STMicroelectronics STH275N8F7-6AG
- Part No.:
- STH275N8F7-6AG
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-263-7, D2PAK (6 Leads + Tab)
- Datasheet:
-
STH275N8F7-6AG.pdf
- Description:
- MOSFET N-CH 80V 180A H2PAK-6
- Quantity:
- Payment:

- Shipping:

Inventory:1,842
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STH275N8F7-6AG from STMicroelectronics is an automotive-grade N-channel 80 V, 1.7 mΩ typ. RDS(on), 180 A continuous drain current Power MOSFET in H²PAK-6 package, utilizing STripFET™ F7 trench technology for ultra-low conduction loss and fast switching. It delivers 0.775 J single-pulse avalanche energy and supports high-current motor control and DC-DC conversion in engine management systems.
For engineers reviewing the STH275N8F7-6AG datasheet, STH275N8F7-6AG pinout, STH275N8F7-6AG application, or STH275N8F7-6AG equivalent, key selection criteria include its AEC-Q101 qualification, 0.48 °C/W junction-to-case thermal resistance, low Crss/Ciss ratio for EMI immunity, and H²PAK-6 thermal pad layout compatibility with high-power PCB heatsinking.
Technical Context
This device implements an enhanced trench-gate STripFET™ F7 structure that reduces both RDS(on) (1.7 mΩ typ. at VGS = 10 V) and gate charge (Qg = 193 nC), enabling high-efficiency synchronous rectification and PWM motor drive. Its Crss/Ciss ratio of ~1.7% (236 pF / 13600 pF) suppresses Miller-induced turn-on during high-dV/dt switching.
The H²PAK-6 package integrates a large exposed thermal pad and six source terminals to minimize parasitic inductance and improve current sharing. With 720 A pulsed drain capability and 315 W total dissipation at TC = 25 °C, it operates reliably across –55 °C to 175 °C junction temperature range under automotive transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V - Supports 48 V automotive systems with 20% margin against load dump transients |
| RDS(on) typ. | 1.7 mΩ - Enables <1.5 W conduction loss at 90 A, reducing heatsink requirements |
| ID cont. | 180 A - Rated for continuous operation at TC = 25 °C and 100 °C, limited by package |
| EAS | 0.775 J - Withstands unclamped inductive switching events in motor phase-legs without failure |
| Qg | 193 nC - Optimized for gate drivers delivering ≥2 A peak to achieve <100 ns turn-on delay |
| Rthj-case | 0.48 °C/W - Enables direct mounting to cold plates or chassis for >200 W thermal handling |
| Crss/Ciss | 1.7% - Low reverse transfer capacitance improves noise immunity in high-frequency inverters |
Pinout & Package
H²PAK-6 is a surface-mount power package with six parallel source terminals (S1–S6), one drain terminal (D), and one gate terminal (G), featuring an oversized copper thermal pad on the bottom for PCB-level heat extraction. The package complies with AEC-Q101 and ECOPACK® environmental standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Gate control input | Accepts 0–10 V logic-level drive; requires 193 nC total charge for full enhancement |
| D | Drain connection | High-side or low-side switch node; rated for 80 V blocking and 720 A pulsed current |
| S1–S6 | Source return paths | Six parallel terminals reduce source inductance and distribute 180 A current evenly across PCB traces |
| Thermal pad | Junction-to-PCB thermal path | Exposed copper area directly soldered to inner-layer ground/power planes for 0.48 °C/W Rthj-case |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive powertrain and chassis applications per stress test requirements |
| Low RDS(on) × Qg FoM | 328 mΩ·nC - Balances conduction and switching losses for 100–200 kHz DC-DC converters |
| High avalanche ruggedness | 0.775 J EAS at Tj = 25 °C - Survives repetitive inductive turn-off without parameter shift |
| Low Crss/Ciss ratio | 1.7% - Reduces risk of false turn-on during high dV/dt commutation in half-bridge topologies |
| H²PAK-6 thermal architecture | 0.48 °C/W Rthj-case - Supports >200 W continuous power dissipation with standard 2 oz Cu FR-4 PCB |
Applications
| Electric Power Steering (EPS) | 48 V Mild Hybrid DC-DC Converter |
|---|---|
Use Scenario: High-current H-bridge driving 3-phase EPS motor with 150 A peak phase current. IC Role / Device Role / Timing Role: Low-side switching element in three-phase inverter leg, operating at 10–20 kHz PWM. Use Value: 1.7 mΩ RDS(on) limits I²R loss to <4 W per device at 120 A, enabling compact heatsink design. | Use Scenario: Synchronous rectifier in 3.3 kW bi-directional buck-boost converter between 12 V and 48 V rails. IC Role / Device Role / Timing Role: High-efficiency secondary-side switch with 193 nC Qg compatible with 2 A gate drivers. Use Value: 0.48 °C/W thermal resistance allows direct PCB copper plane cooling, eliminating discrete heatsinks. |
| Engine Start-Stop System | Onboard Charger (OBC) Primary Switch |
