STMicroelectronics STL60N10F7
- Part No.:
- STL60N10F7
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
STL60N10F7.pdf
- Description:
- MOSFET N-CH 100V 46A POWERFLAT
- Quantity:
- Payment:

- Shipping:

Inventory:14,477
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Product details
Overview
STL60N10F7 from STMicroelectronics is an N-channel Power MOSFET in PowerFLAT 5x6 package, designed for high-efficiency switching in DC-DC converters and motor drives. It delivers 100 V VDS, 14.5 mΩ typ. RDS(on) at VGS = 10 V, 12 A continuous current at PCB level, 5 W power dissipation, and features low Crss/Ciss ratio for EMI immunity.
For engineers reviewing the STL60N10F7 datasheet, STL60N10F7 pinout, STL60N10F7 application, or STL60N10F7 equivalent, key selection criteria include its 100 V rating, 14.5 mΩ on-resistance, 25 nC total gate charge, avalanche ruggedness, and thermal performance on FR-4 PCBs.
Technical Context
This device employs ST's STripFET F7 DeepGATE trench-gate technology to minimize RDS(on) while reducing Ciss (1640 pF typ.) and Qg (25 nC typ.), enabling fast switching with low conduction and switching losses. Its low Crss/Ciss ratio (25/1640 ≈ 0.015) suppresses Miller-induced turn-on risk under high dv/dt conditions.
The MOSFET supports unclamped inductive switching with guaranteed avalanche energy rating, operates up to 175 °C junction temperature, and is characterized for both case-mounted (Rthj-case = 2.08 °C/W) and PCB-mounted (Rthj-pcb = 31 °C/W) thermal configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Supports 48 V bus systems with 2× safety margin against transients. |
| RDS(on) max | 18 mΩ - Ensures ≤2.6 W conduction loss at 12 A, critical for thermally constrained PCB layouts. |
| ID (Tpcb = 25 °C) | 12 A - Rated for sustained current delivery on standard 1-inch² FR-4 board with 2 oz Cu. |
| Qg | 25 nC - Enables efficient gate driving with moderate-current drivers (e.g., 1–2 A peak). |
| Crss/Ciss | 25/1640 pF - Low ratio improves noise immunity and reduces false triggering in noisy environments. |
| TJ max | 175 °C - Allows operation in automotive under-hood or industrial ambient temperatures up to 125 °C. |
| EAS | Guaranteed avalanche ruggedness - Eliminates need for external snubbers in inductive load switching. |
Pinout & Package
STL60N10F7 uses the surface-mount PowerFLAT 5x6 package (type R), optimized for high-power density and thermal transfer to PCB copper. The exposed drain pad occupies pins 5–8 and serves as primary heat path; gate is pin 4; source connects to pins 1–3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D (5, 6, 7, 8) | Drain | Exposed metal pad - electrically and thermally connected to drain; must be soldered to large PCB copper pour for thermal management. |
| G (4) | Gate | Control terminal - requires low-impedance drive due to 25 nC Qg; sensitive to ESD (±20 V absolute max). |
| S (1, 2, 3) | Source | Reference node for gate drive and current sensing; tied to PCB ground plane for low-inductance return path. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 14.5 mΩ typ. at VGS = 10 V - Reduces I²R losses by >30% vs. legacy F6 devices in same package. |
| Low Crss/Ciss ratio | 25/1640 pF - Minimizes Miller feedback, enabling robust operation in hard-switching topologies without gate clamping. |
| High avalanche energy rating | Guaranteed unclamped inductive switching - Supports reliable operation in relay drivers and solenoid controls without external protection. |
| Optimized for PCB thermal dissipation | Rthj-pcb = 31 °C/W on 1-inch² FR-4 - Enables 5 W continuous power handling without heatsink in space-constrained designs. |
| Enhanced trench gate structure | STripFET F7 DeepGATE - Improves cell density and reduces gate charge while maintaining ruggedness. |
Applications
| DC-DC Synchronous Buck Converter | Automotive Body Control Module (BCM) |
|---|---|
|
Use Scenario: High-efficiency 12 V → 3.3 V/5 V conversion for infotainment and ADAS ECUs. IC Role / Device Role: High-side synchronous rectifier switch in buck regulator stage. Use Value: 14.5 mΩ RDS(on) minimizes conduction loss at 10–12 A load, improving efficiency by ≥1.2% over 25 mΩ alternatives. |
Use Scenario: Load switching for interior lighting, window lifters, and HVAC actuators. IC Role / Device Role: Low-side driver for 12 V inductive and resistive loads. Use Value: Guaranteed avalanche capability eliminates need for freewheeling diodes in relay/solenoid interfaces, reducing BOM count. |
| Industrial Motor Drive Half-Bridge | Server PSU OR-ing FET |
|
Use Scenario: 24–48 V BLDC motor control in pumps and fans. IC Role / Device Role: Low-side switch in half-bridge configuration with fast 8 ns fall time. Use Value: 25 nC Qg and 17 ns rise time enable <100 kHz PWM operation with minimal gate drive loss. |
