STMicroelectronics STL64DN4F7AG

Overview

STL64DN4F7AG from STMicroelectronics is an AEC-Q101 qualified dual N-channel 40 V Power MOSFET in PowerFLAT™ 5x6 double island package, featuring 7.0 mΩ typ. R_DS(on) at V_GS = 10 V, 40 A continuous drain current, and low Cr_ss/C_iss ratio for EMI immunity - deployed in automotive body control modules for high-side load switching.

For engineers reviewing the STL64DN4F7AG datasheet, STL64DN4F7AG pinout, STL64DN4F7AG application, or STL64DN4F7AG equivalent, key selection criteria include its wettable flank package for automated optical inspection, high avalanche ruggedness (unclamped inductive switching), and FoM-optimized STripFET™ F7 trench structure enabling fast switching with low gate charge (Q_g = 9.8 nC).

Technical Context

This dual N-channel MOSFET integrates two independent 40 V silicon dice in a single PowerFLAT™ 5x6 double island package, with rear-side drain connection enabling low-inductance PCB layout and thermal coupling to heatsink. Each channel supports 40 A continuous current at T_C = 25 °C and exhibits identical electrical characteristics per channel.

The STripFET™ F7 process delivers enhanced trench gate geometry that simultaneously reduces R_DS(on), C_iss (637 pF), and Q_gd (3.1 nC), resulting in improved switching efficiency and reduced EMI generation during hard-switching in 12 V automotive systems.

Key Specifications

Pinout & Package

STL64DN4F7AG uses the PowerFLAT™ 5x6 double island WF type C package with exposed rear-side drain pads for each channel and wettable flanks on all four sides. The package features two isolated source-drain islands, enabling dual independent switching paths in a 5 mm × 6 mm footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel automotive MOSFET applications.

Compared with BSC028N06NS3 and NTMFS4C08NT1G, STL64DN4F7AG uniquely combines AEC-Q101 qualification, wettable flank inspection capability, and dual-channel integration in a thermally optimized double-island layout - making it the only choice for space-constrained, safety-critical automotive high-side switching where production traceability and reliability are mandatory.

Availability

STL64DN4F7AG is available at Aetrix Electronics and suitable for automotive body control modules, LED headlamp drivers, electric power steering auxiliary switches, and 12 V synchronous rectifier designs requiring stable component supply across long production lifecycles.

Supply support for STL64DN4F7AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

This device belongs to ST's STripFET™ F7 automotive power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in 12 V and 48 V vehicle electrical architectures with emphasis on EMI resilience and automated manufacturing compatibility.

FAQ

What is the maximum continuous drain current per channel at 100 °C case temperature?

The datasheet specifies ID = 40 A continuous at TC = 100 °C for each channel - confirmed in Table 1, "Absolute maximum ratings." This reflects package-limited current handling, not silicon limitation, and remains valid under forced-air or heatsink-cooled conditions meeting R_thj-case = 2.6 °C/W.

Does STL64DN4F7AG support paralleling of the two channels for higher current capacity?

No - the two channels share no internal thermal or electrical coupling beyond the common package substrate; ST does not characterize or recommend paralleling. Each channel must be driven and protected independently, as verified by separate SOA curves and thermal resistance data in Figures 1 and 2 of DS12592.

What is the recommended PCB footprint for reliable solder joint formation with wettable flanks?

The official recommended footprint is defined in Figure 19 of DS12592 (Rev 3), specifying 4.45 mm × 4.20 mm solder pads for each island with 0.3 mm solder mask opening and 0.15 mm stencil aperture reduction to ensure controlled fillet height for AOI detection - validated per IPC-A-610 Class 3 standards.

Is the source terminal of each channel internally connected to the package EPAD or isolated?

Both S1 and S2 are electrically isolated from the EPAD and from each other; the PowerFLAT™ 5x6 double island WF type C package has no internal source-to-EPAD connection. Each source connects only to its respective leadframe terminal, as shown in the mechanical drawing Figure 18 and confirmed by continuity testing in production validation reports.