Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics STL25N60M2-EP

Part No.:
STL25N60M2-EP
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixSTL25N60M2-EP.pdf
Description:
MOSFET N-CH 600V 16A PWRFLAT HV
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,947

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

STL25N60M2-EP from STMicroelectronics is an N-channel 600 V, 16 A Power MOSFET in PowerFLAT™ 8x8 HV package, featuring 0.205 Ω max RDS(on), 29 nC total gate charge, and 7 µJ turn-off energy at 400 V/2 A. It employs MDmesh™ M2 EP technology for ultra-low switching losses and is engineered for very high-frequency DC-DC converters operating above 150 kHz.

For engineers reviewing the STL25N60M2-EP datasheet, STL25N60M2-EP pinout, STL25N60M2-EP application, or STL25N60M2-EP equivalent, key selection criteria include avalanche ruggedness (180 mJ EAS), Zener-protected gate, 50 V/ns MOSFET dv/dt ruggedness, and optimized Coss profile for soft-switching topologies.

Technical Context

This device uses a strip-based MDmesh™ M2 EP vertical structure to simultaneously reduce RDS(on) and output capacitance-Coss typ. 56 pF and Coss,eq 255 pF across 0–480 V-enabling high-efficiency operation in resonant and phase-shifted full-bridge converters.

Its gate threshold voltage (3.25–4.75 V) and low intrinsic gate resistance (7 Ω) support clean, fast switching with minimal external drive requirements; the integrated source-drain diode exhibits 360 ns reverse recovery time and 5 µC Qrr at 150 °C, enabling synchronous rectification in high-density SMPS designs.

Key Specifications

ParameterValue and Actual Design Meaning
VDS Rating600 V - supports 400 V bus designs with 50% derating margin for transient overvoltage
RDS(on) max0.205 Ω @ 10 V VGS, 8 A - enables <1.3 W conduction loss at 16 A continuous current
Qg29 nC - reduces gate driver power demand and allows use of compact, low-cost drivers
Eoff7 µJ @ 400 V, 2 A - cuts switching loss by >40% vs. legacy 600 V MOSFETs in hard-switched PFC stages
Coss,eq255 pF - minimizes stored energy (EOSS = ½·Coss,eq·V²) for zero-voltage switching (ZVS) initiation
Tj max150 °C - supports high-power density thermal design with Rthj-case = 1 °C/W
Avalanche Energy180 mJ single-pulse - ensures robustness against unclamped inductive transients without snubbers

Pinout & Package

STL25N60M2-EP is housed in a surface-mount PowerFLAT™ 8x8 HV package with exposed drain pad for enhanced thermal performance and low-inductance layout. The 5-pin configuration supports high-current routing while minimizing parasitic inductance in high-dI/dt applications.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)Main current path collectorExposed copper pad on bottom - must be soldered to large PCB copper area for thermal and electrical return
Gate (G)Control inputLow-impedance 7 Ω intrinsic resistance enables fast, stable switching with minimal ringing
Source (S1)Driver reference nodeInternal connection to gate driver IC ground - critical for accurate gate control loop stability
Source (S2)Power return pathDedicated high-current return - separates power and signal return paths to suppress ground bounce
Drain (D)High-side switch outputShared with main drain pad - provides low-inductance path to output capacitor in half-bridge configurations

Key Features

FeatureDesign Value
MDmesh™ M2 EP technologyOptimized vertical cell structure delivering 0.184 Ω typ. RDS(on) with 56 pF Coss - balances conduction and switching loss trade-offs
Zener-protected gate±25 V VGS rating with integrated gate oxide protection - eliminates need for external gate clamping diodes
100% avalanche testedEach unit validated to 3.5 A repetitive avalanche current and 180 mJ single-pulse energy - guarantees ruggedness in real-world fault conditions
Very low turn-off switching losses7 µJ Eoff at 400 V/2 A - enables >95% efficiency in 200–500 kHz LLC resonant converters
Excellent dv/dt ruggedness50 V/ns MOSFET dv/dt rating - prevents false turn-on in high-speed bridge legs without complex gate resistors

Applications

Server VRMIndustrial SMPS

Use Scenario: 48 V–12 V point-of-load conversion in AI accelerator servers requiring >90% efficiency at 300 kHz switching frequency.

IC Role / Device Role / Timing Role: High-side synchronous rectifier in multiphase buck converter, driven by dedicated gate controller.

Use Value: Low Qg (29 nC) and Coss,eq (255 pF) enable precise dead-time control and ZVS operation, reducing system-level thermal load by 12 W per phase.

Use Scenario: Primary-side switch in 1 kW telecom rectifier with active clamp forward topology operating at 250 kHz.

IC Role / Device Role / Timing Role: Main power switch handling 16 A continuous drain current with 50 V/ns dv/dt immunity during clamp transitions.

Use Value: 180 mJ EAS and 150 °C Tj rating allow reliable operation under repeated line surge events without derating.

EV Onboard ChargerRenewable Energy Inverter

Use Scenario: Secondary-side synchronous rectifier in bidirectional OBC AC/DC stage, switching at 350 kHz with SiC gate driver.

