STMicroelectronics STL33N60M6
- Part No.:
- STL33N60M6
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
STL33N60M6.pdf
- Description:
- MOSFET 600V 21A POWERFLAT HV
- Quantity:
- Payment:

- Shipping:

Inventory:5,866
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Product details
Overview
STL33N60M6 from STMicroelectronics is an N-channel 600 V, 21 A MDmesh™ M6 superjunction power MOSFET in PowerFLAT™ 8x8 HV package, featuring 137 mΩ max RDS(on), 100% avalanche tested, and Zener-protected gate. It delivers low switching losses and high dv/dt ruggedness (50 V/ns) for high-efficiency LLC and boost PFC converters.
For engineers reviewing the STL33N60M6 datasheet, STL33N60M6 pinout, STL33N60M6 application, or STL33N60M6 equivalent, key selection criteria include its 0.115 Ω typ. RDS(on) at 10 V, 33.4 nC total gate charge, 150 W Tcase=25 °C power dissipation, and robust 500 mJ single-pulse avalanche energy rating.
Technical Context
This MOSFET employs ST's MDmesh™ M6 silicon technology, optimized for high-voltage switching with reduced RDS(on) per die area and improved dynamic performance. Its 1515 pF input capacitance (Ciss) and 4.2 pF reverse transfer capacitance (Crss) enable fast, controlled turn-on/turn-off with minimal Miller effect.
The device integrates a Zener-protected gate structure and is fully rated for unclamped inductive switching (UIS), supporting reliable operation under hard-switching conditions. Its 0.83 °C/W junction-to-case thermal resistance and PowerFLAT™ 8x8 HV package ensure efficient heat transfer to PCB copper planes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - supports primary-side switching in 400 V DC bus systems with 20% margin |
| RDS(on) max | 137 mΩ - enables low conduction loss at 21 A continuous drain current |
| ID (Tcase=25 °C) | 21 A - defines maximum continuous current under ideal heatsinking |
| Qg | 33.4 nC - determines gate drive power requirement and switching speed control |
| EAS | 500 mJ - ensures survivability during single-pulse inductive fault events |
| dv/dt ruggedness | 50 V/ns - guarantees immunity to parasitic turn-on in high-dV/dt topologies like LLC resonant converters |
| Rthj-case | 0.83 °C/W - allows direct thermal coupling to heatsink or copper pour without external thermal interface material |
Pinout & Package
STL33N60M6 uses the PowerFLAT™ 8x8 HV surface-mount package (8 mm × 8 mm × 0.85 mm height), optimized for high-power density and enhanced thermal performance via bottom-side exposed drain pad. The package features a single large thermal pad and five terminals arranged in a compact layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (5) | Main high-side power terminal | Connected to internal die drain; electrically and thermally tied to exposed copper pad for low-inductance, low-resistance path to ground plane |
| Gate (1) | Control input | Zener-protected MOS gate requiring ≤±25 V drive; low 1.5 Ω intrinsic gate resistance minimizes ringing |
| Driver source (2) | Source reference for gate driver IC | Provides local return path for gate driver supply, reducing common-source inductance and improving switching stability |
| Power source (3, 4) | Main current return path | Dual-source terminals reduce source inductance and improve current sharing in high-di/dt applications |
Key Features
| Feature | Design Value |
|---|---|
| MDmesh™ M6 silicon technology | Delivers 13% lower RDS(on) per area vs prior MDmesh™ M5 generation, directly reducing conduction loss in space-constrained designs |
| 100% avalanche tested | Each unit validated for UIS capability up to 500 mJ, eliminating need for external snubbers in flyback or LLC transient conditions |
| Zener-protected gate | Integrated gate oxide protection clamps transients to ±25 V, enabling robust gate drive without external TVS diodes |
| Low Crss (4.2 pF) | Minimizes Miller feedback during switching, allowing faster turn-off and reduced gate drive power consumption |
| PowerFLAT™ 8x8 HV thermal design | 0.83 °C/W Rthj-case enables >130 W continuous power handling on 2 oz Cu FR-4 with 1 in² thermal pad |
Applications
| LLC Resonant Converter Primary Switch | Boost PFC Front-End Stage |
|---|---|
Use Scenario: High-frequency (100–500 kHz) primary-side switching in server PSU and telecom rectifiers with zero-voltage switching (ZVS). IC Role / Device Role / Timing Role: Main high-side switching element operating in resonant mode; handles 21 A peak current with <265 ns diode recovery time. Use Value: Low Coss (128 pF) and 50 V/ns dv/dt ruggedness prevent spurious turn-on during ZVS transitions, improving efficiency by ≥0.8% at full load. | Use Scenario: Continuous conduction mode (CCM) boost converter in industrial AC-DC supplies delivering >1 kW output. IC Role / Device Role / Timing Role: Fast-switching power switch controlling inductor current; operates at 65–100 kHz with 78 A pulsed drain current capability. Use Value: 33.4 nC Qg and 1515 pF Ciss allow clean gate drive with standard 2 A peak drivers, reducing gate loop EMI and layout complexity. |
| Industrial Motor Drive Inverter Leg | High-Voltage DC-DC Isolated Converter |
