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STMicroelectronics STH180N10F3-6

Part No.:
STH180N10F3-6
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-263-7, D2PAK (6 Leads + Tab)
Datasheet:
AetrixSTH180N10F3-6.pdf
Description:
MOSFET N-CH 100V 180A H2PAK-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,894

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Product details

Overview

STH180N10F3-6 from STMicroelectronics is an N-channel 100 V, 3.9 mΩ typ. RDS(on), 180 A continuous drain current Power MOSFET in H²PAK-6 package, fabricated using STripFET™ F3 technology. It delivers low conduction loss and fast switching for high-efficiency DC-DC converters, motor drives, and industrial power supplies.

For engineers reviewing the STH180N10F3-6 datasheet, STH180N10F3-6 pinout, STH180N10F3-6 application, or STH180N10F3-6 equivalent, key selection criteria include RDS(on) at 10 V gate drive, 350 mJ single-pulse avalanche energy, 114.6 nC total gate charge, thermal resistance (0.48 °C/W junction-to-case), and H²PAK-6 mounting compatibility with FR-4 PCBs.

Technical Context

This device operates as a high-current, high-voltage switching element with gate threshold voltage of 2–4 V and guaranteed 100% avalanche ruggedness. Its STripFET™ F3 process enables reduced gate charge (Qg = 114.6 nC) and optimized capacitance profile (Ciss = 6665 pF, Crss = 49 pF), supporting hard-switching topologies up to 100 kHz.

The integrated source-drain diode exhibits 1.5 V forward voltage at 120 A and 83.4 ns reverse recovery time under 100 A/µs di/dt, enabling synchronous rectification and inductive load control without external freewheeling diodes in many applications.

Key Specifications

ParameterValue and Actual Design Meaning
VDS100 V - Maximum blocking voltage for 48 V and 60 V bus systems with margin
RDS(on) max4.5 mΩ @ VGS = 10 V, ID = 60 A - Enables <1 W conduction loss at 150 A in thermally optimized layouts
ID cont @ TC = 25 °C180 A - Supports high-current power stages without parallel devices
EAS350 mJ - Withstands unclamped inductive switching events in motor control and solenoid drivers
Qg114.6 nC - Determines gate driver power requirement and switching speed trade-off
Rthj-case0.48 °C/W - Requires heatsink interface ≤0.5 °C/W to maintain TJ < 175 °C at full load
tr/tf97.1 ns / 6.9 ns - Enables fast turn-on with minimal overlap loss in half-bridge configurations

Pinout & Package

H²PAK-6 is a surface-mount, thermally enhanced power package with isolated tab (drain-connected) and six gull-wing leads. The metal tab provides direct thermal path to heatsink while minimizing parasitic inductance.

Pin/TerminalCircuit RoleDesign Meaning
TABDrain (D)Exposed copper pad - electrically and thermally connected to drain; must be soldered to PCB copper pour or heatsink
Pin 1Source (S)Low-side return path; connects to power ground plane with minimal loop inductance
Pin 2Source (S)Parallel source connection to reduce resistance and improve current sharing
Pin 3Source (S)Third source terminal for high-current routing and thermal spreading
Pin 4Gate (G)Control input; requires low-inductance gate resistor (e.g., 4.7 Ω) to damp ringing
Pin 5Source (S)Fourth source terminal - enhances thermal dissipation and reduces source inductance
Pin 6Source (S)Fifth source terminal - completes low-impedance source network for 180 A operation

Key Features

FeatureDesign Value
STripFET™ F3 processReduces RDS(on) × Qg figure-of-merit by ~25% vs prior generation, improving efficiency in high-frequency SMPS
100% avalanche testedGuarantees robustness against inductive kickback without derating - critical for motor phase-leg reliability
Low Crss (49 pF)Minimizes Miller effect, enabling stable gate drive with moderate gate resistance and reducing risk of false turn-on
H²PAK-6 thermal performance0.48 °C/W Rthj-case allows >250 W power dissipation with standard heatsink, eliminating need for forced air in many designs
Fast diode recovery (trr = 83.4 ns)Enables use in synchronous buck converters without external Schottky diode, reducing BOM count and layout area

Applications

Motor Drive InverterIndustrial DC-DC Converter

Use Scenario: Three-phase BLDC motor inverter stage operating at 48 V bus, 150 A peak phase current.

IC Role / Device Role / Timing Role: High-side and low-side switching element in 6-pack configuration, switching at 16–20 kHz.

Use Value: Low RDS(on) minimizes conduction loss; 350 mJ EAS ensures safe commutation during fault conditions without snubbers.

Use Scenario: 1 kW isolated full-bridge DC-DC converter for telecom power shelf (48 V input to 12 V output).

IC Role / Device Role / Timing Role: Primary-side switching MOSFET in ZVS-enabled full-bridge topology.

