STMicroelectronics STH240N75F3-6
- Part No.:
- STH240N75F3-6
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-263-7, D2PAK (6 Leads + Tab)
- Datasheet:
-
STH240N75F3-6.pdf
- Description:
- MOSFET N-CH 75V 180A H2PAK-6
- Quantity:
- Payment:

- Shipping:

Inventory:920
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STH240N75F3-6 from STMicroelectronics is an N-channel enhancement-mode Power MOSFET in H²PAK-6 package, rated for 75 V VDS, 2.6 mΩ typ. RDS(on) at VGS = 10 V and 90 A, with 180 A continuous drain current at TC = 25 °C. It delivers low conduction loss and ultra-low parasitic inductance for high-efficiency switching in DC-DC converters and motor drives.
For engineers reviewing the STH240N75F3-6 datasheet, STH240N75F3-6 pinout, STH240N75F3-6 application, or STH240N75F3-6 equivalent, this device is selected for high-current, high-frequency power stages where thermal resistance junction-to-case (0.5 °C/W max) and gate charge (87 nC typ.) directly impact system efficiency and thermal design.
Technical Context
This MOSFET employs STMicroelectronics' STripFET™ III process to simultaneously minimize RDS(on) and total gate charge (Qg = 87 nC typ.), enabling fast switching with reduced Miller plateau time and lower switching losses. Its H²PAK-6 package integrates a large copper tab for direct heatsinking and optimized source/drain terminal layout to suppress parasitic inductance.
The device supports unclamped inductive switching with 600 mJ single-pulse avalanche energy (Tj = 25 °C, ID = 60 A, VDD = 15 V) and exhibits robust body diode performance: trr = 80 ns typ., Qrr = 180 nC typ., and VSD = 1.5 V at ISD = 120 A, making it suitable for synchronous rectification and freewheeling paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 75 V - Maximum blocking voltage in high-side or half-bridge configurations without derating |
| RDS(on) typ. | 2.6 mΩ at VGS = 10 V, ID = 90 A - Enables <1.5 W conduction loss at 120 A, reducing heatsink requirements |
| ID cont. | 180 A at TC = 25 °C - Supports high-current power stages in server VRMs and industrial inverters |
| Qg | 87 nC typ. - Low gate drive power demand; compatible with standard 1-A peak gate drivers |
| Rthj-case | 0.5 °C/W max - Allows >500 W dissipation with modest heatsinking (ΔT = 25 °C) |
| EAS | 600 mJ - Withstands transient inductive energy in motor control and UPS applications |
| tr/tf | 70 ns / 15 ns typ. - Enables >500 kHz switching in resonant topologies with controlled dV/dt |
Pinout & Package
H²PAK-6 is a surface-mount, low-profile power package with integrated copper drain tab (exposed on bottom), designed for high-current PCB mounting and direct thermal coupling to heatsinks. The package features separate source and gate terminals to minimize common-source inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TAB (Drain) | Power Drain connection | Exposed copper drain pad - primary thermal path and high-current return; must be soldered to large copper area |
| Pin 1 (G) | Gate input | Isolated gate terminal - routed with short, low-inductance trace to minimize ringing during switching |
| Pins 2–7 (S) | Source return | Multi-pin source connection - reduces source inductance and improves current sharing across parallel devices |
Key Features
| Feature | Design Value |
|---|---|
| STripFET™ III process technology | Simultaneously optimizes RDS(on) and Qg - enables higher efficiency than previous-generation 75 V MOSFETs at same die size |
| Ultra-low RDS(on) × Qg figure of merit | 227 mΩ·nC - quantifies superior switching-conduction trade-off for hard-switched SMPS |
| Low-profile H²PAK-6 package | Max height 4.8 mm - fits into space-constrained 1U server power supplies and compact motor controllers |
| Robust body diode | trr = 80 ns, Qrr = 180 nC - minimizes commutation loss and EMI in synchronous buck and LLC converters |
Applications
| Server VRM Phase Legs | Industrial Motor Inverters |
|---|---|
Use Scenario: High-density 48 V–12 V step-down conversion in AI accelerator racks requiring >400 A per phase. IC Role / Device Role / Timing Role: High-side and low-side switching element in multiphase buck converter; operates at 300–600 kHz with precise dead-time control. Use Value: 2.6 mΩ RDS(on) and 0.5 °C/W Rthj-case enable >95% efficiency at full load while maintaining Tj < 125 °C without forced air. | Use Scenario: 3-phase inverter stage for 5–10 kW servo drives in CNC machinery. IC Role / Device Role / Timing Role: IGBT replacement in 16 kHz PWM-driven bridge arms; handles 180 A peak motor current with minimal shoot-through risk. Use Value: Low Qgd/Qgs ratio (30/87 nC) ensures clean turn-off and stable operation under high dv/dt conditions near motor windings. |
| Onboard Charger (OBC) DC-DC Stage | Solar Microinverter Half-Bridge |