Use Scenario: Half-bridge leg in 400 V bus motor drives for HVAC compressors and pumps, subject to repetitive inductive switching stress. IC Role / Device Role / Timing Role: Upper-leg switching device with integrated body diode; rated for 21 A continuous and 78 A pulsed current. Use Value: 500 mJ EAS and 100% UIS testing eliminate risk of failure during short-circuit or overload events, extending field reliability. | Use Scenario: Primary-side switch in 1–3 kW isolated DC-DC converters for EV charging infrastructure and renewable energy inverters. IC Role / Device Role / Timing Role: High-side MOSFET in phase-shifted full-bridge topology; withstands 480 V VDS during dead-time and recovers from 374 ns trr at 150 °C. Use Value: 1.6 V VSD forward voltage and 5.78 µC Qrr at 150 °C minimize body diode conduction loss during synchronous rectification gaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPP60R190C7XKSA1 | 650 V, 190 mΩ max RDS(on), TO-220FP package, higher Rthj-case (1.2 °C/W) | Larger footprint, lower power density, requires mechanical heatsink | Select when legacy through-hole assembly or higher single-pulse avalanche energy (620 mJ) is prioritized over board space |
| STW33N60M6 | Identical silicon, TO-247 package, 0.45 °C/W Rthj-case, no driver source pin | Higher thermal performance but larger footprint; lacks dual-source configuration for low-inductance gate drive | Select when maximum continuous power (>200 W) and forced-air cooling are available, and gate loop inductance is less critical |
Compared with IPP60R190C7XKSA1 and STW33N60M6, STL33N60M6 offers superior power density and gate drive stability due to its PowerFLAT™ 8x8 HV package with dedicated driver source pin and 0.83 °C/W thermal resistance-critical for fanless, compact PFC and LLC modules.
Availability
STL33N60M6 is available at Aetrix Electronics and suitable for LLC resonant converters, boost PFC front-end stages, and industrial motor drive inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for STL33N60M6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The MDmesh™ M6 product line targets high-efficiency, high-density AC-DC and DC-DC conversion, specifically engineered to reduce conduction and switching losses in 600–650 V superjunction applications.
FAQ
What is the maximum recommended gate drive voltage for STL33N60M6?
The absolute maximum gate-source voltage is ±25 V per datasheet Table 1. ST recommends operating within 10 V to 15 V for optimal RDS(on) and safe margin against gate oxide stress. Driving above 15 V provides diminishing RDS(on) improvement while increasing risk of gate leakage or long-term degradation.
Does STL33N60M6 require external gate resistors for stable switching?
Yes-external gate resistors are required to control dV/dt and suppress oscillation. Typical values range from 4.7 Ω to 15 Ω depending on drive strength and layout inductance. The 1.5 Ω intrinsic gate resistance (Table 5) is insufficient alone; external resistance ensures predictable turn-on/turn-off timing and prevents shoot-through in bridge configurations.
Can STL33N60M6 replace older MDmesh™ M2 or M5 devices in existing designs?
Direct replacement is possible only with layout and thermal review. While pin-compatible in PowerFLAT™ 8x8 HV, STL33N60M6 has lower RDS(on) and higher Qg than M2/M5 variants, which may alter gate drive requirements and thermal distribution. Verify SOA margins and gate drive capability before drop-in substitution.
Is the body diode in STL33N60M6 suitable for synchronous rectification?
No-the integrated body diode is not optimized for synchronous rectification. Its 265 ns trr (at 25 °C) and 3.07 µC Qrr result in significant reverse recovery loss. For synchronous operation, use a discrete Schottky or SiC diode in parallel, or select a dedicated synchronous rectifier MOSFET with optimized diode characteristics.
STL33N60M6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ M6
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- -
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 21A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 137mOhm @ 10.5A, 10V
- Vgs(th) (Max) @ Id:
- 4.75V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 33.4 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1515 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 150W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerFlat™ (8x8) HV
STL33N60M6 FAQ
1.How can I place an order for STL33N60M6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STL33N60M6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STL33N60M6 reliable?
The price and inventory of STL33N60M6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STL33N60M6 is usually 5 days.
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STL33N60M6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STL33N60M6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STL33N60M6?
For technical support, including STL33N60M6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STL33N60M6 requirements.
6.How does Aetrix verify that STL33N60M6 is sourced from the original manufacturer or authorized distributors?
All STL33N60M6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STL33N60M6 meets industry standards.
7.What is the process for return or replacement of STL33N60M6?
All STL33N60M6 units undergo pre-shipment inspection (PSI). If there is an issue with STL33N60M6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STL33N60M6 part is unused and in its original packaging.
Return procedure for STL33N60M6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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