Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

STMicroelectronics STH140N8F7-2

Name: STH140N8F7-2
Brand: STMicroelectronics
SKU: STH140N8F7-2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: STH140N8F7-2

Manufacturer:: STMicroelectronics

Category:: FETs, MOSFETs

Package:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Datasheet:: STH140N8F7-2.pdf

Description:: MOSFET N-CH 80V 90A H2PAK-2

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:920

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

STH140N8F7-2 from STMicroelectronics is an N-channel 80 V, 3.3 mΩ typ. R_DS(on), 90 A continuous drain current Power MOSFET in H2PAK-2 package, optimized for high-efficiency switching in DC-DC converters and motor drives. It features 200 W total power dissipation, 515 mJ single-pulse avalanche energy, and low Crss/Ciss ratio for EMI immunity.

For engineers reviewing the STH140N8F7-2 datasheet, STH140N8F7-2 pinout, STH140N8F7-2 application, or STH140N8F7-2 equivalent, key selection criteria include R_DS(on) at 10 V gate drive, thermal resistance (R_thj-case = 0.75 °C/W), safe operating area limits, and unclamped inductive switching ruggedness.

Technical Context

This device employs STripFET™ F7 trench-gate technology to achieve ultra-low on-resistance while reducing gate charge (Q_g = 96 nC) and output capacitance (C_oss = 1195 pF). Its low Crss/Ciss ratio (≈1.7%) minimizes Miller-induced turn-off delay and improves noise immunity in high-dV/dt environments.

The H2PAK-2 package enables high-current capability with low thermal resistance (R_thj-case = 0.75 °C/W) and supports pulsed drain currents up to 360 A. Avalanche ruggedness is validated at 515 mJ under defined test conditions (T_j = 25 °C, I_D = 18.5 A, V_DD = 50 V).

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	80 V - Maximum blocking voltage compatible with 48 V industrial bus and 60 V automotive systems
R_DS(on) typ.	3.3 mΩ @ V_GS = 10 V - Enables <1.5 W conduction loss at 60 A, critical for high-current power stages
I_D cont.	90 A @ T_C = 25 °C - Limited by package thermal capacity, not silicon die
E_AS	515 mJ - Confirmed unclamped inductive switching robustness for motor control and relay driving
Q_g	96 nC - Total gate charge determines driver strength requirement and switching loss trade-off
C_rss/C_iss	105/6340 pF - Low ratio (1.66%) reduces dv/dt-induced false turn-on risk
R_thj-case	0.75 °C/W - Enables direct heatsink mounting without thermal interface material degradation concerns

Pinout & Package

H2PAK-2 is a surface-mount, double-sided cooling package with isolated source pad and exposed drain tab. It provides low-inductance, high-current paths and supports PCB-side thermal transfer via the drain tab.

Pin/Terminal	Circuit Role	Design Meaning
Drain (Tab)	Main current path, high-side switch node	Exposed metal tab electrically connected to drain; serves as primary thermal and current path
Source (Pad)	Reference node for gate drive and current sensing	Isolated copper pad; used for Kelvin source connection in precision gate drive layouts
Gate (Pad)	Control terminal for channel modulation	Small-signal pad requiring low-inductance routing; sensitive to ringing due to Q_gd = 26 nC

Key Features

Feature	Design Value
Ultra-low R_DS(on)	3.3 mΩ typ. at 10 V - Reduces conduction losses by >25% vs. prior-generation F6 devices in same package
Enhanced FoM (R_DS(on) × Q_g)	317 Ω·nC - Improves efficiency in hard-switched topologies like synchronous buck converters
Low Crss/Ciss ratio	1.66% - Minimizes Miller plateau duration and improves EMI behavior in noisy environments
Avalanche ruggedness	515 mJ single-pulse - Eliminates need for external snubbers in inductive load switching
H2PAK-2 thermal performance	R_thj-case = 0.75 °C/W - Supports >150 W continuous power dissipation with modest heatsinking

Applications

Motor Control

DC-DC Converters

Use Scenario: 48 V BLDC motor inverter stage with 60–90 A phase current.

IC Role / Device Role / Timing Role: High-side N-channel switch in 3-phase bridge, driven by isolated gate driver.

Use Value: 3.3 mΩ R_DS(on) limits conduction loss to ≤1.2 W per device at 60 A, enabling compact thermal design.

Use Scenario: Primary-side switch in 1 kW telecom half-bridge LLC resonant converter.

IC Role / Device Role / Timing Role: Main switching element handling high peak currents and fast dV/dt transitions.