IC Role / Device Role / Timing Role: Fast-recovery body diode (360 ns trr) used for freewheeling during dead time in phase-shifted full-bridge.

Use Value: Low Qrr (5 µC) and IRRM (28 A) minimize reverse recovery loss and EMI generation compared to standard silicon diodes.

Use Scenario: Auxiliary DC-DC supply in 10 kW solar string inverter, powering gate drivers and sensors from 400 V DC bus.

IC Role / Device Role / Timing Role: Primary switch in flyback converter operating at 400 kHz with tight regulation under wide input range (200–800 V).

Use Value: Stable VGS(th) (3.25–4.75 V) and low RDS(on) tempco ensure consistent startup and regulation across -40 to +125 °C ambient.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-frequency power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STW20N60M2TO-247 package, higher RDS(on) (0.23 Ω), same MDmesh™ M2 EP dieRequires heatsink; unsuitable for ultra-thin board designsSelect when thermal budget permits discrete heatsinking and layout space exceeds 15 mm²
IXFH20N60PPlanar MOSFET, 0.28 Ω RDS(on), no Zener gate protection, lower dv/dt ruggedness (25 V/ns)Lacks integrated avalanche robustness and gate protection; needs external clampingSelect only for cost-sensitive, non-safety-critical 100–150 kHz applications with controlled EMI environment

Compared with STW20N60M2 and IXFH20N60P, STL25N60M2-EP delivers superior power density via its PowerFLAT™ 8x8 HV package, lowest Eoff (7 µJ), and guaranteed Zener gate protection-making it the preferred choice for space-constrained, high-reliability >150 kHz converters where board-level ruggedness is mandatory.

Availability

STL25N60M2-EP is available at Aetrix Electronics and suitable for server VRMs, industrial SMPS, EV onboard chargers, and renewable energy inverters requiring stable component supply and long-term production continuity.

Supply support for STL25N60M2-EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

This device belongs to ST's MDmesh™ M2 EP high-voltage MOSFET product line, developed specifically for high-frequency, high-efficiency power conversion in next-generation SMPS, PFC, and resonant topologies.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STL25N60M2-EP supports 10 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS10759 Rev 5. This derating from the 16 A rating at 25 °C reflects thermal limitations of the PowerFLAT™ 8x8 HV package and ensures safe operation within the SOA boundary at elevated temperatures.

Does this MOSFET include integrated gate protection?

Yes, the STL25N60M2-EP features Zener-protected gate oxide, rated for ±25 V gate-source voltage. This integrated protection eliminates the need for external gate clamping diodes in typical gate driver circuits, simplifying layout and improving reliability in high-noise industrial environments.

Can this device be used in zero-voltage switching (ZVS) topologies?

Yes-the device's low Coss,eq (255 pF) and low EOSS (8 µJ at 400 V) make it well-suited for ZVS operation in LLC and phase-shifted full-bridge converters. Its fast turn-off (61 ns td(off)) and low Qgd/Qgs ratio further support precise timing control required for soft-switching transitions.

What is the thermal resistance from junction to PCB?

The junction-to-PCB thermal resistance (Rthj-pcb) is 45 °C/W when mounted on a 1-inch² FR-4 board with 2 oz copper, per Table 2 of DS10759 Rev 5. This value assumes standard thermal vias under the exposed drain pad and is critical for estimating board-level temperature rise in compact layouts.

STL25N60M2-EP Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ M2-EP
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
16A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
205mOhm @ 8A, 10V
Vgs(th) (Max) @ Id:
4.75V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
29 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
1090 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
125W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerFlat™ (8x8) HV

STL25N60M2-EP FAQ

1.How can I place an order for STL25N60M2-EP through Aetrix?

Please submit a Request for Quotation (RFQ) for STL25N60M2-EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STL25N60M2-EP reliable?

The price and inventory of STL25N60M2-EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STL25N60M2-EP is usually 5 days.

3.What payment methods are accepted for STL25N60M2-EP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STL25N60M2-EP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STL25N60M2-EP?

STL25N60M2-EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STL25N60M2-EP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STL25N60M2-EP?

For technical support, including STL25N60M2-EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STL25N60M2-EP requirements.

6.How does Aetrix verify that STL25N60M2-EP is sourced from the original manufacturer or authorized distributors?

All STL25N60M2-EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STL25N60M2-EP meets industry standards.

7.What is the process for return or replacement of STL25N60M2-EP?

All STL25N60M2-EP units undergo pre-shipment inspection (PSI). If there is an issue with STL25N60M2-EP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STL25N60M2-EP part is unused and in its original packaging.

Return procedure for STL25N60M2-EP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STL25N60M2-EP Tags

  • STL25N60M2-EP
  • STL25N60M2-EP PDF
  • STL25N60M2-EP Datasheet
  • STL25N60M2-EP Specifications
  • STL25N60M2-EP Images
  • STMicroelectronics
  • STMicroelectronics STL25N60M2-EP
  • Buy STL25N60M2-EP
  • STL25N60M2-EP Price
  • STL25N60M2-EP Distributor
  • STL25N60M2-EP Supplier
  • STL25N60M2-EP Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER