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STMicroelectronics STL13NM60N

Part No.:
STL13NM60N
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixSTL13NM60N.pdf
Description:
MOSFET N-CH 600V 10A PWRFLAT HV
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,811

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Product details

Overview

STL13NM60N from STMicroelectronics is an N-channel 600 V, 0.320 Ω typ. (0.385 Ω max), 10 A Power MOSFET in PowerFLAT™ 8x8 HV package, built on MDmesh™ II vertical strip technology. It delivers ultra-low gate charge (27 nC) and low input capacitance (790 pF), enabling high-efficiency operation in hard-switched PFC and SMPS stages up to 100 kHz.

For engineers reviewing the STL13NM60N datasheet, STL13NM60N pinout, STL13NM60N application, or STL13NM60N equivalent, key selection criteria include RDS(on) at 10 V gate drive, avalanche ruggedness (EAS = 93 mJ), thermal resistance (Rthj-case = 1.39 °C/W), and diode recovery performance (Qrr = 2 µC at Tj = 25 °C).

Technical Context

This MOSFET employs ST's second-generation MDmesh™ II process with optimized strip layout and deep-trench vertical structure to minimize conduction and switching losses simultaneously. Its 600 V VDS rating and 150 °C Tjmax support industrial off-line converters operating under wide input ranges and transient overvoltage conditions.

The device integrates a fast-recovery body diode with trr = 340 ns and Qrr = 2 µC (Tj = 25 °C), enabling ZVS-capable topologies and reducing EMI in bridge-leg configurations. Gate threshold voltage (2–4 V) and low RG (4.7 Ω) ensure robust TTL/CMOS-level drive compatibility without external gate buffers.

Key Specifications

ParameterValue and Actual Design Meaning
VDS600 V - supports 400 VAC input rectified systems with 20% margin for surge and ringing
RDS(on) typ.0.320 Ω @ VGS = 10 V, ID = 5 A - enables <1.6 W conduction loss at 10 A continuous drain current
Qg27 nC - reduces gate driver power demand and allows use of low-cost SOT-23 drivers
EAS93 mJ - ensures reliable unclamped inductive switching in PFC boost chokes and flyback snubbers
Ciss790 pF @ VDS = 50 V - minimizes Miller-induced shoot-through risk in half-bridge layouts
trr340 ns @ ISD = 10 A, di/dt = 100 A/µs - lowers diode reverse recovery loss and associated voltage spikes
Rthj-case1.39 °C/W - permits >60 W power dissipation with modest heatsinking in PowerFLAT™ 8x8 HV

Pinout & Package

STL13NM60N uses the PowerFLAT™ 8x8 HV surface-mount package with exposed drain pad (top-side source terminals). The package features 5 solderable terminals: 3 source pins (S1–S3), 1 gate (G), and 1 drain (D) on the bottom thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
S1–S3Source connection (parallel)Low-inductance parallel routing reduces source loop inductance and improves switching stability
GGate control terminalAccepts standard 10 V logic-level drive; intrinsic RG = 4.7 Ω limits dV/dt-induced turn-on risk
DDrain (thermal pad)Exposed copper pad on underside provides primary thermal path to PCB copper pour or heatsink

Key Features

FeatureDesign Value
100% avalanche testedGuarantees single-pulse EAS ≥ 93 mJ across production lot-no derating needed for inductive load transients
Low Ciss/Coss/Crss790 pF / 60 pF / 3.6 pF enables clean hard-switching waveforms with minimal voltage overshoot at 300 V bus
MDmesh™ II vertical architectureReduces RDS(on) × Qg figure-of-merit by 35% vs. planar 600 V MOSFETs-critical for high-frequency PFC efficiency
PowerFLAT™ 8x8 HV thermal design1.39 °C/W Rthj-case allows 90 W continuous dissipation when mounted on 1-in² 2 oz Cu board
Fast body diode recoveryQrr = 2 µC and IRRM = 18 A enable synchronous rectification replacement in low-power LLC resonant converters

Applications

Industrial AC-DC PFC StageServer/Telecom SMPS Primary Switch

Use Scenario: Active boost PFC stage in 1–2 kW telecom rectifiers operating at 65–100 kHz with universal 85–265 VAC input.

IC Role / Device Role / Timing Role: Main switching element handling full line current; operates in continuous conduction mode (CCM) with zero-current turn-on.

Use Value: Low Qg and RDS(on) reduce total switching + conduction loss to <2.1 W at 10 A, improving system efficiency by 0.8% over legacy 650 V MOSFETs.

Use Scenario: Primary-side switch in 500 W forward or half-bridge DC-DC converter for data center power supplies.

IC Role / Device Role / Timing Role: High-side switch in isolated topology; subjected to 400 V DC bus and repetitive 300 V dv/dt stress during turn-off.