Use Value: Low Crss/Ciss ratio suppresses false triggering during zero-voltage switching transitions.

Industrial Power Supplies

Automotive On-Board Chargers

Use Scenario: Output synchronous rectifier in 3 kW server PSU with 12 V/200 A output.

IC Role / Device Role / Timing Role: Low-side switch in multiphase buck converter delivering regulated 12 V rail.

Use Value: 90 A continuous rating allows parallel-free operation, simplifying layout and reducing component count.

Use Scenario: DC-link switching in 11 kW AC/DC OBC with 400 V nominal input.

IC Role / Device Role / Timing Role: High-current switching device in active front-end or isolation stage.

Use Value: 515 mJ avalanche energy withstands line transients and regenerative braking surges without failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IPB180N08N3 G	R_DS(on) = 3.2 mΩ, Q_g = 105 nC, TO-263-7 package	Higher gate charge increases driver loss; different pinout requires PCB redesign	Preferred where lower R_DS(on) outweighs gate drive complexity
IRFP4868PBF	R_DS(on) = 3.6 mΩ, Q_g = 120 nC, TO-247AC package	Larger footprint and higher thermal resistance (R_thj-case = 0.95 °C/W)	Suitable when through-hole mounting or legacy TO-247 compatibility is required

Compared with IPB180N08N3 G and IRFP4868PBF, STH140N8F7-2 offers best-in-class FoM (317 Ω·nC) and lowest thermal resistance in surface-mount form, making it optimal for space-constrained, high-power-density designs where thermal management is critical.

Availability

STH140N8F7-2 is available at Aetrix Electronics and suitable for motor control, DC-DC conversion, and industrial power supply applications requiring stable component supply and long-term production continuity.

Supply support for STH140N8F7-2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power, analog, MEMS, and microcontroller technologies.

This device belongs to ST's STripFET™ F7 Power MOSFET product line, engineered specifically for high-efficiency, high-current switching in industrial and automotive power systems where low conduction loss and avalanche reliability are mandatory.

FAQ

What is the maximum gate-source voltage rating for STH140N8F7-2?

The absolute maximum V_GS is ±20 V. Operation beyond this range risks permanent gate oxide damage. Recommended gate drive is +10 V to +15 V for full enhancement, with negative turn-off bias (e.g., –5 V) improving noise immunity in high-dV/dt environments.

Can STH140N8F7-2 be used in avalanche mode continuously?

No - the 515 mJ E_AS rating applies only to single-pulse unclamped inductive switching events. Continuous avalanche operation is not characterized or guaranteed; repeated stress degrades R_DS(on) and may cause thermal runaway.

Does the H2PAK-2 package require solder paste stencil optimization?

Yes - the large drain tab demands controlled solder volume to prevent voiding and ensure mechanical integrity. ST recommends a 120 µm thick stencil with 80% aperture reduction for the drain pad, and standard 100 µm openings for gate and source pads.

How does temperature affect R_DS(on) in STH140N8F7-2?

R_DS(on) increases linearly with junction temperature: typical value rises from 3.3 mΩ at 25 °C to ~4.7 mΩ at 175 °C. This 42% increase must be factored into worst-case conduction loss calculations for thermal design validation.

STH140N8F7-2 Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: DeepGATE™, STripFET™ VII

Package/Case:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 80 V

Current - Continuous Drain (Id) @ 25°C:: 90A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 4mOhm @ 45A, 10V

Vgs(th) (Max) @ Id:: 4.5V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 96 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 6340 pF @ 40 V

FET Feature:: -

Power Dissipation (Max):: 200W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: H2PAK-2

STH140N8F7-2 FAQ

1.How can I place an order for STH140N8F7-2 through Aetrix?

Please submit a Request for Quotation (RFQ) for STH140N8F7-2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STH140N8F7-2 reliable?

The price and inventory of STH140N8F7-2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STH140N8F7-2 is usually 5 days.

3.What payment methods are accepted for STH140N8F7-2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STH140N8F7-2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STH140N8F7-2?

STH140N8F7-2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STH140N8F7-2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STH140N8F7-2?

For technical support, including STH140N8F7-2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STH140N8F7-2 requirements.

6.How does Aetrix verify that STH140N8F7-2 is sourced from the original manufacturer or authorized distributors?

All STH140N8F7-2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STH140N8F7-2 meets industry standards.

7.What is the process for return or replacement of STH140N8F7-2?

All STH140N8F7-2 units undergo pre-shipment inspection (PSI). If there is an issue with STH140N8F7-2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STH140N8F7-2 part is unused and in its original packaging.

Return procedure for STH140N8F7-2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…