STMicroelectronics STH30N65DM6-7AG
- Part No.:
- STH30N65DM6-7AG
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
- Datasheet:
-
STH30N65DM6-7AG.pdf
- Description:
- AUTOMOTIVE-GRADE N-CHANNEL 650 V
- Quantity:
- Payment:

- Shipping:

Inventory:135
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STH30N65DM6-7AG from STMicroelectronics is an AEC-Q101 qualified N-channel 650 V Power MOSFET in H²PAK-7 package, featuring 102 mΩ typ. RDS(on), 28 A continuous drain current at TC = 25 °C, and fast-recovery body diode with 126 ns trr (TJ = 25 °C). It enables high-efficiency ZVS phase-shift converters and hard-switched bridge topologies in automotive and industrial power supplies.
For engineers reviewing the STH30N65DM6-7AG datasheet, STH30N65DM6-7AG pinout, STH30N65DM6-7AG application, or STH30N65DM6-7AG equivalent, key selection criteria include dv/dt ruggedness (100 V/ns), Qrr (0.63 µC), gate charge (46 nC), thermal resistance (RthJC = 0.56 °C/W), and avalanche energy rating (EAS = 600 mJ).
Technical Context
This MDmesh DM6 device uses a superjunction structure optimized for low Qrr and high dv/dt immunity, achieving 339 pF Coss,eq at VDS = 520 V and Zener-protected gate oxide. Its fast-recovery body diode eliminates need for external anti-parallel diodes in resonant LLC and phase-shift full-bridge designs.
The H²PAK-7 package integrates a thermally enhanced drain tab with seven terminals: one gate, one driver source, one power source, and four parallel source pins - enabling low-inductance, high-current source return paths critical for minimizing switching losses and EMI in >1 kW systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 650 V - supports 400 V DC bus operation with ≥30% voltage margin for transient overvoltage in industrial and automotive on-board chargers. |
| RDS(on) max | 115 mΩ - ensures ≤3.2 W conduction loss at 28 A, enabling compact heatsink design in space-constrained 3–5 kW PFC stages. |
| Qg | 46 nC - reduces gate drive power requirement and allows use of lower-power isolated gate drivers (e.g., Si823x) without boost circuitry. |
| trr | 126 ns (TJ = 25 °C) - minimizes reverse recovery tail current, reducing turn-off losses and snubber stress in hard-switched topologies. |
| dv/dt ruggedness | 100 V/ns - prevents spurious turn-on during high-slew-rate commutation in motor drives and solar inverters with long cable runs. |
| EAS | 600 mJ - provides robust unclamped inductive switching capability, eliminating need for external clamping circuits in flyback or forward converters. |
| RthJC | 0.56 °C/W - enables 223 W power dissipation at TC = 25 °C, supporting high-power density designs with direct heatsink mounting. |
Pinout & Package
H²PAK-7 is a surface-mount, thermally optimized power package with exposed copper drain tab (TAB) and seven signal terminals. The package features dual-source configuration (driver source + power source) to separate control and power return paths, reducing gate loop inductance and improving switching stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TAB | Drain | Primary heat transfer path to heatsink; electrically connected to drain; requires insulated mounting in non-isolated topologies. |
| 1 | Gate | High-impedance control input; connects to gate driver output via low-inductance trace; sensitive to ringing due to low Ciss (2000 pF). |
| 2 | Driver Source | Reference node for gate driver IC; isolates gate loop from high di/dt power return, suppressing Miller-induced false turn-on. |
| 3–7 | Power Source | Five parallel source terminals (pins 3, 4, 5, 6, 7); collectively carry full 28 A load current; minimize source inductance and voltage bounce. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive under-hood applications including OBCs and DC-DC converters operating from −40 °C to 150 °C junction temperature. |
| Zener-protected gate | Integrated gate oxide protection withstands ±25 V transient gate-source voltage, eliminating need for external Zener clamp in noisy environments. |
| 100% avalanche tested | Each unit undergoes single-pulse unclamped inductive switching test at IAR = 4 A and EAS = 600 mJ, ensuring production-level ruggedness. |
| Low Coss,eq | 339 pF across 0–520 V range - reduces capacitive turn-off loss and improves light-load efficiency in resonant converters. |
| Extremely high dv/dt ruggedness | 100 V/ns rating verified per JEDEC JESD24-11 - enables reliable operation in high-frequency, high-voltage switching nodes with minimal layout sensitivity. |
Applications
| On-Board Charger (OBC) | Industrial AC-DC Power Supply |
|---|---|
|
Use Scenario: Bidirectional 6.6 kW OBC using phase-shift full-bridge topology with 400 V battery interface. IC Role / Device Role / Timing Role: Primary-side high-side switch handling 28 A RMS current and 650 V blocking; operates at 100–200 kHz with ZVS. Use Value: Low Qrr (0.63 µC) and fast trr (126 ns) reduce dead-time losses and improve ZVS window margin across full load range. |
Use Scenario: Three-phase PFC front-end in 10 kW industrial UPS with active clamp circuitry. IC Role / Device Role / Timing Role: Boost switch in interleaved totem-pole PFC stage; switches at 65 kHz with 520 V VDS peak. Use Value: 102 mΩ RDS(on) and 0.56 °C/W RthJC enable >98.5% efficiency at full load without forced air cooling. |
| Solar Microinverter | EV Traction Inverter Auxiliary Supply |
|
