STMicroelectronics STP32N65M5
- Part No.:
- STP32N65M5
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
STP32N65M5.pdf
- Description:
- MOSFET N-CH 650V 24A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:300
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STP32N65M5 from STMicroelectronics is an N-channel 650 V, 24 A Power MOSFET in D²PAK (TO-263) package, featuring 95 mΩ typ. RDS(on), 72 nC total gate charge, and 150 W power dissipation at TC = 25 °C. It employs MDmesh M5 vertical process technology for high-efficiency switching in high-voltage DC-DC converters and industrial motor drives.
For engineers reviewing the STP32N65M5 datasheet, STP32N65M5 pinout, STP32N65M5 application, or STP32N65M5 equivalent, key selection criteria include avalanche ruggedness (650 mJ EAS), fast switching (53 ns td(off), 16 ns tf), low Coss (75 pF), and integrated source-drain diode with 375 ns trr at 25 °C.
Technical Context
This MOSFET uses ST's MDmesh M5 process to achieve ultra-low RDS(on) while maintaining 650 V breakdown voltage and robust unclamped inductive switching capability. Its gate threshold voltage (3–5 V) ensures compatibility with standard 10 V gate drivers, and its low Qgd/Qgs ratio (29/17 nC) supports clean turn-off in hard-switched topologies.
The device integrates a fast-recovery body diode with 375 ns reverse recovery time and 6 µC Qrr at 25 °C, enabling reduced switching losses in flyback and LLC resonant converters. Thermal resistance RthJC is 0.83 °C/W, allowing high-power operation with minimal heatsink requirements when mounted on PCB copper planes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 650 V - Withstands 650 V drain-source blocking voltage, suitable for 400 V AC-input PFC and 380 V DC bus applications. |
| RDS(on) max | 119 mΩ - Confirmed maximum on-resistance at VGS = 10 V, ID = 12 A, ensuring <1.7 W conduction loss at 24 A. |
| Qg | 72 nC - Total gate charge enables efficient drive with standard gate drivers; reduces driver power loss and layout complexity. |
| EAS | 650 mJ - Single-pulse avalanche energy rating confirms ruggedness under transient overvoltage conditions without external snubbers. |
| tr/tf | 12 ns / 16 ns - Fast rise/fall times minimize switching transition losses in high-frequency SMPS designs up to 100 kHz. |
| Coss | 75 pF - Low output capacitance reduces turn-on loss in zero-voltage switching (ZVS) circuits and improves efficiency in resonant topologies. |
| ID (TC = 100 °C) | 15 A - Continuous current derating at elevated case temperature ensures reliable operation in enclosed industrial enclosures. |
Pinout & Package
D²PAK (TO-263) package with exposed drain tab for thermal and electrical connection; 3-pin surface-mount outline (A2 variant); recommended footprint per Figure 21 in DS6032 Rev 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal requiring ≤±25 V gate-source voltage; low input capacitance (3320 pF Ciss) eases drive design. |
| 2 (D / TAB) | Drain / Exposed Pad | Main high-side power path; electrically and thermally connected to large copper area for heat dissipation and low-inductance layout. |
| 3 (S) | Source | Reference node for gate drive and current sensing; ties to power ground plane; supports Kelvin source configuration for precision RDS(on) monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| MDmesh M5 process technology | Enables 650 V rating with 95 mΩ typ. RDS(on), reducing conduction loss by ~25% vs. prior-generation 650 V MOSFETs. |
| 100% avalanche tested | Guarantees single-pulse ruggedness to 650 mJ EAS, eliminating need for overvoltage clamping in inductive load switching. |
| Low Qgd/Qg ratio (0.4) | Improves Miller immunity and enables stable operation with high dv/dt (15 V/ns rated) in half-bridge configurations. |
| Fast body diode (trr = 375 ns) | Reduces reverse recovery loss and EMI in discontinuous conduction mode (DCM) flyback and synchronous rectification. |
| ECOPACK® compliant | Meets RoHS and halogen-free requirements; qualified for industrial temperature range (−55 to +150 °C junction). |
Applications
| Industrial Motor Drives | Server & Telecom PSU |
|---|---|
|
Use Scenario: Three-phase inverter stage in 1–3 kW variable frequency drives for HVAC compressors and pumps. IC Role / Device Role / Timing Role: High-side N-channel switch in IGBT/MOSFET half-bridge modules, operating at 8–20 kHz PWM frequency. Use Value: Low RDS(on) and high avalanche energy reduce heatsink size and eliminate snubber networks, lowering BOM cost and improving MTBF. |
Use Scenario: Primary-side switch in 1–2 kW active-clamp forward or LLC resonant DC-DC converters for 48 V server racks. IC Role / Device Role / Timing Role: Main power switch handling 380 V DC input, synchronized with ZVS control to minimize switching loss. Use Value: Low Coss and fast tf enable efficient ZVS operation up to 300 kHz, increasing power density by >15% vs. legacy 650 V MOSFETs. |
| Photovoltaic Inverters | EV Onboard Chargers |
|
Use Scenario: DC-DC boost stage in string inverters converting 600–1000 V PV array output to 400 V DC link. IC Role / Device Role / Timing Role: High-voltage switch in interleaved boost converter, operating with 100 kHz switching and high duty-cycle transients. Use Value: Stable V(BR)DSS across temperature and low gate charge ensure consistent regulation during irradiance fluctuations and partial shading events. |
