STMicroelectronics STF8NM50N
- Part No.:
- STF8NM50N
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
STF8NM50N.pdf
- Description:
- MOSFET N-CH 500V 5A TO220FP
- Quantity:
- Payment:

- Shipping:

Inventory:950
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Product details
Overview
STF8NM50N from STMicroelectronics is an N-channel 500 V, 730 mΩ (typ), 5 A MDmesh™ II Power MOSFET in TO-220FP package. It delivers low gate charge (14 nC), low input capacitance (364 pF), and 100% avalanche-tested ruggedness for high-efficiency offline SMPS, PFC stages, and industrial motor drives.
For engineers reviewing the STF8NM50N datasheet, STF8NM50N pinout, STF8NM50N application, or STF8NM50N equivalent, key selection criteria include its 15 V/ns dv/dt capability, 140 mJ single-pulse avalanche energy, 6.25 °C/W junction-to-case thermal resistance, and integrated body diode with 187 ns reverse recovery time at 150 °C.
Technical Context
This MOSFET employs ST's second-generation MDmesh vertical strip architecture to minimize RDS(on) and gate charge simultaneously. Its optimized cell layout enables high-voltage operation while maintaining fast switching (td(off) = 25 ns, tf = 8.8 ns) and low Ciss/Crss ratio (364 pF / 1.2 pF), reducing Miller effect and improving hard-switching robustness.
The device integrates a fast-recovery body diode (Qrr = 1.3 µC, trr = 187 ns at TJ = 25 °C) and supports unclamped inductive switching up to 2 A repetitive avalanche current. Its 2.5 kV RMS insulation withstand voltage between leads and heat sink enables safe use in isolated high-side configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 500 V - Supports 400 V DC bus designs with 25 % margin for surge and ringing. |
| RDS(on) max | 790 mΩ at VGS = 10 V, ID = 2.5 A - Enables low conduction loss in 5 A continuous power stages. |
| Qg | 14 nC - Reduces driver power requirement and gate drive losses in high-frequency converters. |
| Ciss | 364 pF at VDS = 50 V - Low input capacitance improves switching speed and reduces EMI generation. |
| EAS | 140 mJ - Confirmed single-pulse avalanche energy ensures reliability under transient overvoltage conditions. |
| RthJC | 6.25 °C/W - Enables 20 W dissipation at ≤ 125 °C case temperature without derating. |
| dv/dt | 15 V/ns - High immunity to false turn-on during fast voltage transients in bridge topologies. |
Pinout & Package
TO-220FP (Full-Pak) package with insulated tab: thermally conductive but electrically isolated mounting surface rated for 2.5 kV RMS. Compact footprint (L3 = 28.6–30.6 mm) and low-profile height (H = 10.0–10.4 mm) support dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Pin 1) | Gate | High-impedance control terminal; requires <5.4 Ω gate resistance to limit ringing and ensure stable turn-on/turn-off. |
| D (Pin 2) | Drain | High-voltage output node; connected to heatsink via insulated tab; supports 500 V blocking. |
| S (Pin 3) | Source | Power return path and reference for gate drive; ties to low-side switch common in half-bridge configurations. |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees minimum 140 mJ single-pulse energy handling across production lot-no screening waivers. |
| Low gate input resistance | 5.4 Ω typical - minimizes gate oscillation and simplifies RC snubber design in high-dV/dt environments. |
| MDmesh™ II technology | Vertical strip layout achieves 730 mΩ typ RDS(on) at 500 V - 30 % lower on-resistance than first-gen MDmesh at same voltage rating. |
| Fast body diode | trr = 187 ns, Qrr = 1.3 µC - reduces commutation loss and EMI in flyback and resonant LLC topologies. |
Applications
| Industrial Motor Drives | Server PSU PFC Stages |
|---|---|
Use Scenario: 3-phase inverter stage in 1–3 kW variable-frequency drives operating at 16 kHz PWM frequency. IC Role / Device Role / Timing Role: Low-side switching element in IGBT/MOSFET hybrid inverter leg; handles 5 A RMS load current with 20 A pulsed peak. Use Value: 790 mΩ RDS(on) limits conduction loss to <1.5 W at full load; 15 V/ns dv/dt rating prevents spurious turn-on during cross-conduction. | Use Scenario: Boost switch in active PFC front-end of 80 PLUS Titanium server power supply (3.3 kW). IC Role / Device Role / Timing Role: Main switching transistor in continuous conduction mode (CCM) boost converter; switches at 100–200 kHz. Use Value: 14 nC Qg enables efficient gate driving at 200 kHz; low Coss (33 pF) minimizes turn-off loss and improves light-load efficiency. |
| Offline SMPS Flyback | Industrial PLC Power Modules |
