STMicroelectronics STH180N10F3-6
- Part No.:
- STH180N10F3-6
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-263-7, D2PAK (6 Leads + Tab)
- Datasheet:
-
STH180N10F3-6.pdf
- Description:
- MOSFET N-CH 100V 180A H2PAK-6
- Quantity:
- Payment:

- Shipping:

Inventory:5,894
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Product details
Overview
STH180N10F3-6 from STMicroelectronics is an N-channel 100 V, 3.9 mΩ typ. RDS(on), 180 A continuous drain current Power MOSFET in H²PAK-6 package, fabricated using STripFET™ F3 technology. It delivers low conduction loss and fast switching for high-efficiency DC-DC converters, motor drives, and industrial power supplies.
For engineers reviewing the STH180N10F3-6 datasheet, STH180N10F3-6 pinout, STH180N10F3-6 application, or STH180N10F3-6 equivalent, key selection criteria include RDS(on) at 10 V gate drive, 350 mJ single-pulse avalanche energy, 114.6 nC total gate charge, thermal resistance (0.48 °C/W junction-to-case), and H²PAK-6 mounting compatibility with FR-4 PCBs.
Technical Context
This device operates as a high-current, high-voltage switching element with gate threshold voltage of 2–4 V and guaranteed 100% avalanche ruggedness. Its STripFET™ F3 process enables reduced gate charge (Qg = 114.6 nC) and optimized capacitance profile (Ciss = 6665 pF, Crss = 49 pF), supporting hard-switching topologies up to 100 kHz.
The integrated source-drain diode exhibits 1.5 V forward voltage at 120 A and 83.4 ns reverse recovery time under 100 A/µs di/dt, enabling synchronous rectification and inductive load control without external freewheeling diodes in many applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum blocking voltage for 48 V and 60 V bus systems with margin |
| RDS(on) max | 4.5 mΩ @ VGS = 10 V, ID = 60 A - Enables <1 W conduction loss at 150 A in thermally optimized layouts |
| ID cont @ TC = 25 °C | 180 A - Supports high-current power stages without parallel devices |
| EAS | 350 mJ - Withstands unclamped inductive switching events in motor control and solenoid drivers |
| Qg | 114.6 nC - Determines gate driver power requirement and switching speed trade-off |
| Rthj-case | 0.48 °C/W - Requires heatsink interface ≤0.5 °C/W to maintain TJ < 175 °C at full load |
| tr/tf | 97.1 ns / 6.9 ns - Enables fast turn-on with minimal overlap loss in half-bridge configurations |
Pinout & Package
H²PAK-6 is a surface-mount, thermally enhanced power package with isolated tab (drain-connected) and six gull-wing leads. The metal tab provides direct thermal path to heatsink while minimizing parasitic inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TAB | Drain (D) | Exposed copper pad - electrically and thermally connected to drain; must be soldered to PCB copper pour or heatsink |
| Pin 1 | Source (S) | Low-side return path; connects to power ground plane with minimal loop inductance |
| Pin 2 | Source (S) | Parallel source connection to reduce resistance and improve current sharing |
| Pin 3 | Source (S) | Third source terminal for high-current routing and thermal spreading |
| Pin 4 | Gate (G) | Control input; requires low-inductance gate resistor (e.g., 4.7 Ω) to damp ringing |
| Pin 5 | Source (S) | Fourth source terminal - enhances thermal dissipation and reduces source inductance |
| Pin 6 | Source (S) | Fifth source terminal - completes low-impedance source network for 180 A operation |
Key Features
| Feature | Design Value |
|---|---|
| STripFET™ F3 process | Reduces RDS(on) × Qg figure-of-merit by ~25% vs prior generation, improving efficiency in high-frequency SMPS |
| 100% avalanche tested | Guarantees robustness against inductive kickback without derating - critical for motor phase-leg reliability |
| Low Crss (49 pF) | Minimizes Miller effect, enabling stable gate drive with moderate gate resistance and reducing risk of false turn-on |
| H²PAK-6 thermal performance | 0.48 °C/W Rthj-case allows >250 W power dissipation with standard heatsink, eliminating need for forced air in many designs |
| Fast diode recovery (trr = 83.4 ns) | Enables use in synchronous buck converters without external Schottky diode, reducing BOM count and layout area |
Applications
| Motor Drive Inverter | Industrial DC-DC Converter |
|---|---|
Use Scenario: Three-phase BLDC motor inverter stage operating at 48 V bus, 150 A peak phase current. IC Role / Device Role / Timing Role: High-side and low-side switching element in 6-pack configuration, switching at 16–20 kHz. Use Value: Low RDS(on) minimizes conduction loss; 350 mJ EAS ensures safe commutation during fault conditions without snubbers. | Use Scenario: 1 kW isolated full-bridge DC-DC converter for telecom power shelf (48 V input to 12 V output). IC Role / Device Role / Timing Role: Primary-side switching MOSFET in ZVS-enabled full-bridge topology. Use Value: Low Qg and Ciss support zero-voltage switching at 100 kHz; H²PAK-6 thermal design simplifies heatsinking on primary side. |
| Server PSU Primary Switch | Solar Microinverter Half-Bridge |
