STMicroelectronics STP13NK50Z
- Part No.:
- STP13NK50Z
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
STP13NK50Z.pdf
- Description:
- MOSFET N-CH 500V 11A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:5,931
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STP13NK50Z from STMicroelectronics is a Zener-protected N-channel SuperMESH Power MOSFET rated for 500 V drain-source voltage, 400 mΩ typical RDS(on), and 11 A continuous drain current at TC = 25 °C. It features 100% avalanche testing, 4.5 V/ns peak diode recovery dv/dt capability, and gate charge minimized to 47 nC - deployed in high-reliability AC-DC power supplies and industrial motor drives.
For engineers reviewing the STP13NK50Z datasheet, STP13NK50Z pinout, STP13NK50Z application, or STP13NK50Z equivalent, key selection criteria include verified avalanche energy (240 mJ), Zener-protected gate structure, TO-220FP thermal resistance (RthJC = 4.17 °C/W), and unclamped inductive switching performance under 400 V bus conditions.
Technical Context
This device implements ST's SuperMESH process - an evolution of PowerMESH - delivering reduced on-resistance while preserving high dv/dt immunity (4.5 V/ns) and robust unclamped inductive switching behavior. Its Zener-protected gate ensures ±30 V VGS tolerance and 2.5 kV HBM ESD rating.
The integrated body diode supports source-drain currents up to 11 A (continuous) and 44 A (pulsed), with reverse recovery time (trr) of 380 ns at 6.5 A/100 A/µs and Qrr = 3.4 µC - critical for hard-switched PFC and flyback snubberless topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 500 V - supports 400 V DC bus designs with 25% margin for transient overvoltage |
| RDS(on) max | 480 mΩ - limits conduction loss to ≤0.34 W at 11 A, enabling TO-220FP thermal operation without forced cooling |
| ID cont @ TC=25°C | 11 A - defines maximum steady-state load current before thermal derating begins |
| EAS | 240 mJ - enables single-pulse unclamped inductive switching at full rated current without failure |
| Qg | 47 nC - determines gate driver power requirement and switching speed trade-off in 100 kHz–500 kHz converters |
| trr | 380 ns - constrains minimum dead-time in half-bridge configurations to prevent shoot-through |
| RthJC | 4.17 °C/W - allows junction temperature rise of ≤125 °C with 30 W dissipation and 25 °C case temperature |
Pinout & Package
Supplied in TO-220FP (Type B) package: isolated tab, vertical mounting, 3-pin through-hole configuration with integral heat sink interface. Thermal pad electrically connected to drain.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Pin 1) | Gate | Control terminal; requires ≤±30 V drive; Zener-clamped to protect against transients |
| D (Pin 2) | Drain | High-voltage power input; electrically tied to metal tab for thermal conduction and isolation |
| S (Pin 3) | Source | Power return path; referenced to driver ground; carries full load current and diode reverse recovery charge |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees single-pulse EAS = 240 mJ at TJ = 25 °C - eliminates screening failures in surge-prone mains-input stages |
| Zener-protected gate | Integrated gate-source Zener clamps VGS to ±30 V - prevents oxide rupture during layout-induced ringing or hot-swap events |
| Extremely high dv/dt capability | 4.5 V/ns rated slope - sustains fast voltage transitions across drain-source without false turn-on in high-noise industrial environments |
| Minimized gate charge | Qg = 47 nC - reduces driver losses and enables efficient operation in 300–500 kHz SMPS designs |
| SuperMESH technology | Optimized cell layout lowers RDS(on) by ~15% vs prior PowerMESH - improves efficiency in 100–500 W offline converters |
Applications
| AC-DC Power Supplies | Industrial Motor Drives |
|---|---|
Use Scenario: Primary-side switch in 300–500 W universal-input offline flyback or forward converters. IC Role / Device Role / Timing Role: High-voltage power switch handling 400 V DC bus, operating at 65–130 kHz with ZVS-assisted turn-on. Use Value: 240 mJ avalanche energy absorbs leakage inductance spikes without snubber, reducing component count and board area. | Use Scenario: Half-bridge high-side switch in 3-phase inverter stages for HVAC blowers and pump controllers. IC Role / Device Role / Timing Role: Fast-switching N-channel MOSFET driving inductive loads with 4.5 V/ns dv/dt immunity to prevent parasitic turn-on. Use Value: 380 ns trr and 3.4 µC Qrr enable tight dead-time control, minimizing conduction loss while avoiding shoot-through. |
| LED Street Lighting Drivers | Uninterruptible Power Supplies (UPS) |
