STMicroelectronics STL7N6LF3

Overview

STL7N6LF3 from STMicroelectronics is an automotive-grade N-channel 60 V Power MOSFET in PowerFLAT™ 5x6 wettable flank package, featuring 35 mΩ typ. R_DS(on) at V_GS = 10 V, 6.5 A continuous drain current (T_pcb = 25 °C), and AEC-Q101 qualification. It delivers low conduction loss and fast switching for 12 V/24 V automotive load switching, including body control modules and LED lighting drivers.

For engineers reviewing the STL7N6LF3 datasheet, STL7N6LF3 pinout, STL7N6LF3 application, or STL7N6LF3 equivalent, key selection criteria include its logic-level gate threshold (1–2.5 V), 175 °C max junction temperature, 100% avalanche rating, and wettable flank package for automated optical inspection (AOI) in high-reliability automotive PCB assembly.

Technical Context

This device uses STripFET™ F3 trench-gate technology to reduce both R_DS(on) and gate charge (Q_g = 8.7 nC typ.), enabling high-efficiency switching in DC-DC converters and motor drivers. Its dynamic parameters-C_iss = 432 pF, C_oss = 93 pF, and Q_gd = 1.9 nC-support clean turn-on/turn-off with minimal voltage overshoot under inductive loads.

The integrated source-drain diode exhibits t_rr = 24 ns and Q_rr = 23.3 nC at T_j = 150 °C, enabling robust freewheeling in half-bridge configurations. Thermal resistance R_thj-pcb = 35 °C/W (on 1 in² FR-4, 2 oz Cu) defines power derating limits for PCB-mounted thermal design.

Key Specifications

Pinout & Package

STL7N6LF3 uses the PowerFLAT™ 5x6 WF type R package-a surface-mount, wettable flank leadless package with exposed drain pad for thermal and electrical performance. The package measures 5.0–5.4 mm × 6.2–6.6 mm × 0.8–1.0 mm and features a single-row 5-pin configuration (3 drain pins, 1 source, 1 gate).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 60 V automotive power MOSFET applications.

Compared with BSC014N06LS3 and NTMFS4C06NT1G, STL7N6LF3 uniquely combines AEC-Q101 qualification, wettable flank package, 175 °C rating, and verified 190 mJ avalanche capability-making it the preferred choice for safety-critical, thermally constrained, and high-yield automotive production.

Availability

STL7N6LF3 is available at Aetrix Electronics and suitable for automotive body electronics, LED lighting systems, and start-stop power management requiring stable component supply across multi-year vehicle production cycles.

Supply support for STL7N6LF3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.

This device belongs to ST's STripFET™ F3 automotive power MOSFET product line, engineered specifically for high-reliability 12 V/24 V vehicle subsystems demanding low R_DS(on), robust avalanche performance, and AEC-Q101 compliance.

FAQ

Is STL7N6LF3 suitable for high-side switching without a dedicated gate driver?

No. As an N-channel MOSFET, STL7N6LF3 requires gate voltage ≥10 V relative to source to achieve specified R_DS(on). In high-side configuration, this necessitates a floating gate driver or charge pump. Its logic-level V_GS(th) enables direct MCU control only in low-side topology.

What is the maximum allowable PCB copper area for thermal performance at 6.5 A continuous current?

For rated I_D = 6.5 A at T_pcb = 25 °C, ST specifies R_thj-pcb = 35 °C/W on 1 in² (645 mm²) of 2 oz copper. Reducing copper area increases thermal resistance proportionally; halving area raises R_thj-pcb to ~50 °C/W, limiting safe continuous current to ~4.6 A.

Does the wettable flank feature require special stencil or reflow profile adjustments?

No. The wettable flank geometry is compatible with standard Type 3 solder paste, standard 0.15 mm laser-cut stencils, and industry-standard reflow profiles (peak 245–255 °C). Its primary benefit is AOI compatibility-not process deviation-so no process changes are needed beyond standard PowerFLAT™ 5x6 assembly practices.

How does the 100% avalanche rating impact system-level reliability testing?

The 100% avalanche rating means every unit undergoes individual E_AS screening at 190 mJ (T_j = 25 °C, I_D = 8 A, V_DD = 25 V). This eliminates statistical failure modes in unclamped inductive switching events-critical for validating robustness in relay coil snubbing, solenoid driving, and motor phase commutation without additional system-level surge testing.