STMicroelectronics STFW3N170
- Part No.:
- STFW3N170
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-3P-3 Full Pack
- Datasheet:
-
STFW3N170.pdf
- Description:
- MOSFET N-CH 1700V 2.6A ISOWATT
- Quantity:
- Payment:

- Shipping:

Inventory:672
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Product details
Overview
STFW3N170 from STMicroelectronics is an N-channel 1700 V, 7 Ω typ. (13 Ω max), 2.6 A PowerMESH™ high-voltage power MOSFET in TO-3PF package, designed for high-speed switching in high-voltage DC-DC converters and industrial snubberless flyback topologies.
For engineers reviewing the STFW3N170 datasheet, STFW3N170 pinout, STFW3N170 application, or STFW3N170 equivalent, key selection criteria include its 1700 V VDS, 44 nC total gate charge, 1.58 µs reverse recovery time, 3.5 kV insulation withstand voltage, and 100% avalanche-tested ruggedness for unclamped inductive load reliability.
Technical Context
This device employs ST's strip-layout-based MESH OVERLAY process to minimize intrinsic capacitances (Ciss = 1100 pF, Coss = 50 pF) and gate charge (Qg = 44 nC), enabling fast switching with low switching losses. Its 2 °C/W RthJC supports high-power dissipation up to 63 W at TC = 25 °C.
The integrated source-drain diode exhibits VSD = 1.5 V at 2.6 A and trr = 1.58 µs (TJ = 25 °C), optimized for hard-switched flyback and resonant converter freewheeling. Avalanche capability is validated at EAS = 2 mJ (single-pulse, TJ = 25 °C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 1700 V - Withstands DC bus voltages up to 1200 V RMS in 3-phase rectified systems with margin. |
| RDS(on) max | 13 Ω - Limits conduction loss to ≤87 W at 2.6 A, defining thermal design envelope. |
| Qg | 44 nC - Determines gate driver current requirement (≥9 mA avg. for 100 kHz, 10 V swing). |
| tr/tf | 9 ns / 53 ns - Enables <500 kHz operation with controlled EMI in isolated SMPS. |
| VISO | 3.5 kV RMS - Permits direct mounting on insulated heat sinks without additional isolation pads. |
| EAS | 2 mJ - Supports single-event unclamped inductive switching without failure under defined SOA limits. |
| trr | 1.58 µs - Reduces diode recovery loss and voltage overshoot in flyback snubberless designs. |
Pinout & Package
TO-3PF metal-can package with isolated tab; thermally and electrically insulated case rated for 3.5 kV RMS. Dimensions conform to ST's TO-3PF Type A mechanical specification (L4 = 43.6–44.0 mm, G = 10.8–11.0 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D (Tab) | Drain (case-connected) | Primary high-voltage node; requires creepage/clearance compliance and insulated mounting. |
| G (Pin 1) | Gate | High-impedance control input; sensitive to dV/dt-induced turn-on; requires low-inductance gate loop. |
| S (Pin 3) | Source | Return path for load current; referenced to gate drive ground; carries full switching current. |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees single-pulse ruggedness to 2 mJ at TJ = 25 °C, eliminating need for external clamping in flyback primary switches. |
| Minimized Qg and Coss | 44 nC Qg and 50 pF Coss reduce switching energy loss by >25% vs. legacy 1700 V MOSFETs at 100 kHz. |
| Optimized body diode | 1.58 µs trr and 7.9 A IRRM enable reliable zero-voltage switching transitions in quasi-resonant converters. |
| High insulation rating | 3.5 kV RMS isolation allows direct heatsink mounting in medical/industrial equipment without creepage extenders. |
Applications
| Industrial Flyback Converters | Capacitor Discharge Units |
|---|---|
Use Scenario: Primary-side switch in 1–3 kW offline flyback converters powering PLC I/O modules. IC Role / Device Role / Timing Role: High-voltage main switch handling 1700 V blocking and 2.6 A peak current during 50–200 kHz switching. Use Value: Avalanche ruggedness eliminates snubber network, reducing BOM count and improving efficiency by 1.2% at full load. | Use Scenario: Energy discharge switch in high-voltage capacitor banks for laser pulse forming networks. IC Role / Device Role / Timing Role: Fast-turn-off high-voltage switch triggering precise microsecond-scale discharge pulses. Use Value: 53 ns fall time ensures <100 ns pulse edge fidelity; 3.5 kV isolation prevents flashover across heatsink interface. |
| Snubberless AC-DC Adapters | High-Voltage DC Link Protection |
Use Scenario: Primary switch in universal-input (85–265 VAC) 65 W adapters targeting no-snubber topology. IC Role / Device Role / Timing Role: Hard-switched MOSFET operating at 65 kHz with VDS stress up to 1.4× peak rectified voltage. Use Value: 1700 V rating provides 2.5× margin over 650 V PFC+flyback architectures, enabling compact transformer design. | Use Scenario: Overvoltage crowbar device protecting 1000 V DC link in motor drives during regenerative braking faults. IC Role / Device Role / Timing Role: Normally-off protection switch triggered by voltage comparator to short DC bus to ground. Use Value: 10.4 A pulsed drain current (IDM) sustains 10 ms fault clearing without bond-wire fusing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW3N170 | Same die, TO-247 package; higher RthJA (50 °C/W vs. 2 °C/W junction-to-case), no isolation rating | Lacks 3.5 kV isolation; requires external insulator; better suited for PCB-mounted heatsinks | Select when board-level isolation is already implemented and lower assembly cost is prioritized. |