Use Scenario: Isolated bidirectional DC-DC stage in EV onboard chargers interfacing 400 V battery and 12 V auxiliary systems. IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge topology; conducts 120 A RMS with 50% duty cycle. Use Value: 600 mJ EAS withstands transformer leakage inductance spikes during zero-voltage switching transitions. | Use Scenario: High-efficiency 250–400 V DC input stage in residential solar microinverters. IC Role / Device Role / Timing Role: Low-side switch in half-bridge inverter leg; switches at 50–100 kHz with soft recovery requirements. Use Value: Body diode trr = 80 ns and low Qrr reduce reverse recovery loss by >30% vs. standard trench MOSFETs, improving full-load efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 75 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRFB4115PBF | RDS(on) = 3.2 mΩ (max), Qg = 120 nC - higher conduction and switching loss | Designed for lower-frequency (<100 kHz) industrial motor drives; less optimized for high-frequency VRMs | Select when cost sensitivity outweighs efficiency targets and thermal margin is ample |
| IXFH40N75X3 | RDS(on) = 2.8 mΩ (typ), Qg = 72 nC - slightly lower gate charge but higher RDS(on) | Optimized for avalanche ruggedness (EAS = 1.2 J); used in UPS and welding equipment | Select when unclamped inductive load stress exceeds 600 mJ or ambient temperature exceeds 105 °C |
Compared with IRFB4115PBF and IXFH40N75X3, STH240N75F3-6 offers the lowest RDS(on) × Qg product (227 mΩ·nC), enabling highest efficiency in high-frequency, high-current applications where thermal headroom is constrained.
Availability
STH240N75F3-6 is available at Aetrix Electronics and suitable for server VRMs, industrial motor inverters, and onboard charger DC-DC stages requiring stable component supply and long-term production continuity.
Supply support for STH240N75F3-6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and power applications.
This device belongs to ST's STripFET™ Power MOSFET product line, engineered specifically for high-efficiency, high-power-density switching applications including data center power supplies, renewable energy inverters, and electric vehicle subsystems.
FAQ
What is the maximum recommended gate-source voltage for reliable operation?
The absolute maximum VGS rating is ±20 V, but ST recommends limiting gate drive to +15 V / –5 V for long-term reliability. Operation above +15 V increases gate oxide stress and accelerates threshold voltage drift; below –5 V risks incomplete turn-off due to Miller-induced false triggering in high-dv/dt environments.
Can STH240N75F3-6 be paralleled with identical units without external gate resistors?
No. While matched RDS(on) and gate charge support current sharing, each device requires individual gate resistors (typically 2.2–4.7 Ω) to dampen oscillation and equalize turn-on/turn-off timing. Layout asymmetry and PCB inductance differences will otherwise cause dynamic current imbalance, especially above 200 kHz.
Is the H²PAK-6 package RoHS-compliant and lead-free?
Yes. The H²PAK-6 package meets RoHS Directive 2011/65/EU and is lead-free, halogen-free, and compliant with ST's ECOPACK®2 environmental standard. The device carries the "ECOPACK2" marking on its top-side laser etch and uses matte tin plating on all terminations.
Does the datasheet specify maximum safe operating area (SOA) for linear-mode operation?
Yes. Figure 2 in the datasheet defines the SOA curve for DC, pulsed, and repetitive operation up to 10 ms. At VDS = 40 V and TC = 25 °C, the device supports ≤120 A continuously; at 100 °C case temperature, the limit drops to ~75 A. Linear-mode use requires strict thermal monitoring and derating per the SOA graph.
STH240N75F3-6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STripFET™ III
- Package/Case:
- TO-263-7, D2PAK (6 Leads + Tab)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 180A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 3mOhm @ 90A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 87 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 6800 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- H2PAK-6
STH240N75F3-6 FAQ
1.How can I place an order for STH240N75F3-6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STH240N75F3-6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STH240N75F3-6 reliable?
The price and inventory of STH240N75F3-6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STH240N75F3-6 is usually 5 days.
3.What payment methods are accepted for STH240N75F3-6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STH240N75F3-6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STH240N75F3-6?
STH240N75F3-6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STH240N75F3-6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STH240N75F3-6?
For technical support, including STH240N75F3-6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STH240N75F3-6 requirements.
6.How does Aetrix verify that STH240N75F3-6 is sourced from the original manufacturer or authorized distributors?
All STH240N75F3-6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STH240N75F3-6 meets industry standards.
7.What is the process for return or replacement of STH240N75F3-6?
All STH240N75F3-6 units undergo pre-shipment inspection (PSI). If there is an issue with STH240N75F3-6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STH240N75F3-6 part is unused and in its original packaging.
Return procedure for STH240N75F3-6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STH240N75F3-6 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

