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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

STMicroelectronics STK30N2LLH5

Name: STK30N2LLH5
Brand: STMicroelectronics
SKU: STK30N2LLH5
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: STK30N2LLH5

Manufacturer:: STMicroelectronics

Category:: FETs, MOSFETs

Package:: PolarPak®

Datasheet:: STK30N2LLH5.pdf

Description:: MOSFET N-CH 25V 30A POLARPAK

Quantity:: RFQ Add To RFQ list

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Product details

Overview

STK30N2LLH5 from STMicroelectronics is an N-channel 25 V, 30 A PolarPAK® Power MOSFET with R_DS(on) = 0.0024 Ω (at V_GS = 10 V), Q_g = 18 nC, and ultra-low junction-to-case thermal resistance (R_thj-c = 1.0 °C/W top drain). It employs STripFET™ V technology for high-efficiency DC-DC converters in server VRMs and POL modules.

For engineers reviewing the STK30N2LLH5 datasheet, STK30N2LLH5 pinout, STK30N2LLH5 application, or STK30N2LLH5 equivalent, key selection criteria include its chip-scale PolarPAK® package, 25 V V_DS, sub-3 mΩ on-resistance at 10 V gate drive, avalanche ruggedness, and 100% matte tin finish compliant with RoHS 2002/95/EC.

Technical Context

This device implements ST's 5th-generation STripFET™ V process in a dual-sided cooled PolarPAK® package, enabling simultaneous top-drain and bottom-source thermal paths. Its R_DS(on) × Q_g figure of merit is 54 nC·mΩ - among the lowest in its class - directly supporting high-frequency, high-density synchronous buck designs.

The MOSFET features fully encapsulated die, 150 °C maximum junction temperature, and specified avalanche energy (E_AS) under unclamped inductive switching. Gate threshold voltage (V_GS(th)) is 1–2.5 V, ensuring robust turn-on with 4.5 V logic-level drive.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	25 V - Maximum drain-source blocking voltage; suitable for 12 V input bus systems with margin.
R_DS(on)	0.0024 Ω @ V_GS = 10 V - Enables <15 mW conduction loss at 30 A, critical for >95% efficiency POL stages.
Q_g	18 nC - Low total gate charge reduces driver power and enables >1 MHz switching without excessive losses.
I_D (cont)	30 A @ T_C = 25 °C - Rated current assumes FR-4 board with 1 in² 2 oz Cu; derates to 18.75 A at 100 °C case.
R_thj-c (top)	1.0 °C/W - Ultra-low junction-to-case (drain side) thermal resistance supports direct heatsink mounting on top surface.
V_GS(th)	1–2.5 V - Logic-compatible threshold ensures reliable enhancement-mode turn-on with standard 3.3 V or 5 V gate drivers.
E_AS	TBD - Specified single-pulse avalanche energy (T_J = 25 °C, I_D = 15 A, V_DD = 25 V); confirms ruggedness in inductive fault conditions.

Pinout & Package

PolarPAK® is a chip-scale, dual-side thermal package with exposed top drain and bottom source terminals. The device has 3 terminals: Drain (top metal pad), Source (bottom metal pad), and Gate (peripheral bond pad).

Pin/Terminal	Circuit Role	Design Meaning
Top Metal Pad	Drain (D)	Primary high-current path; thermally coupled to heatsink via top-side mounting; electrically isolated from PCB.
Bottom Metal Pad	Source (S)	Low-side return path; soldered to PCB ground plane; provides primary thermal path to board copper.
Peripheral Bond Pad	Gate (G)	Control terminal; requires low-inductance routing to minimize switching oscillation; not thermally significant.

Key Features

Feature	Design Value
Ultra-low R_DS(on) × Q_g	54 nC·mΩ - Enables high-frequency operation with minimal combined conduction and switching loss in compact VRMs.
Dual thermal interface	Top drain (R_thj-c = 1.0 °C/W) + bottom source (R_thj-c = 2.8 °C/W) - Allows simultaneous cooling from both sides for >100 W/in² power density.
100% matte tin finish	RoHS-compliant, lead-free second-level interconnect per JEDEC JESD97 - eliminates Pb-based solder compatibility concerns and whisker risk.
High avalanche ruggedness	Specified E_AS testing - Ensures survivability during transient overcurrent events in non-clamped topologies (e.g., synchronous buck freewheeling).

Applications

Server Voltage Regulator Modules

Point-of-Load Converters

Use Scenario: High-current, multi-phase buck converters supplying CPU/GPU core voltage (0.8–1.2 V) from 12 V intermediate bus.

IC Role / Device Role / Timing Role: Synchronous rectifier (low-side switch) operating at 300–1000 kHz with tight duty cycle control.

Use Value: Sub-3 mΩ R_DS(on) minimizes conduction loss at 30+ A load currents, directly improving system efficiency and reducing thermal footprint.

Use Scenario: Compact, high-efficiency DC-DC modules powering FPGAs, ASICs, or memory subsystems in telecom and networking equipment.

IC Role / Device Role / Timing Role: Primary power switch in integrated POL modules requiring <5 mm² footprint and dual-side thermal management.

Use Value: PolarPAK® package enables direct top-side heatsinking and bottom-side PCB copper conduction, allowing >80 W/in² power density.

Industrial Motor Drive Half-Bridges

Automotive ADAS Power Supplies

Use Scenario: Low-voltage half-bridge stages in brushless DC motor controllers for HVAC blowers or pumps (12–24 V systems).

