STMicroelectronics STP27N60M2-EP
- Part No.:
- STP27N60M2-EP
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
STP27N60M2-EP.pdf
- Description:
- MOSFET N-CH 600V 20A TO220
- Quantity:
- Payment:

- Shipping:

Inventory:4,312
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Product details
Overview
STW27N60M2-EP from STMicroelectronics is an N-channel 600 V, 150 mΩ typ. (163 mΩ max.), 20 A Power MOSFET using MDmesh M2 Enhanced Performance technology in TO-247 package. It delivers extremely low gate charge (33 nC), optimized COSS profile (70 pF), and very low turn-off switching losses-enabling efficient operation in high-frequency resonant and hard-switched converters above 150 kHz, such as LLC and PFC stages.
For engineers reviewing the STW27N60M2-EP datasheet, STW27N60M2-EP pinout, STW27N60M2-EP application, or STW27N60M2-EP equivalent, key selection criteria include its 50 V/ns dv/dt ruggedness, 100% avalanche-tested reliability, Zener-protected gate, and thermal resistance of 0.74 °C/W (junction-to-case) for high-power-density SMPS designs.
Technical Context
This MOSFET employs a strip layout and enhanced vertical structure to simultaneously reduce RDS(on) and output capacitance nonlinearity, enabling fast, low-loss switching with minimal voltage overshoot during hard commutation. Its Coss eq. of 146 pF (0–480 V) and low Crss (1 pF) support clean zero-voltage switching transitions in high-frequency topologies.
The device integrates a robust body diode with trr = 271 ns (TJ = 25 °C) and Qrr = 3.44 µC, rated for 20 A continuous source-drain current and 80 A pulsed, while maintaining 15 V/ns diode recovery dv/dt capability under defined test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Supports primary-side switching in universal-input offline SMPS up to 400 V DC bus with margin. |
| RDS(on) max. | 163 mΩ at VGS = 10 V, ID = 10 A - Enables <1.6 W conduction loss at 20 A, critical for thermally constrained PFC stages. |
| Qg | 33 nC - Reduces gate drive power and enables use of smaller, lower-cost gate drivers in >150 kHz designs. |
| Coss | 70 pF at VDS = 100 V - Low stored energy (EOSS ≈ 2.5 µJ at 400 V) minimizes turn-on loss in ZVS circuits. |
| dv/dt ruggedness | 50 V/ns - Ensures reliable operation without spurious turn-on in noisy high-dV/dt environments like motor drives. |
| TJ max. | 150 °C - Allows full 20 A rating at TC = 25 °C and derated 13 A at TC = 100 °C for sustained industrial operation. |
| EAS | 260 mJ - Withstands single-pulse inductive energy events without failure, supporting unclamped inductive load robustness. |
Pinout & Package
TO-247 package: isolated tab (Drain), 3-pin through-hole mounting with standard footprint. Thermal path optimized via metal tab soldered to heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; accepts 0–10 V logic-level drive; Zener-protected to ±25 V for ESD immunity. |
| 2 (D, Tab) | Drain | Main high-side power terminal; electrically connected to metal tab for low-inductance, high-current path and thermal conduction. |
| 3 (S) | Source | Power return and reference node; used for current sensing and gate drive referencing in high-side configurations. |
Key Features
| Feature | Design Value |
|---|---|
| Extremely low gate charge | 33 nC total gate charge reduces driver power dissipation and enables faster switching with lower EMI. |
| Optimized COSS profile | Coss = 70 pF (100 V) and Coss eq. = 146 pF (0–480 V) ensures predictable turn-on loss and stable ZVS behavior. |
| Very low turn-off switching losses | td(off) = 55.6 ns and tf = 6.3 ns minimize energy loss during high-frequency hard switching. |
| 100% avalanche tested | Rated for 3.6 A repetitive avalanche current and 260 mJ single-pulse energy-guarantees ruggedness in overvoltage transients. |
| Zener-protected gate | Integrated gate oxide protection withstands ±25 V transient stress, eliminating need for external clamping in most layouts. |
Applications
| Server PSU Primary Switch | Industrial PFC Stage |
|---|---|
Use Scenario: High-efficiency 3.3 kW server power supply operating at 200–300 kHz with interleaved totem-pole PFC. IC Role / Device Role / Timing Role: Main switching device in active clamp or dual-phase totem-pole configuration; handles 20 A RMS input current at 400 V DC bus. Use Value: Low Qg and Coss enable >98.5% efficiency at full load; 0.74 °C/W RthJC supports compact heatsinking without forced air. |
Use Scenario: 1.5 kW industrial AC-DC front-end with wide input range (85–265 VAC) and high line regulation. IC Role / Device Role / Timing Role: Boost switch in continuous conduction mode (CCM) PFC; operates at 150–250 kHz with 13 A peak current. Use Value: Avalanche-rated design tolerates mains surges; 50 V/ns dv/dt ruggedness prevents false triggering during line dips and transients. |
| EV Onboard Charger (OBC) DC-DC | High-Frequency Induction Heater |
Use Scenario: 6.6 kW bidirectional OBC DC-DC stage using phase-shifted full-bridge topology. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier or primary-side bridge switch; switches at 250 kHz with soft-commutation. Use Value: Low trr (271 ns) and Qrr (3.44 µC) minimize body-diode conduction loss during dead-time; Zener gate ensures reliability across automotive temperature range. |