Use Scenario: Switching element in high-efficiency, thermally constrained constant-current LED drivers for outdoor luminaires. IC Role / Device Role / Timing Role: Primary switch in resonant LLC topology operating at 200–350 kHz with zero-voltage switching. Use Value: 400 mΩ RDS(on) typ. maintains <0.5 W conduction loss at 11 A, allowing natural convection cooling in sealed enclosures. | Use Scenario: Battery-charging FET and inverter-stage switch in line-interactive UPS systems with bidirectional power flow. IC Role / Device Role / Timing Role: Bidirectional switching device supporting both AC-to-DC charging and DC-to-AC inversion paths. Use Value: 100% avalanche-tested ruggedness ensures reliability during grid fault transitions and battery overvoltage events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STF13NK50Z | TO-220FP package with insulated tab; RDS(on) max = 480 mΩ; Qg = 47 nC | Designed for PCB-mounted heatsinking with electrical isolation required | Select when creepage/clearance constraints mandate isolated drain connection to heatsink |
| STW13NK50Z | TO-247 package; same RDS(on) and Qg; higher PTOT (45 W); no built-in Zener protection | Higher power density; requires external gate protection circuitry | Choose for >500 W designs needing lower RthJC (0.83 °C/W) and higher pulse current capability |
Compared with STF13NK50Z and STW13NK50Z, STP13NK50Z shares identical die but is obsolete per DS5422 Rev 3 - STF13NK50Z is the active, drop-in replacement with identical specs and TO-220FP insulation; STW13NK50Z offers superior thermal performance but requires redesign for gate protection and mechanical mounting.
Availability
STP13NK50Z is available at Aetrix Electronics and suitable for AC-DC power supplies, industrial motor drives, and LED street lighting drivers requiring stable component supply and long-term lifecycle support.
Supply support for STP13NK50Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The SuperMESH Power MOSFET product line targets high-efficiency, high-reliability switching applications in offline power conversion - emphasizing avalanche ruggedness, low gate charge, and thermal robustness in cost-sensitive industrial power systems.
FAQ
Is STP13NK50Z still in active production?
No - STP13NK50Z was formally discontinued in DS5422 Rev 3 (February 2026). STF13NK50Z is the direct, functionally identical replacement in the same TO-220FP package, with identical electrical specs, pinout, and thermal characteristics. Inventory of STP13NK50Z is limited to remaining distributor stock.
What is the significance of "100% avalanche tested" for this MOSFET?
Each STP13NK50Z unit undergoes individual unclamped inductive switching validation at EAS = 240 mJ, ensuring guaranteed single-pulse ruggedness. This eliminates statistical failure risk in surge-prone applications like mains-connected PFC stages, where transient energy absorption must be deterministic rather than probabilistic.
Can STP13NK50Z be used in place of STF13NK50Z without design changes?
Yes - STP13NK50Z and STF13NK50Z share identical die, electrical parameters, pinout, and TO-220FP mechanical form factor. The only difference is marking and packaging (tube vs. tape-and-reel); no schematic, layout, or thermal design modifications are needed for substitution in existing designs.
Why does the datasheet specify both RDS(on) typ. (400 mΩ) and max (480 mΩ)?
The 400 mΩ typical value reflects median production performance under VGS = 10 V and ID = 6.5 A; the 480 mΩ maximum guarantees worst-case conduction loss across temperature, process variation, and lifetime. Designers must use the max value for thermal and efficiency calculations to ensure margin at end-of-life and high ambient conditions.
STP13NK50Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- SuperMESH™
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 11A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 480mOhm @ 6.5A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 100µA
- Gate Charge (Qg) (Max) @ Vgs:
- 47 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1600 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 140W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
STP13NK50Z FAQ
1.How can I place an order for STP13NK50Z through Aetrix?
Please submit a Request for Quotation (RFQ) for STP13NK50Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STP13NK50Z reliable?
The price and inventory of STP13NK50Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STP13NK50Z is usually 5 days.
3.What payment methods are accepted for STP13NK50Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STP13NK50Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STP13NK50Z?
STP13NK50Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STP13NK50Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STP13NK50Z?
For technical support, including STP13NK50Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STP13NK50Z requirements.
6.How does Aetrix verify that STP13NK50Z is sourced from the original manufacturer or authorized distributors?
All STP13NK50Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STP13NK50Z meets industry standards.
7.What is the process for return or replacement of STP13NK50Z?
All STP13NK50Z units undergo pre-shipment inspection (PSI). If there is an issue with STP13NK50Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STP13NK50Z part is unused and in its original packaging.
Return procedure for STP13NK50Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STP13NK50Z Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
