STMicroelectronics STL25N60M2-EP
- Part No.:
- STL25N60M2-EP
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
STL25N60M2-EP.pdf
- Description:
- MOSFET N-CH 600V 16A PWRFLAT HV
- Quantity:
- Payment:

- Shipping:

Inventory:2,947
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Product details
Overview
STL25N60M2-EP from STMicroelectronics is an N-channel 600 V, 16 A Power MOSFET in PowerFLAT™ 8x8 HV package, featuring 0.205 Ω max RDS(on), 29 nC total gate charge, and 7 µJ turn-off energy at 400 V/2 A. It employs MDmesh™ M2 EP technology for ultra-low switching losses and is engineered for very high-frequency DC-DC converters operating above 150 kHz.
For engineers reviewing the STL25N60M2-EP datasheet, STL25N60M2-EP pinout, STL25N60M2-EP application, or STL25N60M2-EP equivalent, key selection criteria include avalanche ruggedness (180 mJ EAS), Zener-protected gate, 50 V/ns MOSFET dv/dt ruggedness, and optimized Coss profile for soft-switching topologies.
Technical Context
This device uses a strip-based MDmesh™ M2 EP vertical structure to simultaneously reduce RDS(on) and output capacitance-Coss typ. 56 pF and Coss,eq 255 pF across 0–480 V-enabling high-efficiency operation in resonant and phase-shifted full-bridge converters.
Its gate threshold voltage (3.25–4.75 V) and low intrinsic gate resistance (7 Ω) support clean, fast switching with minimal external drive requirements; the integrated source-drain diode exhibits 360 ns reverse recovery time and 5 µC Qrr at 150 °C, enabling synchronous rectification in high-density SMPS designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Rating | 600 V - supports 400 V bus designs with 50% derating margin for transient overvoltage |
| RDS(on) max | 0.205 Ω @ 10 V VGS, 8 A - enables <1.3 W conduction loss at 16 A continuous current |
| Qg | 29 nC - reduces gate driver power demand and allows use of compact, low-cost drivers |
| Eoff | 7 µJ @ 400 V, 2 A - cuts switching loss by >40% vs. legacy 600 V MOSFETs in hard-switched PFC stages |
| Coss,eq | 255 pF - minimizes stored energy (EOSS = ½·Coss,eq·V²) for zero-voltage switching (ZVS) initiation |
| Tj max | 150 °C - supports high-power density thermal design with Rthj-case = 1 °C/W |
| Avalanche Energy | 180 mJ single-pulse - ensures robustness against unclamped inductive transients without snubbers |
Pinout & Package
STL25N60M2-EP is housed in a surface-mount PowerFLAT™ 8x8 HV package with exposed drain pad for enhanced thermal performance and low-inductance layout. The 5-pin configuration supports high-current routing while minimizing parasitic inductance in high-dI/dt applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | Main current path collector | Exposed copper pad on bottom - must be soldered to large PCB copper area for thermal and electrical return |
| Gate (G) | Control input | Low-impedance 7 Ω intrinsic resistance enables fast, stable switching with minimal ringing |
| Source (S1) | Driver reference node | Internal connection to gate driver IC ground - critical for accurate gate control loop stability |
| Source (S2) | Power return path | Dedicated high-current return - separates power and signal return paths to suppress ground bounce |
| Drain (D) | High-side switch output | Shared with main drain pad - provides low-inductance path to output capacitor in half-bridge configurations |
Key Features
| Feature | Design Value |
|---|---|
| MDmesh™ M2 EP technology | Optimized vertical cell structure delivering 0.184 Ω typ. RDS(on) with 56 pF Coss - balances conduction and switching loss trade-offs |
| Zener-protected gate | ±25 V VGS rating with integrated gate oxide protection - eliminates need for external gate clamping diodes |
| 100% avalanche tested | Each unit validated to 3.5 A repetitive avalanche current and 180 mJ single-pulse energy - guarantees ruggedness in real-world fault conditions |
| Very low turn-off switching losses | 7 µJ Eoff at 400 V/2 A - enables >95% efficiency in 200–500 kHz LLC resonant converters |
| Excellent dv/dt ruggedness | 50 V/ns MOSFET dv/dt rating - prevents false turn-on in high-speed bridge legs without complex gate resistors |
Applications
| Server VRM | Industrial SMPS |
|---|---|
Use Scenario: 48 V–12 V point-of-load conversion in AI accelerator servers requiring >90% efficiency at 300 kHz switching frequency. IC Role / Device Role / Timing Role: High-side synchronous rectifier in multiphase buck converter, driven by dedicated gate controller. Use Value: Low Qg (29 nC) and Coss,eq (255 pF) enable precise dead-time control and ZVS operation, reducing system-level thermal load by 12 W per phase. | Use Scenario: Primary-side switch in 1 kW telecom rectifier with active clamp forward topology operating at 250 kHz. IC Role / Device Role / Timing Role: Main power switch handling 16 A continuous drain current with 50 V/ns dv/dt immunity during clamp transitions. Use Value: 180 mJ EAS and 150 °C Tj rating allow reliable operation under repeated line surge events without derating. |
| EV Onboard Charger | Renewable Energy Inverter |