| IXTH3N170 | 1700 V, 12 Ω max, 2.5 A; higher Qg (65 nC); no guaranteed avalanche testing | Higher switching loss; requires external avalanche protection in unclamped circuits | Select only if existing IXYS footprint compatibility is mandatory and SOA derating is acceptable. |
Compared with STW3N170 and IXTH3N170, STFW3N170 uniquely combines certified 3.5 kV isolation, 100% avalanche screening, and TO-3PF thermal performance-making it the sole choice for space-constrained, safety-critical high-voltage switch applications requiring direct heatsink mounting.
Availability
STFW3N170 is available at Aetrix Electronics and suitable for industrial flyback converters, capacitor discharge units, snubberless AC-DC adapters, and high-voltage DC link protection requiring stable component supply and long-term lifecycle support.
Supply support for STFW3N170 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MEMS, power, and microcontroller solutions for industrial, automotive, and consumer markets.
STFW3N170 belongs to the PowerMESH™ high-voltage MOSFET product line, engineered specifically for rugged, high-efficiency switching in 1–5 kW industrial power supplies and energy discharge systems where reliability under unclamped inductive stress is critical.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The STFW3N170 supports 1.6 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS9384 Rev 5. This derating reflects thermal limits imposed by the TO-3PF package's 2 °C/W RthJC and safe operating area constraints-not silicon capability alone.
Does STFW3N170 require a negative gate voltage for reliable turn-off?
No. The device specifies ±30 V gate-source voltage rating but operates reliably with 0 V to +10 V gate drive. A negative gate bias is not required due to its 4 V typical VGS(th) and low Miller capacitance (Crss = 7 pF), minimizing dV/dt-induced turn-on risk in well-layouted circuits.
Can STFW3N170 replace STW3N170 in existing designs?
Yes, with mechanical and thermal caveats: STFW3N170 uses TO-3PF (isolated tab), while STW3N170 uses TO-247 (non-isolated). Direct replacement requires verifying heatsink isolation, mounting torque (TO-3PF uses M3.5 screw), and layout clearance for the larger TO-3PF outline (L4 = 44 mm vs. TO-247's 15.8 mm).
What is the recommended gate resistor value for 100 kHz switching?
A 4.7 Ω gate resistor is validated per Figure 13 in DS9384 Rev 5 for 100 kHz operation, yielding td(on) = 25 ns and tf = 53 ns. Lower values (<2.2 Ω) increase peak gate current beyond 1.5 A and risk ringing; higher values (>10 Ω) degrade switching speed and raise losses disproportionately.
STFW3N170 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- PowerMESH™
- Package/Case:
- TO-3P-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 1700 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 13Ohm @ 1.3A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1100 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 63W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-3PF
STFW3N170 FAQ
1.How can I place an order for STFW3N170 through Aetrix?
Please submit a Request for Quotation (RFQ) for STFW3N170 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STFW3N170 reliable?
The price and inventory of STFW3N170 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STFW3N170 is usually 5 days.
3.What payment methods are accepted for STFW3N170?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STFW3N170 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STFW3N170?
STFW3N170 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STFW3N170 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STFW3N170?
For technical support, including STFW3N170 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STFW3N170 requirements.
6.How does Aetrix verify that STFW3N170 is sourced from the original manufacturer or authorized distributors?
All STFW3N170 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STFW3N170 meets industry standards.
7.What is the process for return or replacement of STFW3N170?
All STFW3N170 units undergo pre-shipment inspection (PSI). If there is an issue with STFW3N170, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STFW3N170 part is unused and in its original packaging.
Return procedure for STFW3N170:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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