Use Scenario: High-side main switch controlling battery disconnect during cranking and regenerative braking. IC Role / Device Role / Timing Role: 80 V-rated power switch handling 180 A continuous load with 720 A surge capability. Use Value: 0.775 J EAS ensures robustness against inductive kickback from solenoid and relay coils. | Use Scenario: Primary-side hard-switched MOSFET in 6.6 kW OBC AC/DC stage operating at 65 kHz. IC Role / Device Role / Timing Role: Fast-turning, low-Coss switch minimizing switching loss in LLC resonant topology. Use Value: Coss = 2050 pF and Crss = 236 pF enable stable zero-voltage switching up to 100 kHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 80 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon IPP026N08N | RDS(on) = 2.6 mΩ (typ.), Qg = 160 nC, TO-220FP package | Higher conduction loss; lacks AEC-Q101 qualification and H²PAK-6 thermal performance | Preferred where cost sensitivity outweighs thermal density and automotive compliance |
| ON Semiconductor NTMFS5C673NL | RDS(on) = 1.85 mΩ (typ.), Qg = 175 nC, SO-8FL package | Lower current rating (120 A), no avalanche rating published, smaller thermal pad | Selected for space-constrained 48 V auxiliary supplies where 180 A is not required |
Compared with IPP026N08N and NTMFS5C673NL, STH275N8F7-6AG offers the lowest RDS(on) (1.7 mΩ), highest pulsed current (720 A), and only AEC-Q101-qualified option with H²PAK-6's 0.48 °C/W thermal resistance-making it optimal for high-reliability automotive traction and energy conversion.
Availability
STH275N8F7-6AG is available at Aetrix Electronics and suitable for electric power steering, 48 V mild hybrid DC-DC conversion, and onboard charger applications requiring stable component supply, long-term automotive lifecycle support, and traceable sourcing.
Supply support for STH275N8F7-6AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
STripFET™ F7 is ST's seventh-generation trench MOSFET platform targeting high-current, high-efficiency automotive power conversion-specifically engineered for engine control units, EPS, and 48 V system switches where low RDS(on), avalanche ruggedness, and thermal density are critical.
FAQ
What is the maximum allowable gate-source voltage for STH275N8F7-6AG?
The absolute maximum VGS is ±20 V, with recommended operating range of –10 V to +15 V. Exceeding ±20 V risks permanent gate oxide damage. Gate drive circuits must include clamping (e.g., Zener diodes) to prevent overshoot during fast switching transitions, especially in high-noise automotive environments.
Does STH275N8F7-6AG have integrated body diode recovery characteristics suitable for synchronous rectification?
Yes. It features a fast, soft-recovery body diode with trr = 78 ns and Qrr = 182 nC at Tj = 150 °C, enabling efficient synchronous rectification in DC-DC converters. The low IRRM (4.7 A) and controlled di/dt response reduce switching node ringing and EMI in high-frequency topologies.
How does the H²PAK-6 package differ mechanically from H²PAK-2 for this part number?
H²PAK-6 adds five extra source terminals (S2–S6) versus H²PAK-2's single source pin, reducing source loop inductance by >60%. Its footprint has wider terminal spacing (e1 = 4.88–5.28 mm, e2 = 7.42–7.82 mm) and optimized thermal pad geometry to support higher current density and lower Rthj-pcb on multilayer boards.
Is STH275N8F7-6AG suitable for use in a high-side configuration with bootstrap gate driving?
Yes. Its VDS = 80 V rating and VGS = ±20 V tolerance support bootstrap-based high-side drive in half-bridge configurations up to 60 V bus voltage. Designers must ensure gate driver output swing exceeds VGS(th) (2.5–4.5 V) and provides ≥2 A peak current to charge 193 nC Qg within required switching times.
STH275N8F7-6AG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STripFET™ F7
- Package/Case:
- TO-263-7, D2PAK (6 Leads + Tab)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 180A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 2.1mOhm @ 90A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 193 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 13600 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 315W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- H2PAK-6
STH275N8F7-6AG FAQ
1.How can I place an order for STH275N8F7-6AG through Aetrix?
Please submit a Request for Quotation (RFQ) for STH275N8F7-6AG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STH275N8F7-6AG reliable?
The price and inventory of STH275N8F7-6AG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STH275N8F7-6AG is usually 5 days.
3.What payment methods are accepted for STH275N8F7-6AG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STH275N8F7-6AG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STH275N8F7-6AG?
STH275N8F7-6AG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STH275N8F7-6AG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STH275N8F7-6AG?
For technical support, including STH275N8F7-6AG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STH275N8F7-6AG requirements.
6.How does Aetrix verify that STH275N8F7-6AG is sourced from the original manufacturer or authorized distributors?
All STH275N8F7-6AG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STH275N8F7-6AG meets industry standards.
7.What is the process for return or replacement of STH275N8F7-6AG?
All STH275N8F7-6AG units undergo pre-shipment inspection (PSI). If there is an issue with STH275N8F7-6AG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STH275N8F7-6AG part is unused and in its original packaging.
Return procedure for STH275N8F7-6AG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STH275N8F7-6AG Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

