STMicroelectronics STL140N4LLF5

Overview

STL140N4LLF5 from STMicroelectronics is an N-channel enhancement-mode Power MOSFET using STripFET™ F5 technology in a PowerFLAT™ 5x6 package, rated for 40 V V_DS, 2.2 mΩ typ. R_DS(on) at V_GS = 10 V and 16 A, and 32 A continuous drain current at T_pcb = 25 °C. It delivers high avalanche ruggedness (E_AS = 300 mJ) and low gate charge (Q_g = 45 nC), enabling efficient high-frequency switching in DC-DC converters and motor control stages.

For engineers reviewing the STL140N4LLF5 datasheet, STL140N4LLF5 pinout, STL140N4LLF5 application, or STL140N4LLF5 equivalent, key selection criteria include R_DS(on) at 4.5 V (2.4–3.1 mΩ), thermal resistance junction-to-PCB (31.3 °C/W on 1 in² FR-4), safe operating area limits, source-drain diode recovery (t_rr = 44 ns), and PowerFLAT™ 5x6 footprint compatibility.

Technical Context

This MOSFET employs ST's STripFET™ F5 process to minimize conduction and switching losses simultaneously. Its optimized cell layout achieves low R_DS(on) × Q_g figure-of-merit while maintaining robust unclamped inductive switching capability (IAV = 16 A, EAS = 300 mJ).

The device operates with gate threshold voltage V_GS(th) of 1 V (min), supports ±22 V gate drive, and exhibits stable R_DS(on) over temperature (normalized to 1.5× at T_j = 125 °C). Its output capacitance C_oss is 870 pF at V_DS = 25 V, enabling fast turn-off with low Miller effect.

Key Specifications

Pinout & Package

STL140N4LLF5 uses the PowerFLAT™ 5x6 type C surface-mount package with exposed drain pad (D) on bottom and three terminals: Drain (D), Source (S), Gate (G). The package has no leads; all connections are soldered to PCB pads per Figure 20 footprint (D2 = 4.15–4.45 mm, E2 = 3.50–3.70 mm).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Compared with BSC014N04LS6 and SiR626DP, STL140N4LLF5 offers the best balance of low R_DS(on), moderate Q_g, and high E_AS, making it preferred for cost-sensitive, thermally constrained motor and power supply designs requiring field-proven ruggedness.

Availability

STL140N4LLF5 is available at Aetrix Electronics and suitable for motor drive half-bridges, DC-DC synchronous rectifiers, and automotive LED drivers requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for STL140N4LLF5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.

This device belongs to ST's STripFET™ F5 Power MOSFET product line, engineered specifically for high-efficiency, high-power-density switching applications where low R_DS(on), fast switching, and avalanche reliability are jointly critical.

FAQ

What is the maximum continuous drain current at PCB temperature of 100 °C?

The STL140N4LLF5 supports 20 A continuous drain current when mounted on a standard FR-4 PCB at T_pcb = 100 °C, as specified in Table 2 under ID(2). This rating assumes a 1 in² copper area with 2 oz Cu thickness and accounts for R_thj-pcb = 31.3 °C/W. Exceeding this current requires enhanced thermal design or derating.

Can STL140N4LLF5 be used in a high-side configuration with 12 V gate drive?

Yes - its V_GS(th) minimum is 1 V and R_DS(on) remains 2.75 mΩ max at V_GS = 10 V and ID = 16 A. With 12 V gate drive, the device fully enhances well below its ±22 V absolute maximum rating, ensuring low-loss operation and immunity to noise-induced turn-on in high-side switch layouts.

Does the PowerFLAT™ 5x6 package require solder paste stencil adjustments versus standard SO-8?

Yes - the PowerFLAT™ 5x6 type C package uses a bottom-exposed drain pad requiring a dedicated stencil aperture (typically 80–90% area ratio) and two separate source pad openings. Unlike SO-8, it has no leads; insufficient paste volume on the drain pad causes voiding and thermal failure. ST recommends using the footprint in Figure 20 and verifying reflow profile for void-free solder joints.

Is the source-drain diode suitable for synchronous rectification without external control?

No - the body diode conducts only during dead time or fault conditions; synchronous rectification requires active gate control timed to the complementary switch. However, the diode's 44 ns t_rr and 57 nC Q_rr minimize losses during forced commutation, supporting robust gate-timed synchronous operation in buck and flyback topologies.