My Inquiry
My Account
STMicroelectronics STL8NH3LL
- Part No.:
- STL8NH3LL
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
STL8NH3LL.pdf
- Description:
- MOSFET N-CH 30V 8A POWERFLAT
- Quantity:
- Payment:
- Shipping:
Inventory:55
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STL8NH3LL from STMicroelectronics is an N-channel Power MOSFET optimized for high-efficiency switching in space-constrained DC-DC converters and load switches, featuring 30 V VDS, 0.012 Ω RDS(on) at VGS = 10 V, 8 A continuous drain current at TC = 25 °C, ultra-low 9 nC total gate charge, and PowerFLAT™ (3.3 × 3.3 mm) chip-scale packaging.
For engineers reviewing the STL8NH3LL datasheet, STL8NH3LL pinout, STL8NH3LL application, or STL8NH3LL equivalent, key selection criteria include low RDS(on) at 4.5 V drive, thermal resistance of 2.5 °C/W junction-to-case, fast 15 ns rise time, and compatibility with compact PCB layouts requiring minimal copper area and low-profile mounting.
Technical Context
This device implements ST's STripFET™ III process in a thermally enhanced PowerFLAT™ package, enabling high current density with minimal conduction and switching losses. Its low 1.0 mm max height and 42.8 °C/W junction-to-PCB thermal resistance (1 in² FR-4, 2 oz Cu) support passive cooling in dense power stages.
The MOSFET features a low 1–2.5 V gate threshold voltage, allowing robust turn-on with 3.3 V or 5 V logic-level drivers, and includes an integrated source-drain diode with 24 ns reverse recovery time and 17.4 nC Qrr for synchronous rectification or flyback operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - supports 24 V nominal input rails with 25 % margin against transients |
| RDS(on) | 0.012 Ω @ VGS = 10 V - delivers ≤ 0.38 W conduction loss at 8 A |
| Qg | 9 nC - enables efficient 1–2 MHz switching with low driver power dissipation |
| ID (cont.) | 8 A @ TC = 25 °C - rated for sustained load switching in thermally managed PCBs |
| Rthj-case | 2.5 °C/W - allows direct heatsinking to copper pour or metal-core board |
| tr | 15 ns - minimizes overlap loss in synchronous buck topologies |
| VGS(th) | 1–2.5 V - ensures reliable enhancement-mode turn-on with standard logic drivers |
Pinout & Package
STL8NH3LL uses the PowerFLAT™ (3.3 × 3.3 mm) package - a 5-terminal, exposed-drain chip-scale package with 1.0 mm maximum profile and solderable bottom thermal pad. The package is RoHS-compliant and ECOPACK®-qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | Main current path output terminal | Exposed copper pad on bottom surface - must be soldered to large PCB copper area for thermal and electrical conduction |
| Source (S1, S2) | Power return path | Two separate source pins on left side - reduce parasitic inductance and improve current sharing in high-di/dt applications |
| Gate (G) | Control input | Single top-side pin - requires low-inductance layout to preserve fast switching performance |
| Source (S3) | Additional source connection | Third source pin on right side - enhances Kelvin sensing capability and reduces gate-source loop inductance |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low gate charge | 9 nC total gate charge enables efficient high-frequency PWM control with minimal driver stress |
| Chip-scale PowerFLAT™ package | 3.3 × 3.3 mm footprint saves >60 % board area vs. SO-8 while maintaining 50 W power handling |
| Low RDS(on) at 4.5 V | 0.0135 Ω @ VGS = 4.5 V - supports direct interface with 3.3 V microcontrollers without level-shifting |
| Enhanced thermal performance | 2.5 °C/W junction-to-case resistance allows >75 % higher power density than comparable DFN packages |
| Integrated source-drain diode | 24 ns trr, 17.4 nC Qrr - suitable for synchronous rectification in buck and flyback converters |
Applications
| DC-DC Buck Converter | USB-C Load Switch |
|---|---|
Use Scenario: High-efficiency 12 V to 3.3 V step-down conversion in portable industrial controllers. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET operating at 500 kHz–1 MHz with 4.5 V gate drive. Use Value: 0.0135 Ω RDS(on) at 4.5 V reduces conduction loss by 35 % versus legacy 0.022 Ω alternatives, improving full-load efficiency to >94 %. | Use Scenario: Inrush-current-limited hot-swap switching for USB-C PD power delivery paths. IC Role / Device Role / Timing Role: Single-N-channel load switch controlling 5–20 V input to downstream USB-C port circuitry. Use Value: 1.0 mm profile and 3.3 × 3.3 mm footprint enable placement directly behind USB-C connector, minimizing trace inductance and EMI. |
| Automotive Body Control Module | Smart LED Driver |
