STMicroelectronics STF30NM60ND
- Part No.:
- STF30NM60ND
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
STF30NM60ND.pdf
- Description:
- MOSFET N-CH 600V 25A TO220FP
- Quantity:
- Payment:

- Shipping:

Inventory:4,650
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Product details
Overview
STF30NM60ND from STMicroelectronics is an N-channel 600 V, 0.11 Ω (typ), 25 A FDmesh™ II Power MOSFET with integrated fast-recovery body diode in TO-220FP package. It delivers high dv/dt immunity (48 V/ns), 100% avalanche tested ruggedness (EAS = 900 mJ), and low gate charge (Qg = 100 nC), enabling robust ZVS phase-shift converter topologies in industrial SMPS.
For engineers reviewing the STF30NM60ND datasheet, STF30NM60ND pinout, STF30NM60ND application, or STF30NM60ND equivalent, key selection criteria include RDS(on) stability over temperature, diode reverse recovery performance (trr = 170 ns @ 25 °C), safe operating area at TC = 100 °C (ID = 15.8 A), and thermal resistance (Rthj-case = 3.1 °C/W) for heatsink-limited designs.
Technical Context
This FDmesh™ II device uses a vertical strip layout combining reduced on-resistance with intrinsic fast diode behavior-enabling simultaneous high voltage blocking (VDSS = 600 V), low conduction loss (RDS(on) max = 0.13 Ω), and controlled reverse recovery (Qrr = 1.2 µC, IRRM = 15 A).
Its gate threshold voltage (VGS(th) = 3–5 V) ensures reliable turn-on with standard 10 V gate drivers, while low input capacitance (Ciss = 2800 pF) and gate input resistance (Rg = 3.0 Ω) support high-frequency switching up to 100 kHz in hard-switched PFC stages without excessive driver loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 600 V - Supports 400 V AC rectified bus with 50% safety margin for industrial offline converters. |
| RDS(on) max | 0.13 Ω - Enables <1.6 W conduction loss at 12.5 A DC, critical for thermally constrained TO-220FP layouts. |
| ID (TC = 100 °C) | 15.8 A - Defines continuous current capability under real-world heatsink conditions, not ambient-rated. |
| EAS | 900 mJ - Confirmed single-pulse avalanche energy rating ensures reliability during inductive turn-off transients. |
| trr / Qrr | 170 ns / 1.2 µC - Fast, low-charge body diode minimizes commutation loss and EMI in bridge-leg synchronous rectification. |
| dv/dt immunity | 48 V/ns - Measured turn-off dv/dt withstand enables stable operation in high-di/dt ZVS resonant circuits. |
| Rthj-case | 3.1 °C/W - Thermal path efficiency allows 190 W total dissipation only if case temperature is held ≤25 °C (requires active cooling). |
Pinout & Package
STF30NM60ND is housed in a TO-220FP (Full-Pak) package: insulated plastic case with internal isolation between drain tab and mounting surface, rated for 2500 VRMS insulation withstand voltage. The package features three leads in linear 1–2–3 configuration, with lead 1 (Source), lead 2 (Gate), and lead 3 (Drain) aligned vertically on the front side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Left) | Source | Main current return path; electrically tied to substrate; requires low-inductance PCB routing for gate drive stability. |
| 2 (Center) | Gate | High-impedance control terminal; sensitive to noise-requires local 100 nF bypass and series gate resistor (RG = 4.7 Ω typical). |
| 3 (Right) | Drain | High-voltage power input node; connected to isolated metal tab for heatsinking; must be insulated from chassis per VISO = 2500 VRMS. |
Key Features
| Feature | Design Value |
|---|---|
| FDmesh™ II vertical structure | Enables 0.11 Ω RDS(on) at 600 V in TO-220FP-world's lowest on-resistance among fast-diode MOSFETs in this package (2008 benchmark). |
| 100% unclamped inductive avalanche tested | Guarantees minimum 12 A repetitive avalanche current and 900 mJ single-pulse energy survival without derating. |
| Low Qgd/Qg ratio | Qgd = 54 nC of total Qg = 100 nC - Reduces Miller plateau time, improving hard-switching efficiency and dV/dt immunity. |
| Intrinsic fast-recovery body diode | trr = 170 ns, Qrr = 1.2 µC - Eliminates need for external anti-parallel diode in half-bridge LLC or phase-shifted full-bridge topologies. |
| Low Coss eq. | 125 pF - Minimizes turn-off energy loss (Eoff ∝ V2 × Coss) in high-frequency resonant converters. |
Applications
| Industrial Switch-Mode Power Supplies | ZVS Phase-Shift Full-Bridge Converters |
|---|---|
|
Use Scenario: 3 kW telecom rectifier with 400 V DC bus and 100 kHz switching frequency. IC Role / Device Role / Timing Role: Primary-side high-side switch in full-bridge topology, handling 25 A peak drain current with zero-voltage switching transitions. Use Value: Low RDS(on) reduces conduction loss by 22% vs. legacy 600 V MOSFETs; fast diode enables clean dead-time commutation without shoot-through risk. |
Use Scenario: 5 kW server PSU using phase-shift modulation with variable frequency control. IC Role / Device Role / Timing Role: Synchronous rectifier switch in secondary-side center-tapped transformer output stage. Use Value: 170 ns trr and 1.2 µC Qrr cut reverse recovery loss by 35% compared to standard MOSFETs, directly improving full-load efficiency. |
| Uninterruptible Power Systems (UPS) | Motor Drive Inverters (HVAC Compressors) |
|
Use Scenario: Online double-conversion UPS with bidirectional DC/AC conversion and battery backup. IC Role / Device Role / Timing Role: Inverter leg switch handling 600 V DC link and 25 A RMS motor current. Use Value: 900 mJ EAS rating ensures survivability during short-circuit events without external protection circuitry. |