Use Scenario: Hot-swap and redundancy management in 48 V server power distribution. IC Role / Device Role: OR-ing MOSFET in ideal diode configuration. Use Value: Low 1.1 V VSD forward drop at 12 A reduces conduction loss vs. Schottky diodes, improving system efficiency by ~0.8 W per FET. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 100 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB120N10N3 G | RDS(on) = 12.5 mΩ typ., Qg = 32 nC, TO-263 package | Larger footprint and higher gate charge increase layout area and drive complexity | Preferred only when case-mounted thermal path (Rthj-case = 1.4 °C/W) is required over PCB mounting |
| IRF3205PBF | RDS(on) = 40 mΩ typ., TO-220 package, no avalanche rating | Higher conduction loss and lack of guaranteed avalanche limit use in inductive switching | Acceptable only in low-frequency, non-avalanche-critical linear or switching applications with ample heatsinking |
Compared with IPB120N10N3 G and IRF3205PBF, STL60N10F7 offers superior power density and EMI robustness via its low Crss/Ciss ratio and PowerFLAT 5x6 thermal interface-critical for compact, high-reliability PCB-mounted designs.
Availability
STL60N10F7 is available at Aetrix Electronics and suitable for DC-DC converters, automotive body control modules, and industrial motor drives requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for STL60N10F7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
STL60N10F7 belongs to the STripFET F7 family-engineered specifically for high-efficiency, high-density power conversion in space-constrained applications where PCB-level thermal management dominates over heatsink-based cooling.
FAQ
What is the maximum continuous drain current for STL60N10F7 at 100 °C PCB temperature?
The datasheet specifies ID = 9 A continuous at Tpcb = 100 °C (Table 1). This rating assumes mounting on a 1-inch² FR-4 board with 2 oz copper and accounts for Rthj-pcb = 31 °C/W. Exceeding this current risks junction temperature exceeding 175 °C under steady-state conditions.
Does STL60N10F7 have a built-in body diode, and what are its recovery characteristics?
Yes-it integrates a source-drain diode rated for 12 A continuous and 48 A pulsed. At TJ = 150 °C, it exhibits trr = 53 ns, Qrr = 67 nC, and IRRM = 2.5 A under specified test conditions (VDD = 50 V, di/dt = 100 A/µs), making it suitable for synchronous rectification and flyback recovery.
Can STL60N10F7 be driven directly from a 3.3 V microcontroller GPIO?
No-its VGS(th) ranges from 2.5 V to 4.5 V, but full enhancement requires VGS ≥ 10 V to achieve 14.5 mΩ RDS(on). A 3.3 V drive yields high on-resistance (>100 mΩ) and excessive conduction loss; a dedicated gate driver or level-shifting circuit is mandatory.
What is the recommended PCB footprint for thermal reliability?
Per Figure 20 in DS9584 Rev 4, the recommended footprint uses a 4.8 × 4.8 mm thermal pad centered under the device, connected to ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch) to inner-layer copper pours. Minimum solder mask opening matches the exposed drain pad (D5/D6 dimensions), ensuring full solder wetting for optimal Rthj-pcb.
STL60N10F7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- DeepGATE™, STripFET™ VII
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 46A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 18mOhm @ 6A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 25 nC @ 10 V
- Vgs (Max):
- 20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1640 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 5W (Ta), 72W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerFlat™ (5x6)
STL60N10F7 FAQ
1.How can I place an order for STL60N10F7 through Aetrix?
Please submit a Request for Quotation (RFQ) for STL60N10F7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STL60N10F7 reliable?
The price and inventory of STL60N10F7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STL60N10F7 is usually 5 days.
3.What payment methods are accepted for STL60N10F7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STL60N10F7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STL60N10F7?
STL60N10F7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STL60N10F7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STL60N10F7?
For technical support, including STL60N10F7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STL60N10F7 requirements.
6.How does Aetrix verify that STL60N10F7 is sourced from the original manufacturer or authorized distributors?
All STL60N10F7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STL60N10F7 meets industry standards.
7.What is the process for return or replacement of STL60N10F7?
All STL60N10F7 units undergo pre-shipment inspection (PSI). If there is an issue with STL60N10F7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STL60N10F7 part is unused and in its original packaging.
Return procedure for STL60N10F7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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