Use Scenario: Primary-side switch in universal-input (85–265 VAC) 65 W flyback adapter for industrial HMIs. IC Role / Device Role / Timing Role: Self-oscillating or PWM-controlled main switch; subjected to 600 V drain spikes during demagnetization. Use Value: 500 V VDS rating plus 140 mJ EAS ensures reliable operation under reflected output overvoltage and transformer leakage spikes. | Use Scenario: DC-DC isolation switch in 24 V input, 5 V/3 A output power module for programmable logic controller backplanes. IC Role / Device Role / Timing Role: High-side switch in synchronous buck regulator; operates with 100 % duty cycle capability and thermal cycling stress. Use Value: TO-220FP insulated tab allows direct mounting to shared chassis ground while maintaining 2.5 kV isolation-eliminates need for insulating pads or bushings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP8NM50 | Same die, TO-220 (non-FP) package; no insulated tab; RthJC = 6.25 °C/W identical; VISO = 0 V. | Requires external insulator for heatsink mounting; unsuitable where creepage/clearance or safety isolation is mandated. | Select when cost-sensitive and mechanical isolation is handled externally; avoid in medical or reinforced-isolation systems. |
| FDPF18N50 | 500 V, 0.54 Ω typ RDS(on), 33 nC Qg; DPAK package; higher gate charge and larger RDS(on). | Better thermal performance in surface-mount layouts; less suitable for high-frequency >150 kHz due to higher Qg. | Prefer for space-constrained SMT designs where 5 A average current and moderate switching frequency apply. |
Compared with STP8NM50 and FDPF18N50, STF8NM50N uniquely combines insulated-tab packaging, low Qg, and MDmesh™ II efficiency-making it optimal for safety-critical, high-density, high-frequency offline converters where thermal and electrical isolation are co-required.
Availability
STF8NM50N is available at Aetrix Electronics and suitable for industrial motor drives, server PSU PFC stages, and offline SMPS flyback converters requiring stable component supply and long-term lifecycle assurance.
Supply support for STF8NM50N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
The MDmesh™ power MOSFET product line targets high-efficiency AC-DC and DC-DC conversion, emphasizing low RDS(on), low gate charge, and rugged avalanche performance for demanding industrial and computing power applications.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The STF8NM50N supports 3 A continuous drain current at TC = 100 °C, as specified in Table 1 (ID at TC = 100 °C). This derating reflects thermal limits of the TO-220FP package and ensures safe operation within the SOA boundary at elevated temperatures.
Does the STF8NM50N have an integrated ESD protection diode on the gate?
No. The device does not integrate gate ESD protection; its gate-body leakage current (±100 nA at ±25 V) and VGS absolute maximum rating (±25 V) indicate standard gate oxide robustness. External gate protection (e.g., Zener clamp) is recommended in high-noise industrial environments.
Can STF8NM50N be used in synchronous rectification topologies?
No. As an N-channel high-side switch with non-optimized body diode forward voltage (VSD = 1.5 V at 5 A), it is unsuitable for synchronous rectification. Its design prioritizes high-voltage blocking and avalanche ruggedness-not low VF or bidirectional conduction.
What is the safe operating area (SOA) limitation at 100 µs pulse width?
At 100 µs pulse width and TJ = 150 °C, the SOA is limited by RDS(on) to approximately 4 A at 200 V VDS, per Figure 1. This reflects the device's ability to sustain short-duration overload without thermal runaway or secondary breakdown.
STF8NM50N Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ II
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 790mOhm @ 2.5A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 364 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 20W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220FP
STF8NM50N FAQ
1.How can I place an order for STF8NM50N through Aetrix?
Please submit a Request for Quotation (RFQ) for STF8NM50N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STF8NM50N reliable?
The price and inventory of STF8NM50N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STF8NM50N is usually 5 days.
3.What payment methods are accepted for STF8NM50N?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STF8NM50N transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STF8NM50N?
STF8NM50N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STF8NM50N order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STF8NM50N?
For technical support, including STF8NM50N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STF8NM50N requirements.
6.How does Aetrix verify that STF8NM50N is sourced from the original manufacturer or authorized distributors?
All STF8NM50N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STF8NM50N meets industry standards.
7.What is the process for return or replacement of STF8NM50N?
All STF8NM50N units undergo pre-shipment inspection (PSI). If there is an issue with STF8NM50N, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STF8NM50N part is unused and in its original packaging.
Return procedure for STF8NM50N:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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