Use Scenario: 2 kW server power supply using LLC resonant topology with 54 V nominal input. IC Role / Device Role / Timing Role: Primary-side switch handling 180 A pulsed current during resonance cycles. Use Value: 720 A pulsed drain current rating supports peak LLC currents; low Coss (786 pF) improves resonant tank efficiency. | Use Scenario: 300 W microinverter converting PV panel output (30–60 V) to grid-synchronized 230 V AC. IC Role / Device Role / Timing Role: Low-side switch in half-bridge inverter leg, operating with unipolar PWM at 20 kHz. Use Value: Fast tf (6.9 ns) and low VSD (1.5 V) reduce switching and conduction losses in bidirectional current paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXFH180N10P | RDS(on) = 4.0 mΩ (typ), Qg = 135 nC, TO-247 package | Higher gate charge increases driver loss; through-hole mounting limits board density | Preferred where legacy TO-247 heatsink infrastructure exists and gate drive capability exceeds 2 A peak |
| IRFP4868PbF | RDS(on) = 3.8 mΩ (typ), Qg = 145 nC, TO-247AC package | Larger Ciss (7200 pF) and slower tr/tf limit usable frequency to ≤50 kHz | Selected when cost sensitivity outweighs switching loss and board space constraints |
Compared with IXFH180N10P and IRFP4868PbF, STH180N10F3-6 offers superior RDS(on) × Qg trade-off and surface-mount thermal performance, making it optimal for compact, high-frequency, high-reliability power stages where PCB real estate and thermal management are constrained.
Availability
STH180N10F3-6 is available at Aetrix Electronics and suitable for industrial motor drives, telecom DC-DC converters, and solar microinverters requiring stable component supply and long-term production continuity.
Supply support for STH180N10F3-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power, analog, MEMS, and microcontroller technologies for industrial, automotive, and consumer markets.
This device belongs to ST's STripFET™ F3 Power MOSFET product line, engineered specifically for high-efficiency, high-current switching in industrial power conversion and motor control applications.
FAQ
What is the maximum recommended gate-source voltage for reliable operation?
The absolute maximum VGS is ±20 V per datasheet Table 2. For long-term reliability, ST recommends limiting VGS to +15 V during normal switching and avoiding negative gate bias below –10 V. Gate oxide integrity is preserved within this range, and typical gate drivers (e.g., UCC27531) operate safely at 12–15 V drive.
Can STH180N10F3-6 be used in paralleled configurations?
Yes - its positive temperature coefficient of RDS(on) (see Figure 11) ensures inherent current sharing across paralleled units. Layout symmetry, matched gate drive impedance, and shared source inductance are critical; ST recommends ≤1 nH per source path difference to avoid dynamic imbalance above 100 kHz.
Is the H²PAK-6 package RoHS and REACH compliant?
Yes - the device carries ECOPACK®2 compliance, meeting RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Lead-free termination and halogen-free molding compound are confirmed in ST's official material declarations (DocID026719).
What is the safe operating area (SOA) limitation at 100 °C case temperature?
At TC = 100 °C, the continuous drain current is derated to 120 A (Table 2). The SOA curve (Figure 2) shows that pulse operation up to 720 A is permitted only for ≤100 µs pulses with duty cycle ≤1.5%, due to thermal and avalanche limits - sustained operation beyond 120 A requires active cooling or derating.
STH180N10F3-6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STripFET™ III
- Package/Case:
- TO-263-7, D2PAK (6 Leads + Tab)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 180A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 4.5mOhm @ 60A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 114.6 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 6665 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 315W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- H2PAK-6
STH180N10F3-6 FAQ
1.How can I place an order for STH180N10F3-6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STH180N10F3-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STH180N10F3-6 reliable?
The price and inventory of STH180N10F3-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STH180N10F3-6 is usually 5 days.
3.What payment methods are accepted for STH180N10F3-6?
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4.How is shipping managed for STH180N10F3-6?
STH180N10F3-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STH180N10F3-6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STH180N10F3-6?
For technical support, including STH180N10F3-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STH180N10F3-6 requirements.
6.How does Aetrix verify that STH180N10F3-6 is sourced from the original manufacturer or authorized distributors?
All STH180N10F3-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STH180N10F3-6 meets industry standards.
7.What is the process for return or replacement of STH180N10F3-6?
All STH180N10F3-6 units undergo pre-shipment inspection (PSI). If there is an issue with STH180N10F3-6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STH180N10F3-6 part is unused and in its original packaging.
Return procedure for STH180N10F3-6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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