Use Scenario: 300–600 V DC input microinverter with transformerless H5 topology and 50 kHz switching. IC Role / Device Role / Timing Role: High-side bridge leg switch subjected to repetitive 100 V/ns dv/dt transients during zero-crossing commutation. Use Value: 100 V/ns dv/dt ruggedness prevents parasitic turn-on, eliminating need for negative gate voltage or complex gate drive timing compensation. |
Use Scenario: 12 V auxiliary supply in 800 V EV traction inverter, using flyback converter with 650 V primary switch. IC Role / Device Role / Timing Role: Primary-side MOSFET in 100 kHz flyback; subjected to unclamped inductive energy during MOSFET turn-off. Use Value: 600 mJ EAS rating allows safe operation without external RCD snubber, reducing BOM count and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW30N65DM6 | Housing in TO-247-3L package; identical die, but higher RthJC (0.75 °C/W) and no driver source pin. | Limited to lower-frequency (<100 kHz) or forced-air-cooled designs; unsuitable for ultra-low-inductance gate loops. | Select when legacy TO-247 footprint compatibility is required and thermal margin exceeds 25 °C/W. |
| IXFH30N65X2 | 650 V, 120 mΩ, 30 A; uses X2 technology with higher Qg (62 nC) and slower trr (200 ns); not AEC-Q101 qualified. | Better suited for cost-sensitive industrial SMPS where automotive qualification is unnecessary. | Prefer for non-automotive 1–3 kW PSUs where gate drive simplicity outweighs dv/dt and recovery performance. |
Compared with STW30N65DM6 and IXFH30N65X2, STH30N65DM6-7AG delivers superior thermal performance (0.56 vs. 0.75/1.2 °C/W), lower switching losses (46 vs. 62 nC Qg, 126 vs. 200 ns trr), and automotive-grade reliability - making it optimal for space- and efficiency-critical OBC and traction auxiliary systems.
Availability
STH30N65DM6-7AG is available at Aetrix Electronics and suitable for on-board chargers, industrial AC-DC power supplies, and solar microinverters requiring stable component supply, automotive qualification, and high dv/dt immunity.
Supply support for STH30N65DM6-7AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and power applications since 1987.
This device belongs to the MDmesh DM6 family - engineered specifically for high-efficiency, high-frequency hard-switched and resonant power converters demanding low Qrr, high ruggedness, and AEC-Q101 compliance.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The STH30N65DM6-7AG supports 18 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS13646 Rev 3. This derating reflects thermal limits of the H²PAK-7 package and ensures safe operation within SOA boundaries up to 150 °C junction temperature.
Does this MOSFET require an external gate resistor for stability?
Yes - a gate resistor (typically 4.7 Ω) is recommended to dampen ringing caused by low gate impedance and PCB trace inductance. Figure 13 in DS13646 shows the standard test circuit using RG = 4.7 Ω, and measured td(on)/td(off) values assume this configuration.
Can the driver source (pin 2) and power source (pins 3–7) be shorted together?
No - shorting driver source and power source defeats the dual-source architecture's purpose. Pin 2 must connect only to the gate driver's reference, while pins 3–7 return high di/dt load current directly to the power ground plane to prevent gate loop coupling and false turn-on.
Is the body diode suitable for synchronous rectification?
No - although fast (trr = 126 ns), the body diode has relatively high VSD (1.6 V at 28 A) and lacks controlled reverse recovery slope. It is intended for freewheeling only; external Schottky or SiC diodes are preferred for synchronous rectification in high-efficiency designs.
STH30N65DM6-7AG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ DM2
- Package/Case:
- TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 28A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 115mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 4.75V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 46 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2000 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 223W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- H2PAK-7
STH30N65DM6-7AG FAQ
1.How can I place an order for STH30N65DM6-7AG through Aetrix?
Please submit a Request for Quotation (RFQ) for STH30N65DM6-7AG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STH30N65DM6-7AG reliable?
The price and inventory of STH30N65DM6-7AG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STH30N65DM6-7AG is usually 5 days.
3.What payment methods are accepted for STH30N65DM6-7AG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STH30N65DM6-7AG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STH30N65DM6-7AG?
STH30N65DM6-7AG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STH30N65DM6-7AG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STH30N65DM6-7AG?
For technical support, including STH30N65DM6-7AG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STH30N65DM6-7AG requirements.
6.How does Aetrix verify that STH30N65DM6-7AG is sourced from the original manufacturer or authorized distributors?
All STH30N65DM6-7AG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STH30N65DM6-7AG meets industry standards.
7.What is the process for return or replacement of STH30N65DM6-7AG?
All STH30N65DM6-7AG units undergo pre-shipment inspection (PSI). If there is an issue with STH30N65DM6-7AG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STH30N65DM6-7AG part is unused and in its original packaging.
Return procedure for STH30N65DM6-7AG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STH30N65DM6-7AG Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