Use Scenario: 12 V battery-fed lamp and solenoid driver in non-safety-critical BCM subsystems. IC Role / Device Role / Timing Role: High-side or low-side switch for PWM-dimmed incandescent/LED loads up to 8 A peak. Use Value: 32 A pulsed drain current rating and 24 ns diode trr suppress voltage spikes during inductive load turn-off, eliminating need for external snubbers. | Use Scenario: Constant-current LED string driver in architectural lighting with analog/PWM dimming. IC Role / Device Role / Timing Role: Low-side current-sense switch in linear or hysteretic LED current regulation topology. Use Value: 0.012 Ω RDS(on) enables <10 mV sense voltage at 0.8 A, reducing sense resistor power loss and thermal drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon BSC014N04LS | 40 V VDS, 1.4 mΩ RDS(on) @ 10 V, PowerPAK® 3.3×3.3 | Higher voltage rating but larger gate charge (14.5 nC); less suitable for 3.3 V drive | Prefer when 40 V system margin or lower RDS(on) is critical; verify gate drive strength |
| ON Semiconductor NTMFS4C02N | 30 V VDS, 1.7 mΩ RDS(on) @ 10 V, SO-8 package | SO-8 footprint increases board area and thermal resistance (Rthj-pcb ≈ 75 °C/W) | Select only if legacy SO-8 compatibility required; expect 25 % lower power density and higher junction temperature |
Compared with BSC014N04LS and NTMFS4C02N, STL8NH3LL offers optimal balance of 30 V rating, ultra-low Qg, and chip-scale thermal performance-making it preferred for compact, high-frequency, logic-level-driven power stages where board area and driver efficiency are constrained.
Availability
STL8NH3LL is available at Aetrix Electronics and suitable for DC-DC converters, USB-C load switches, automotive body control modules, and smart LED drivers requiring stable component supply and long-term design-in support.
Supply support for STL8NH3LL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, microcontrollers, sensors, and analog solutions across industrial, automotive, and consumer markets.
The STL8NH3LL belongs to ST's STripFET™ Power MOSFET product line, engineered specifically for high-efficiency, high-density power conversion in space- and thermally-constrained applications such as portable electronics and distributed power systems.
FAQ
Is STL8NH3LL suitable for 3.3 V gate drive?
Yes. With a gate threshold voltage range of 1–2.5 V and RDS(on) = 0.0135 Ω at VGS = 4.5 V, STL8NH3LL achieves full enhancement using standard 3.3 V logic outputs. However, for lowest RDS(on), 4.5–10 V drive is recommended to ensure robust conduction under temperature variation.
What is the recommended PCB footprint for STL8NH3LL?
The official recommended footprint is provided in Figure 21 of Doc ID 10681 Rev 8: a 2.50–2.75 mm wide central thermal pad flanked by three 0.30–0.50 mm length solder terminals per side. Minimum solder mask opening must expose full thermal pad; stencil aperture should be 80–90 % open area to prevent voiding.
Does STL8NH3LL have avalanche ruggedness rating?
No. The datasheet does not specify unclamped inductive switching (UIS) energy rating or single-pulse avalanche capability. Designers must implement external clamping or snubbing circuits when driving inductive loads to avoid junction failure under overvoltage conditions.
Is STL8NH3LL still in active production?
No. Per STMicroelectronics' official documentation and distributor status, STL8NH3LL is marked "Obsolete Product(s)" in all revisions of its datasheet (latest Rev 8, Sep 2009). Aetrix Electronics maintains limited legacy stock for design continuity and repair; no new manufacturing commitments exist.
STL8NH3LL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STripFET™
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 15mOhm @ 4A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12 nC @ 4.5 V
- Vgs (Max):
- ±18V
- Input Capacitance (Ciss) (Max) @ Vds:
- 965 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta), 50W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerFlat™ (3.3x3.3)
STL8NH3LL FAQ
1.How can I place an order for STL8NH3LL through Aetrix?
Please submit a Request for Quotation (RFQ) for STL8NH3LL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STL8NH3LL reliable?
The price and inventory of STL8NH3LL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STL8NH3LL is usually 5 days.
3.What payment methods are accepted for STL8NH3LL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STL8NH3LL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STL8NH3LL?
STL8NH3LL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STL8NH3LL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STL8NH3LL?
For technical support, including STL8NH3LL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STL8NH3LL requirements.
6.How does Aetrix verify that STL8NH3LL is sourced from the original manufacturer or authorized distributors?
All STL8NH3LL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STL8NH3LL meets industry standards.
7.What is the process for return or replacement of STL8NH3LL?
All STL8NH3LL units undergo pre-shipment inspection (PSI). If there is an issue with STL8NH3LL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STL8NH3LL part is unused and in its original packaging.
Return procedure for STL8NH3LL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STL8NH3LL Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
