 MHz, enabling stable drive with standard gate drivers without excessive damping.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 500 V - Withstands DC bus voltages up to 400 V in 800 V-class PFC stages with margin.
RDS(on) 0.090 Ω @ VGS = 10 V - Enables <1.5 W conduction loss at 13.5 A continuous drain current.
Qg 94 nC - Reduces driver power demand and enables >100 kHz operation with minimal switching loss penalty.
EAS 900 mJ - Supports unclamped inductive switching in LLC resonant and hard-switched topologies without external snubbers.
Rthj-amb 50 °C/W - Allows 40 W dissipation at ΔT = 2000 K·W with standard heatsink mounting in TO-220FP footprint.
tr/tf 20 ns / 60 ns - Enables clean edge control in ZVS/ZCS circuits with minimal overlap loss.
ID (TC = 100 °C) 17 A - Defines usable current limit in thermally constrained industrial enclosures with forced air cooling.

Pinout & Package

STF30NM50N uses the TO-220FP (Full-Pak) package: insulated plastic case with internal isolation between drain tab and mounting surface, eliminating need for insulating washers. The package provides 2500 VRMS insulation withstand voltage from all three leads to external heat sink.

Pin/Terminal Circuit Role Design Meaning
1 (Gate) Control terminal Receives 10 V logic-level drive; 2.7 Ω gate resistance minimizes ringing without external series resistor.
2 (Drain) High-side power switch node Internally connected to metal tab; electrically isolated from heatsink by molded plastic barrier.
3 (Source) Power return reference Provides low-inductance return path for load current; ties directly to PCB ground plane via wide copper pour.

Key Features

Feature Design Value
MDmesh™ II vertical structure Reduces RDS(on) × Qg figure-of-merit by 40% vs. first-gen superjunction MOSFETs, improving efficiency in 65–300 kHz converters.
100% avalanche tested Guarantees single-pulse ruggedness to 900 mJ at Tj = 25 °C, enabling reliable operation in overvoltage transients without derating.
Low Ciss/Coss ratio 2740 pF / 160 pF = 17.1 - Improves ZVS initiation in resonant topologies and reduces capacitive turn-on losses.
ECOPACK® lead-free construction Complies with RoHS and JEDEC JESD97 marking standards; second-level interconnect qualified for Pb-free reflow profiles.

Applications

Industrial Switch-Mode Power Supplies Server & Telecom Rectifiers

Use Scenario: Primary-side switch in 1–3 kW AC/DC front-end supplies with active PFC + LLC resonant stage.

IC Role / Device Role / Timing Role: High-voltage switching element handling 400 V DC bus, driven at 70–150 kHz with zero-voltage switching.

Use Value: 0.090 Ω RDS(on) limits conduction loss to ≤1.6 W at full load; 94 nC Qg enables efficient gate driving with UCC27611 or similar.

Use Scenario: Main switch in 48 V intermediate bus converters (IBCs) powering ASIC/FPGA rails in datacenter servers.

IC Role / Device Role / Timing Role: 500 V primary switch in phase-shifted full-bridge topology operating at 200–500 kHz.

Use Value: 50 °C/W Rthj-amb allows 35 W dissipation with 60 °C ambient and 200 LFM airflow-meeting 80 PLUS Titanium efficiency targets.

Motor Drive Inverters Induction Heating Systems

Use Scenario: Phase-leg switch in 3–7.5 kW variable-frequency drives for HVAC compressors and pumps.

IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in 6–16 kHz PWM inverters with regenerative braking.

Use Value: 100% avalanche rating ensures robustness during motor short-circuit events; trr = 480 ns prevents shoot-through in bidirectional current paths.

Use Scenario: Half-bridge switch in 20–100 kHz resonant tank circuits for domestic induction cooktops.

IC Role / Device Role / Timing Role: Fast-switching power device handling 10–25 A peak currents with high dv/dt stress (>10 V/ns).