Use Scenario: 5 kW resonant inverter driving induction coils at 200–500 kHz for precision metal heating. IC Role / Device Role / Timing Role: Half-bridge switching element; subjected to high di/dt (>200 A/µs) and repetitive unclamped inductive stress. Use Value: 100% avalanche testing and 260 mJ EAS rating ensure survival under coil detuning or load mismatch events without snubber redesign. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage, high-frequency MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW34N60M2 | 600 V, 125 mΩ max., 27 A ID - lower RDS(on) but higher Qg (42 nC) and Coss (95 pF). | Better conduction loss at high current; less suitable for >200 kHz due to higher switching loss. | Select when thermal headroom is limited and switching frequency ≤150 kHz. |
| IPW60R099P7 | 600 V, 99 mΩ max., 34 A ID - Infineon CoolMOS™ P7; lower RDS(on) but no integrated Zener gate protection. | Higher peak current capability; requires external gate clamping and careful PCB layout for ESD robustness. | Select when maximum efficiency at 100–150 kHz is prioritized and gate drive design includes discrete protection. |
Compared with STW34N60M2 and IPW60R099P7, the STW27N60M2-EP offers the best balance of low Qg, proven avalanche ruggedness, and integrated gate protection-making it optimal for compact, high-reliability >150 kHz converters where layout simplicity and transient immunity are critical.
Availability
STW27N60M2-EP is available at Aetrix Electronics and suitable for server power supplies, industrial PFC modules, and EV onboard charger DC-DC stages requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for STW27N60M2-EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The MDmesh M2 EP series targets high-efficiency, high-frequency power conversion-specifically engineered for resonant topologies, totem-pole PFC, and compact SMPS where low switching loss and ruggedness outweigh raw conduction performance.
FAQ
Is STW27N60M2-EP pin-compatible with earlier STP27N60M2?
No. STW27N60M2-EP replaces STP27N60M2 and is not pin-compatible-the STP variant was discontinued per DS11415 Rev 2 (April 2026), and STW27N60M2-EP features updated internal structure, tighter RDS(on) distribution, and enhanced avalanche testing. Board redesign is required for migration.
What is the maximum recommended gate resistor for 200 kHz operation?
A gate resistor of 4.7 Ω is validated per datasheet Figure 18 for 200 kHz switching with VDD = 300 V and ID = 10 A. Lower values (≤2.2 Ω) may be used with active gate drivers to reduce td(off) further, but require careful layout to avoid ringing due to low Crss (1 pF) and high dv/dt sensitivity.
Does the body diode support synchronous rectification in LLC converters?
Yes-the body diode has trr = 271 ns (TJ = 25 °C) and Qrr = 3.44 µC, enabling use in quasi-resonant LLC secondary-side rectification at up to 300 kHz. However, for optimal efficiency above 250 kHz, external SiC Schottky catch diodes are recommended to eliminate reverse recovery loss entirely.
Can STW27N60M2-EP operate reliably at TJ = 150 °C continuously?
Yes-its absolute maximum junction temperature is 150 °C, and SOA curves (Figure 1) confirm safe operation at 13 A continuous current with TC = 100 °C. Sustained 150 °C operation requires thermal design ensuring RthJC ≤ 0.74 °C/W and adequate heatsink interface resistance.
STP27N60M2-EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ M2-EP
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 20A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 163mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 4.75V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 33 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1320 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 170W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
STP27N60M2-EP FAQ
1.How can I place an order for STP27N60M2-EP through Aetrix?
Please submit a Request for Quotation (RFQ) for STP27N60M2-EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STP27N60M2-EP reliable?
The price and inventory of STP27N60M2-EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STP27N60M2-EP is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STP27N60M2-EP?
For technical support, including STP27N60M2-EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STP27N60M2-EP requirements.
6.How does Aetrix verify that STP27N60M2-EP is sourced from the original manufacturer or authorized distributors?
All STP27N60M2-EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STP27N60M2-EP meets industry standards.
7.What is the process for return or replacement of STP27N60M2-EP?
All STP27N60M2-EP units undergo pre-shipment inspection (PSI). If there is an issue with STP27N60M2-EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STP27N60M2-EP part is unused and in its original packaging.
Return procedure for STP27N60M2-EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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