Use Value: Low Qg and Ciss support zero-voltage switching at 100 kHz; H²PAK-6 thermal design simplifies heatsinking on primary side.

Server PSU Primary SwitchSolar Microinverter Half-Bridge

Use Scenario: 2 kW server power supply using LLC resonant topology with 54 V nominal input.

IC Role / Device Role / Timing Role: Primary-side switch handling 180 A pulsed current during resonance cycles.

Use Value: 720 A pulsed drain current rating supports peak LLC currents; low Coss (786 pF) improves resonant tank efficiency.

Use Scenario: 300 W microinverter converting PV panel output (30–60 V) to grid-synchronized 230 V AC.

IC Role / Device Role / Timing Role: Low-side switch in half-bridge inverter leg, operating with unipolar PWM at 20 kHz.

Use Value: Fast tf (6.9 ns) and low VSD (1.5 V) reduce switching and conduction losses in bidirectional current paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IXFH180N10PRDS(on) = 4.0 mΩ (typ), Qg = 135 nC, TO-247 packageHigher gate charge increases driver loss; through-hole mounting limits board densityPreferred where legacy TO-247 heatsink infrastructure exists and gate drive capability exceeds 2 A peak
IRFP4868PbFRDS(on) = 3.8 mΩ (typ), Qg = 145 nC, TO-247AC packageLarger Ciss (7200 pF) and slower tr/tf limit usable frequency to ≤50 kHzSelected when cost sensitivity outweighs switching loss and board space constraints

Compared with IXFH180N10P and IRFP4868PbF, STH180N10F3-6 offers superior RDS(on) × Qg trade-off and surface-mount thermal performance, making it optimal for compact, high-frequency, high-reliability power stages where PCB real estate and thermal management are constrained.

Availability

STH180N10F3-6 is available at Aetrix Electronics and suitable for industrial motor drives, telecom DC-DC converters, and solar microinverters requiring stable component supply and long-term production continuity.

Supply support for STH180N10F3-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power, analog, MEMS, and microcontroller technologies for industrial, automotive, and consumer markets.

This device belongs to ST's STripFET™ F3 Power MOSFET product line, engineered specifically for high-efficiency, high-current switching in industrial power conversion and motor control applications.

FAQ

What is the maximum recommended gate-source voltage for reliable operation?

The absolute maximum VGS is ±20 V per datasheet Table 2. For long-term reliability, ST recommends limiting VGS to +15 V during normal switching and avoiding negative gate bias below –10 V. Gate oxide integrity is preserved within this range, and typical gate drivers (e.g., UCC27531) operate safely at 12–15 V drive.

Can STH180N10F3-6 be used in paralleled configurations?

Yes - its positive temperature coefficient of RDS(on) (see Figure 11) ensures inherent current sharing across paralleled units. Layout symmetry, matched gate drive impedance, and shared source inductance are critical; ST recommends ≤1 nH per source path difference to avoid dynamic imbalance above 100 kHz.

Is the H²PAK-6 package RoHS and REACH compliant?

Yes - the device carries ECOPACK®2 compliance, meeting RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Lead-free termination and halogen-free molding compound are confirmed in ST's official material declarations (DocID026719).

What is the safe operating area (SOA) limitation at 100 °C case temperature?

At TC = 100 °C, the continuous drain current is derated to 120 A (Table 2). The SOA curve (Figure 2) shows that pulse operation up to 720 A is permitted only for ≤100 µs pulses with duty cycle ≤1.5%, due to thermal and avalanche limits - sustained operation beyond 120 A requires active cooling or derating.

STH180N10F3-6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STripFET™ III
Package/Case:
TO-263-7, D2PAK (6 Leads + Tab)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
180A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
4.5mOhm @ 60A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
114.6 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
6665 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
315W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
H2PAK-6

STH180N10F3-6 FAQ

1.How can I place an order for STH180N10F3-6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STH180N10F3-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STH180N10F3-6 reliable?

The price and inventory of STH180N10F3-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STH180N10F3-6 is usually 5 days.

3.What payment methods are accepted for STH180N10F3-6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STH180N10F3-6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STH180N10F3-6?

STH180N10F3-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STH180N10F3-6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STH180N10F3-6?

For technical support, including STH180N10F3-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STH180N10F3-6 requirements.

6.How does Aetrix verify that STH180N10F3-6 is sourced from the original manufacturer or authorized distributors?

All STH180N10F3-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STH180N10F3-6 meets industry standards.

7.What is the process for return or replacement of STH180N10F3-6?

All STH180N10F3-6 units undergo pre-shipment inspection (PSI). If there is an issue with STH180N10F3-6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STH180N10F3-6 part is unused and in its original packaging.

Return procedure for STH180N10F3-6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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