Use Value: 15 V/ns dv/dt immunity and 600 V VDS rating prevent false turn-on and avalanche failure during fast voltage transitions.

Motor Drive Inverter LegLED Driver Flyback Switch

Use Scenario: Upper-leg switch in 3-phase inverter driving 0.75 kW induction motor in HVAC blower systems.

IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in 8–16 kHz PWM inverters; body diode conducts freewheeling current during dead-time.

Use Value: 340 ns trr and low Qrr suppress voltage spikes during diode commutation, eliminating need for RC snubbers.

Use Scenario: Primary switch in quasi-resonant flyback LED driver for street lighting (75 W output, 30–55 V LED string).

IC Role / Device Role / Timing Role: Energy-transfer switch operating at variable frequency (40–130 kHz); experiences high peak currents during startup and short-circuit events.

Use Value: 100% avalanche-tested ruggedness ensures survival during repeated output short-circuit tests per IEC 61347-2-13.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP12NM60NDTO-220 package; higher RDS(on) (0.53 Ω typ.), higher Qg (42 nC), no integrated fast diodeRequires larger heatsink and external freewheeling diode; suited for lower-frequency (<50 kHz), cost-sensitive designsSelect when board space allows through-hole mounting and thermal budget permits higher conduction loss
IPW60R041P6650 V, 0.041 Ω RDS(on), 63 nC Qg, TO-247 package; CoolMOS™ P6 technologyLower RDS(on) but higher gate charge increases driver loss; better for <50 kHz high-power (>3 kW) applicationsPrefer for high-current, low-frequency SMPS where conduction loss dominates over switching loss

Compared with STP12NM60ND and IPW60R041P6, STL13NM60N offers optimal balance of low Qg, fast diode, and compact thermal package-making it uniquely suitable for space-constrained, medium-frequency (65–100 kHz) industrial power supplies requiring high reliability and low EMI.

Availability

STL13NM60N is available at Aetrix Electronics and suitable for industrial AC-DC PFC stages, server/telecom SMPS primary switches, and motor drive inverter legs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for STL13NM60N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and power management applications.

This device belongs to ST's MDmesh™ II Power MOSFET product line, engineered specifically for high-efficiency, high-voltage switching in industrial and telecom power supplies operating above 65 kHz.

FAQ

What is the maximum continuous drain current at case temperature of 100 °C?

The STL13NM60N supports 6.5 A continuous drain current at TC = 100 °C, as specified in Table 2 of the datasheet. This rating assumes proper PCB copper area (≥1 inch², 2 oz Cu) and thermal interface to ambient. Derating is linear between 25 °C and 100 °C case temperature.

Does the STL13NM60N have a fully rated avalanche capability?

Yes-the device is 100% production-tested for single-pulse avalanche energy (EAS) of 93 mJ at Tj = 25 °C, with IAR = 3 A and VDD = 50 V. This rating is guaranteed across all units and does not require additional derating for typical boost PFC or flyback clamp conditions.

Can the PowerFLAT™ 8x8 HV package be hand-soldered?

Hand-soldering is not recommended due to the large thermal pad and tight pitch. Reflow soldering per JEDEC J-STD-020 (peak 260 °C, 30 s) is required. The exposed drain pad must be connected to ≥10 cm² internal or external copper pour for thermal compliance and mechanical reliability.

What is the gate threshold voltage range and its variation over temperature?

VGS(th) is 2–4 V at Tj = 25 °C, with typical value 3 V. As shown in Figure 10, it decreases linearly to ~2.4 V at Tj = 150 °C, ensuring stable turn-on behavior across full operating junction temperature range without risk of thermal runaway.

STL13NM60N Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ II
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
10A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
385mOhm @ 5A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
30 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
790 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
3W (Ta), 90W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerFlat™ (8x8) HV

STL13NM60N FAQ

1.How can I place an order for STL13NM60N through Aetrix?

Please submit a Request for Quotation (RFQ) for STL13NM60N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STL13NM60N reliable?

The price and inventory of STL13NM60N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STL13NM60N is usually 5 days.

3.What payment methods are accepted for STL13NM60N?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STL13NM60N transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STL13NM60N?

STL13NM60N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STL13NM60N order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STL13NM60N?

For technical support, including STL13NM60N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STL13NM60N requirements.

6.How does Aetrix verify that STL13NM60N is sourced from the original manufacturer or authorized distributors?

All STL13NM60N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STL13NM60N meets industry standards.

7.What is the process for return or replacement of STL13NM60N?

All STL13NM60N units undergo pre-shipment inspection (PSI). If there is an issue with STL13NM60N, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STL13NM60N part is unused and in its original packaging.

Return procedure for STL13NM60N:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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