Use Scenario: Isolated DC-DC stage in 6.6 kW bidirectional OBC converting 400 V battery to 400 V AC grid or vice versa. IC Role / Device Role / Timing Role: Primary-side switch in dual-active-bridge topology, subjected to repetitive unclamped inductive stress during phase-shift control. Use Value: 100% avalanche-tested ruggedness and 150 °C max junction temperature support continuous 24/7 operation under automotive thermal cycling profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW32N65M5 | Same die, TO-247 package; higher RthJC (0.45 °C/W) but superior heatsinking via screw mount; no exposed drain tab. | Better suited for forced-air-cooled industrial UPS where mechanical mounting and thermal mass dominate. | Select when direct heatsink attachment and higher peak power (>200 W) are required; not drop-in for SMT layouts. |
| IPP65R099C7 | Infineon CoolMOS™ C7; 650 V, 99 mΩ typ., 71 nC Qg; lower Coss (55 pF) but no guaranteed avalanche rating. | Preferred in high-frequency (>200 kHz) digital PSUs where ZVS optimization outweighs transient ruggedness needs. | Choose only if system-level testing confirms adequate overvoltage margin; requires additional snubber design effort. |
Compared with STW32N65M5 and IPP65R099C7, STP32N65M5 offers optimal balance of SMT manufacturability, guaranteed avalanche ruggedness, and thermal performance in compact 1–3 kW industrial converters-making it the default choice where reliability and assembly scalability are prioritized over extreme frequency or peak power.
Availability
STP32N65M5 is available at Aetrix Electronics and suitable for industrial motor drives, photovoltaic inverters, and telecom power supplies requiring stable component supply, long-lifecycle support, and full traceability from wafer to shipment.
Supply support for STP32N65M5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
STP32N65M5 belongs to the MDmesh™ M5 high-voltage Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in 650 V industrial and renewable energy systems.
FAQ
What is the maximum safe operating temperature for STP32N65M5?
The absolute maximum junction temperature is 150 °C, with continuous operation supported from −55 °C to 150 °C. Derating begins at TC > 25 °C per the RthJC = 0.83 °C/W spec; at TC = 100 °C, continuous drain current drops to 15 A. Thermal design must ensure junction temperature remains below 150 °C under worst-case load and ambient conditions.
Does STP32N65M5 require a gate resistor for stability?
Yes-a gate resistor (typically 4.7 Ω to 22 Ω) is required to dampen ringing caused by PCB trace inductance interacting with Ciss and Crss. The datasheet specifies switching times using RG = 4.7 Ω; increasing RG slows switching but improves EMI and reduces overshoot, while decreasing it risks shoot-through in bridge configurations.
Can STP32N65M5 replace STP24NM60ND in existing designs?
No-STP24NM60ND is a 600 V, 24 A device with different RDS(on) (140 mΩ), gate charge (65 nC), and avalanche rating (EAS = 420 mJ). While pin-compatible in D²PAK, STP32N65M5's higher VDS, lower RDS(on), and improved ruggedness require verification of gate drive strength, layout parasitics, and thermal margin before substitution.
Is the body diode suitable for synchronous rectification?
No-the integrated source-drain diode has 375 ns trr and 6 µC Qrr at 25 °C, making it unsuitable for high-frequency synchronous rectification. It is optimized for freewheeling in hard-switched topologies; for SR applications, a discrete Schottky or GaN FET should be used in parallel or instead.
STP32N65M5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ V
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 24A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 119mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 72 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3320 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 150W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
STP32N65M5 FAQ
1.How can I place an order for STP32N65M5 through Aetrix?
Please submit a Request for Quotation (RFQ) for STP32N65M5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STP32N65M5 reliable?
The price and inventory of STP32N65M5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STP32N65M5 is usually 5 days.
3.What payment methods are accepted for STP32N65M5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STP32N65M5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STP32N65M5?
STP32N65M5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STP32N65M5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STP32N65M5?
For technical support, including STP32N65M5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STP32N65M5 requirements.
6.How does Aetrix verify that STP32N65M5 is sourced from the original manufacturer or authorized distributors?
All STP32N65M5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STP32N65M5 meets industry standards.
7.What is the process for return or replacement of STP32N65M5?
All STP32N65M5 units undergo pre-shipment inspection (PSI). If there is an issue with STP32N65M5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STP32N65M5 part is unused and in its original packaging.
Return procedure for STP32N65M5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STP32N65M5 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