Use Scenario: Secondary-side synchronous rectifier in bidirectional OBC AC/DC stage, switching at 350 kHz with SiC gate driver. IC Role / Device Role / Timing Role: Fast-recovery body diode (360 ns trr) used for freewheeling during dead time in phase-shifted full-bridge. Use Value: Low Qrr (5 µC) and IRRM (28 A) minimize reverse recovery loss and EMI generation compared to standard silicon diodes. | Use Scenario: Auxiliary DC-DC supply in 10 kW solar string inverter, powering gate drivers and sensors from 400 V DC bus. IC Role / Device Role / Timing Role: Primary switch in flyback converter operating at 400 kHz with tight regulation under wide input range (200–800 V). Use Value: Stable VGS(th) (3.25–4.75 V) and low RDS(on) tempco ensure consistent startup and regulation across -40 to +125 °C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-frequency power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW20N60M2 | TO-247 package, higher RDS(on) (0.23 Ω), same MDmesh™ M2 EP die | Requires heatsink; unsuitable for ultra-thin board designs | Select when thermal budget permits discrete heatsinking and layout space exceeds 15 mm² |
| IXFH20N60P | Planar MOSFET, 0.28 Ω RDS(on), no Zener gate protection, lower dv/dt ruggedness (25 V/ns) | Lacks integrated avalanche robustness and gate protection; needs external clamping | Select only for cost-sensitive, non-safety-critical 100–150 kHz applications with controlled EMI environment |
Compared with STW20N60M2 and IXFH20N60P, STL25N60M2-EP delivers superior power density via its PowerFLAT™ 8x8 HV package, lowest Eoff (7 µJ), and guaranteed Zener gate protection-making it the preferred choice for space-constrained, high-reliability >150 kHz converters where board-level ruggedness is mandatory.
Availability
STL25N60M2-EP is available at Aetrix Electronics and suitable for server VRMs, industrial SMPS, EV onboard chargers, and renewable energy inverters requiring stable component supply and long-term production continuity.
Supply support for STL25N60M2-EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
This device belongs to ST's MDmesh™ M2 EP high-voltage MOSFET product line, developed specifically for high-frequency, high-efficiency power conversion in next-generation SMPS, PFC, and resonant topologies.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The STL25N60M2-EP supports 10 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS10759 Rev 5. This derating from the 16 A rating at 25 °C reflects thermal limitations of the PowerFLAT™ 8x8 HV package and ensures safe operation within the SOA boundary at elevated temperatures.
Does this MOSFET include integrated gate protection?
Yes, the STL25N60M2-EP features Zener-protected gate oxide, rated for ±25 V gate-source voltage. This integrated protection eliminates the need for external gate clamping diodes in typical gate driver circuits, simplifying layout and improving reliability in high-noise industrial environments.
Can this device be used in zero-voltage switching (ZVS) topologies?
Yes-the device's low Coss,eq (255 pF) and low EOSS (8 µJ at 400 V) make it well-suited for ZVS operation in LLC and phase-shifted full-bridge converters. Its fast turn-off (61 ns td(off)) and low Qgd/Qgs ratio further support precise timing control required for soft-switching transitions.
What is the thermal resistance from junction to PCB?
The junction-to-PCB thermal resistance (Rthj-pcb) is 45 °C/W when mounted on a 1-inch² FR-4 board with 2 oz copper, per Table 2 of DS10759 Rev 5. This value assumes standard thermal vias under the exposed drain pad and is critical for estimating board-level temperature rise in compact layouts.
STL25N60M2-EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ M2-EP
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 205mOhm @ 8A, 10V
- Vgs(th) (Max) @ Id:
- 4.75V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 29 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1090 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 125W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerFlat™ (8x8) HV
STL25N60M2-EP FAQ
1.How can I place an order for STL25N60M2-EP through Aetrix?
Please submit a Request for Quotation (RFQ) for STL25N60M2-EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STL25N60M2-EP reliable?
The price and inventory of STL25N60M2-EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STL25N60M2-EP is usually 5 days.
3.What payment methods are accepted for STL25N60M2-EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STL25N60M2-EP transactions.
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4.How is shipping managed for STL25N60M2-EP?
STL25N60M2-EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STL25N60M2-EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STL25N60M2-EP?
For technical support, including STL25N60M2-EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STL25N60M2-EP requirements.
6.How does Aetrix verify that STL25N60M2-EP is sourced from the original manufacturer or authorized distributors?
All STL25N60M2-EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STL25N60M2-EP meets industry standards.
7.What is the process for return or replacement of STL25N60M2-EP?
All STL25N60M2-EP units undergo pre-shipment inspection (PSI). If there is an issue with STL25N60M2-EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STL25N60M2-EP part is unused and in its original packaging.
Return procedure for STL25N60M2-EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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