STMicroelectronics STL140N4F7AG

Overview

STL140N4F7AG from STMicroelectronics is an automotive-grade N-channel Power MOSFET with 40 V V_DS, 2.1 mΩ typ. R_DS(on) at V_GS = 10 V, 120 A continuous drain current, and AEC-Q101 qualification-designed for high-efficiency DC-DC converters and motor control in engine management systems.

For engineers reviewing the STL140N4F7AG datasheet, STL140N4F7AG pinout, STL140N4F7AG application, or STL140N4F7AG equivalent, key selection criteria include low R_DS(on) for conduction loss reduction, Crss/Ciss ratio for EMI robustness, avalanche energy rating (260 mJ), and wettable flank PowerFLAT™ 5x6 package for automated optical inspection.

Technical Context

This device uses STripFET™ F7 trench-gate technology to achieve ultra-low on-resistance while minimizing gate charge (Q_g = 29 nC) and reverse transfer capacitance (Crss = 43 pF). Its enhanced internal structure supports fast switching (t_d(on) = 14 ns, t_f = 5.7 ns) with reduced Miller effect and improved safe operating area under repetitive avalanche stress.

The PowerFLAT™ 5x6 WF-type C package delivers R_thj-case = 1.35 °C/W and R_thj-pcb = 31.3 °C/W (FR-4, 1 in², 2 oz Cu), enabling high-power density thermal management without a heatsink in many automotive PCB layouts.

Key Specifications

Pinout & Package

STL140N4F7AG is housed in a PowerFLAT™ 5x6 WF-type C surface-mount package with exposed drain pad (D) and wettable flanks for solder joint inspection. The package measures 5.0–5.4 mm × 6.2–6.6 mm × 0.8–1.0 mm and features a single-source-drain-terminal configuration optimized for high-current PCB routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 40 V power MOSFET applications.

Compared with BSC014N04LS6 and NTMFS4C09NT1G, STL140N4F7AG uniquely balances ultra-low R_DS(on), AEC-Q101 compliance, wettable flank inspection, and EMI-optimized Crss/Ciss-making it optimal for safety-critical automotive power stages where reliability and manufacturability are co-prioritized.

Availability

STL140N4F7AG is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and on-board chargers requiring stable component supply across automotive production lifecycles.

Supply support for STL140N4F7AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

This device belongs to ST's STripFET™ F7 automotive power MOSFET product line, engineered specifically for high-current, high-reliability switching in engine management, ADAS, and electrification subsystems.

FAQ

What is the maximum continuous drain current for STL140N4F7AG at 100 °C case temperature?

The datasheet specifies I_D(cont) = 120 A at both T_C = 25 °C and T_C = 100 °C. This reflects package-limited current handling-not silicon-limited-due to thermal design of the PowerFLAT™ 5x6 housing, which maintains consistent current derating across that range.

Does STL140N4F7AG support paralleling for higher current applications?

Yes-its positive temperature coefficient of R_DS(on) (confirmed in Figure 10) enables stable current sharing when multiple devices are paralleled. Layout must ensure matched gate drive paths and symmetric source connections to avoid imbalance; recommended for >200 A designs with thermal monitoring.

Is the body diode suitable for synchronous rectification in DC-DC converters?

The source-drain diode has V_SD = 1.2 V at 32 A and t_rr = 55 ns, making it usable for freewheeling in non-synchronous topologies. However, its Q_rr = 67 nC and I_RRM = 2.4 A limit efficiency in high-frequency synchronous rectification-external Schottky or GaN-based solutions are preferred for >200 kHz operation.

What PCB layout recommendations apply to the PowerFLAT™ 5x6 wettable flank package?

Use the recommended footprint in Figure 20: 4.8–5.1 mm × 4.0–4.35 mm solder mask opening for the drain pad, with ≥10 mm² of 2 oz copper connected via ≥6 thermal vias (0.3 mm diameter, 0.8 mm pitch). Source pads require ≥0.3 mm trace width; gate traces must be short (<5 mm) and shielded from drain noise.