Use Value: 15 V/ns dv/dt capability prevents false turn-on; 1.5 V VSD forward drop minimizes body-diode conduction loss during dead-time.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP30NM50N Same die, TO-220 (non-isolated tab); Rthj-amb = 62.5 °C/W; no 2500 V isolation. Requires insulating washer and thermal pad; unsuitable where creepage/clearance mandates reinforced isolation. Select when cost-sensitive designs use bolted heatsinks with proven isolation systems.
IPP60R099C7 Infineon CoolMOS™ C7; 650 V, 0.099 Ω, 91 nC; higher VDSS, slightly higher RDS(on). Better suited for 400 V AC-input PFC; lower EAS (520 mJ) limits unclamped inductive robustness. Select when system requires 650 V margin or tighter gate charge tolerance in digital-controlled SMPS.

Compared with STP30NM50N, STF30NM50N trades 12.5 °C/W higher Rthj-amb for guaranteed 2500 V isolation and simplified mechanical assembly; versus IPP60R099C7, it offers superior avalanche energy handling but narrower voltage headroom.

Availability

STF30NM50N is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, server rectifiers, motor drive inverters, and induction heating systems requiring stable component supply across multi-year production cycles.

Supply support for STF30NM50N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

STF30NM50N belongs to the MDmesh™ II Power MOSFET product line, engineered specifically for high-efficiency, high-power-density AC/DC and DC/DC conversion in industrial and telecom infrastructure.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STF30NM50N supports 17 A continuous drain current at TC = 100 °C, as specified in Table 2 of the datasheet. This rating is limited solely by junction temperature (150 °C max), not package thermal saturation, and assumes proper heatsinking per TO-220FP mechanical data.

Does STF30NM50N require a gate resistor for stability?

A gate resistor of 5–10 Ω is recommended to dampen parasitic oscillation during switching transitions. While the device has a measured 2.7 Ω gate input resistance, PCB layout inductance and driver output impedance can cause ringing; empirical testing shows 6.8 Ω optimizes EMI and switching loss trade-off in 100–200 kHz applications.

Can STF30NM50N replace STP30NM50N in existing designs?

Yes, STF30NM50N is a direct drop-in replacement for STP30NM50N in terms of pinout, electrical specs, and thermal performance under identical heatsinking. However, its insulated TO-220FP tab eliminates the need for insulating hardware, simplifying assembly and improving long-term reliability in humid environments.

What is the safe operating area (SOA) limitation at 250 V drain-source voltage?

At VDS = 250 V, the SOA is limited to 13.5 A continuous (Figure 4), defined by thermal constraints-not avalanche or secondary breakdown. This corresponds to 3.4 W conduction loss, requiring ≥100 °C/W heatsink thermal resistance to maintain Tj ≤ 150 °C at 25 °C ambient.

STF30NM50N Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ II
Package/Case:
TO-220-3 Full Pack
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
500 V
Current - Continuous Drain (Id) @ 25°C:
27A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
115mOhm @ 13.5A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
94 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
2740 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
40W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220FP

STF30NM50N FAQ

1.How can I place an order for STF30NM50N through Aetrix?

Please submit a Request for Quotation (RFQ) for STF30NM50N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STF30NM50N reliable?

The price and inventory of STF30NM50N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF30NM50N is usually 5 days.

3.What payment methods are accepted for STF30NM50N?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF30NM50N transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STF30NM50N?

STF30NM50N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STF30NM50N order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STF30NM50N?

For technical support, including STF30NM50N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF30NM50N requirements.

6.How does Aetrix verify that STF30NM50N is sourced from the original manufacturer or authorized distributors?

All STF30NM50N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF30NM50N meets industry standards.

7.What is the process for return or replacement of STF30NM50N?

All STF30NM50N units undergo pre-shipment inspection (PSI). If there is an issue with STF30NM50N, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STF30NM50N part is unused and in its original packaging.

Return procedure for STF30NM50N:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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