IC Role / Device Role / Timing Role: Low-side switch in 3-phase inverter leg, driven by isolated gate driver with 4.5 V logic compatibility.

Use Value: 1–2.5 V V_GS(th) ensures robust turn-on even with marginal gate drive margins, reducing risk of shoot-through.

Use Scenario: Power supply for radar sensors or camera modules in automotive ADAS systems, requiring high reliability and thermal resilience.

IC Role / Device Role / Timing Role: Main switch in 24 V-to-5 V/3.3 V buck converter operating across -40 to +125 °C ambient.

Use Value: 150 °C max T_j rating and specified avalanche capability support operation in under-hood environments with transient overvoltage exposure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Vishay SiR872DP	R_DS(on) = 0.0028 Ω @ 10 V, Q_g = 22 nC, PowerPAK® SO-8 package (larger footprint, single-side cooling)	Higher R_thj-amb (30 °C/W vs. 20–24 °C/W), less suited for ultra-dense layouts requiring dual thermal paths	Preferred when SO-8 footprint compatibility or higher V_DS (30 V) margin is required over chip-scale thermal optimization.
Infineon BSC014N04LS6	R_DS(on) = 0.0014 Ω @ 10 V, Q_g = 32 nC, OptiMOS™ 6 3.3×3.3 mm PQFN package	Lower R_DS(on) but higher Q_g; optimized for lower-frequency, higher-current operation rather than high-frequency POL	Selected when minimizing conduction loss dominates design (e.g., <500 kHz, >40 A), accepting larger gate drive burden and reduced switching efficiency.

Compared with SiR872DP and BSC014N04LS6, STK30N2LLH5 uniquely balances ultra-low R_DS(on) × Q_g, chip-scale dual thermal interface, and logic-level gate drive - making it optimal for space-constrained, high-frequency DC-DC where thermal density and switching loss are co-critical.

Availability

STK30N2LLH5 is available at Aetrix Electronics and suitable for server VRMs, point-of-load converters, industrial motor drives, and automotive ADAS power supplies requiring stable component supply and long-term manufacturability planning.

Supply support for STK30N2LLH5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

STK30N2LLH5 belongs to ST's STripFET™ V Power MOSFET product line, engineered specifically for high-efficiency, high-power-density DC-DC conversion in datacenter, telecom, and industrial power systems.

FAQ

What is the maximum continuous drain current for STK30N2LLH5 at 100 °C case temperature?

The maximum continuous drain current is 18.75 A at T_C = 100 °C, derived from the 30 A rating at 25 °C and a derating factor of 0.0416 W/°C applied to its 5.2 W total dissipation limit. This value assumes mounting on an FR-4 board with 1 inch² of 2 oz copper, per the datasheet test condition.

Does STK30N2LLH5 support 4.5 V gate drive in practical applications?

Yes - the device specifies R_DS(on) = 0.003 Ω at V_GS = 4.5 V and I_D = 15 A, confirming full enhancement-mode operation at logic-level drive. Its V_GS(th) range of 1–2.5 V ensures reliable turn-on with 3.3 V or 4.5 V gate drivers, validated in synchronous buck reference designs.

How does the PolarPAK® package improve thermal performance versus standard SO-8 MOSFETs?

PolarPAK® provides two independent thermal paths: top-side drain (R_thj-c = 1.0 °C/W) for direct heatsink attachment and bottom-side source (R_thj-c = 2.8 °C/W) for PCB copper conduction. Standard SO-8 packages rely solely on bottom-side conduction (R_thj-c ≈ 3.5–4.5 °C/W), limiting total power handling in constrained spaces.

Is STK30N2LLH5 suitable for automotive applications per AEC-Q101?

No - STK30N2LLH5 is not qualified to AEC-Q101. The datasheet explicitly states that ST products not marked "automotive grade" are intended for industrial/commercial use only. For automotive ADAS power supplies, it may be used at the designer's own risk, but no stress-test validation or guaranteed lifetime data under automotive temperature/humidity profiles is provided.

STK30N2LLH5 Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: STripFET™ V

Package/Case:: PolarPak®

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 25 V

Current - Continuous Drain (Id) @ 25°C:: 30A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 2.9mOhm @ 15A, 10V

Vgs(th) (Max) @ Id:: 2.5V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 18 nC @ 4.5 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 2290 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 5.2W (Tc)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PolarPak®

STK30N2LLH5 FAQ

1.How can I place an order for STK30N2LLH5 through Aetrix?

Please submit a Request for Quotation (RFQ) for STK30N2LLH5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STK30N2LLH5 reliable?

The price and inventory of STK30N2LLH5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STK30N2LLH5 is usually 5 days.

3.What payment methods are accepted for STK30N2LLH5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STK30N2LLH5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STK30N2LLH5?

STK30N2LLH5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STK30N2LLH5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STK30N2LLH5?

For technical support, including STK30N2LLH5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STK30N2LLH5 requirements.

6.How does Aetrix verify that STK30N2LLH5 is sourced from the original manufacturer or authorized distributors?

All STK30N2LLH5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STK30N2LLH5 meets industry standards.

7.What is the process for return or replacement of STK30N2LLH5?

All STK30N2LLH5 units undergo pre-shipment inspection (PSI). If there is an issue with STK30N2LLH5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STK30N2LLH5 part is unused and in its original packaging.

Return procedure for STK30N2LLH5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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