STMicroelectronics STL100NH3LL

Overview

STL100NH3LL from STMicroelectronics is an N-channel 30 V Power MOSFET in PowerFLAT™ (6x5) package, featuring R_DS(on) = 0.0032 Ω @ V_GS = 10 V, continuous drain current of 25 A (PCB-limited), 100 A (case-limited), and thermal resistance R_thj-case = 1.56 °C/W. It is optimized for high-efficiency DC-DC converters and synchronous rectification in portable power systems.

For engineers reviewing the STL100NH3LL datasheet, STL100NH3LL pinout, STL100NH3LL application, or STL100NH3LL equivalent, key selection criteria include low-profile thermal performance, PCB-limited current rating, gate charge (Q_g = 30 nC), avalanche energy (E_AS = 150 mJ), and compatibility with 4.5 V logic-level drive in compact power stages.

Technical Context

This STripFET™ III device uses advanced trench-gate process and chip-scaled PowerFLAT™ packaging to minimize conduction and switching losses simultaneously. Its low R_DS(on) and Q_g/Q_gd ratio (30 nC / 10 nC) support high-frequency operation up to 1 MHz in buck converters.

The integrated source-drain diode exhibits t_rr = 32 ns and Q_rr = 34 nC at T_j = 150 °C, enabling efficient synchronous rectification without external Schottky diodes. Thermal design leverages direct die-to-PCB conduction via exposed drain pad, achieving R_thj-pcb = 31.3 °C/W on 1 in² 2 oz Cu FR-4.

Key Specifications

Pinout & Package

PowerFLAT™ (6x5) is a surface-mount, leadless package with an exposed drain pad (D) on the bottom for thermal and electrical connection. Total footprint: 6.0 mm × 5.0 mm × 0.93 mm max height. JEDEC-compliant ECOPACK® with lead-free interconnect.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Compared with IRLML6344TRPBF and DMN3025LSD-13, STL100NH3LL uniquely balances 25 A PCB-limited current, 30 nC gate charge, and 6×5 mm thermal-optimized footprint-making it optimal for mid-power synchronous buck and motor drive stages requiring both density and ruggedness.

Availability

STL100NH3LL is available at Aetrix Electronics and suitable for DC-DC buck converters, motor drive half-bridges, and USB-C PD power path applications requiring stable component supply and long-term industrial availability.

Supply support for STL100NH3LL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

This part belongs to ST's STripFET™ III Power MOSFET product line, engineered specifically for high-efficiency, high-density power conversion in space- and thermal-constrained applications such as portable electronics and distributed power systems.

FAQ

What is the maximum gate-source voltage rating for reliable operation?

The STL100NH3LL supports ±16 V continuous gate-source voltage (V_GS) and ±18 V for pulses ≤15 ms. Exceeding ±16 V continuously risks gate oxide degradation. Designers must ensure gate driver clamping or Zener protection when using bootstrap circuits with high-side floating supplies.

Can this MOSFET be used in synchronous rectification without an external Schottky diode?

Yes-the integrated body diode has t_rr = 32 ns and Q_rr = 34 nC at 150 °C, enabling clean commutation in synchronous buck topologies up to 1 MHz. However, for >95% efficiency at light loads, a discrete Schottky may still be preferred due to lower V_SD (1.3 V vs. ~0.4 V).

How does the PowerFLAT™ (6x5) package affect PCB layout and thermal design?

The exposed drain pad requires a minimum 10 mm² copper pour on the primary side, connected via ≥4 thermal vias (0.3 mm diameter) to inner ground planes. Footprint tolerance is tight: D2 = 4.15–4.25 mm; misalignment >0.1 mm risks solder bridging between G and S terminals.

Is STL100NH3LL suitable for automotive applications?

No-this part is not qualified to AEC-Q101 and lacks automotive-grade screening, temperature range extension (−40 to 150 °C is specified but not validated per automotive stress tests), or PPAP documentation. ST recommends the AUIRFN3004 or STL325N4LF5 for automotive use.