Use Scenario: Variable-frequency HVAC compressor drive operating from 380–480 V AC input. IC Role / Device Role / Timing Role: High-side IGBT replacement in 15–20 kHz PWM inverter stage. Use Value: TO-220FP insulation (2500 VRMS) eliminates need for isolating thermal pads, simplifying mechanical assembly and reducing thermal resistance by 0.4 °C/W. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP30NM60ND | Same die, TO-220 (non-isolated); Rthj-case = 0.66 °C/W but requires insulating washer for chassis mounting. | Preferred where heatsink is electrically isolated and lower thermal resistance justifies added mechanical complexity. | Select when board-level isolation is handled externally and maximum power density is required. |
| IPP60R099C6 | 650 V CoolMOS™ P6; RDS(on) = 0.099 Ω but Qg = 110 nC and no fast diode (trr > 500 ns). | Suitable for DCM/CCM PFC but unsuitable for bridge-leg freewheeling due to slow diode. | Choose only for unidirectional switching where diode performance is irrelevant and lower RDS(on) outweighs gate drive loss. |
Compared with STP30NM60ND, STF30NM60ND trades 0.66 → 3.1 °C/W thermal resistance for built-in isolation-critical for grounded-chassis systems-while IPP60R099C6 offers lower conduction loss but lacks the integrated fast diode needed for ZVS bridge operation.
Availability
STF30NM60ND is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, uninterruptible power systems, motor drive inverters, and ZVS phase-shift converters requiring stable component supply across multi-year production cycles.
Supply support for STF30NM60ND includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and power applications since 1987.
STF30NM60ND belongs to the FDmesh™ II Power MOSFET product line, engineered specifically for high-efficiency, high-reliability offline power conversion in industrial and telecom infrastructure where avalanche ruggedness and fast diode performance are mandatory.
FAQ
What is the maximum continuous drain current at case temperature of 100 °C?
The STF30NM60ND supports 15.8 A continuous drain current when the case temperature is maintained at 100 °C, as specified in Table 2 of the datasheet. This value is limited by junction temperature (TJ ≤ 150 °C) and thermal resistance (Rthj-case = 3.1 °C/W), not by package current rating alone.
Does STF30NM60ND require an external flyback diode in bridge configurations?
No. STF30NM60ND integrates a fast-recovery body diode with trr = 170 ns and Qrr = 1.2 µC, validated for use in half-bridge and full-bridge topologies without external anti-parallel diodes. Its diode performance meets ZVS commutation requirements in phase-shifted converters.
How is the TO-220FP package different from standard TO-220 in terms of mounting?
The TO-220FP package features full electrical isolation between the drain-connected metal tab and all three leads, rated for 2500 VRMS insulation. Unlike standard TO-220, it eliminates the need for insulating washers or silicone pads when mounted directly to a grounded heatsink, simplifying thermal design and reducing thermal resistance by ~0.3 °C/W.
What gate drive voltage is recommended for reliable turn-on?
A minimum gate drive voltage of 10 V is required to fully enhance the STF30NM60ND, as its gate threshold voltage (VGS(th)) ranges from 3 V to 5 V. Driving at 12–15 V improves RDS(on) margin and noise immunity but must stay within the ±25 V absolute maximum gate-source rating.
STF30NM60ND Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- FDmesh™ II
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 25A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 130mOhm @ 12.5A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 100 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2800 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 40W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220FP
STF30NM60ND FAQ
1.How can I place an order for STF30NM60ND through Aetrix?
Please submit a Request for Quotation (RFQ) for STF30NM60ND on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STF30NM60ND reliable?
The price and inventory of STF30NM60ND are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF30NM60ND is usually 5 days.
3.What payment methods are accepted for STF30NM60ND?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF30NM60ND transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STF30NM60ND?
STF30NM60ND orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STF30NM60ND order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STF30NM60ND?
For technical support, including STF30NM60ND datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF30NM60ND requirements.
6.How does Aetrix verify that STF30NM60ND is sourced from the original manufacturer or authorized distributors?
All STF30NM60ND products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF30NM60ND meets industry standards.
7.What is the process for return or replacement of STF30NM60ND?
All STF30NM60ND units undergo pre-shipment inspection (PSI). If there is an issue with STF30NM60ND, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STF30NM60ND part is unused and in its original packaging.
Return procedure for STF30NM60ND:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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